IDT71V3548S133PFI

256K x 18 3.3V Synchronous ZBT SRAM 3.3V I/O, Burst Counter Pipelined Outputs x x IDT71V3548S IDT71V3548SA Features 256K x 18 memory configurations Supports high performance system speed - 133 MHz (4.2 ns Clock-to-Data Access) ZBTTM Feature - No dead cycles between write and read cycles Internally synchronized output buffer enable eliminates the need to control OE Single R/W (READ/WRITE) control pin Positive clock-edge triggered address, data, and control signal registers for fully pipelined applications 4-word burst capability (interleaved or linear) Individual byte write (BW1 - BW4) control (May tie active) Three chip enables for simple depth expansion 3.3V power supply (±5%), 3.3V I/O Supply (VDDQ) Optional Boundary Scan JTAG Interface (IEEE 1149.1 compliant) Packaged in a JEDEC standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA) x x x x x x x x x x Description The IDT71V3548 are 3.3V high-speed 4,718,592-bit (4.5 Megabit) synchronous SRAMS. They are designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, they have been given the name ZBTTM, or Zero Bus Turnaround. Address and control signals are applied to the SRAM during one clock cycle, and two cycles later the associated data cycle occurs, be it read or write. The IDT71V3548 contain data I/O, address and control signal registers. Output enable is the only asynchronous signal and can be used to disable the outputs at any given time. A Clock Enable (CEN) pin allows operation of the IDT71V3548 to be suspended as long as necessary. All synchronous inputs are ignored when (CEN) is high and the internal device registers will hold their previous values. There are three chip enable pins (CE1, CE2, CE2) that allow the user to deselect the device when desired. If any one of these three are not asserted when ADV/LD is low, no new memory operation can be initiated. However, any pending data transfers (reads or writes) will be completed. The data bus will tri-state two cycles after chip is deselected or a write is initiated. The IDT71V3548 has an on-chip burst counter. In the burst mode, the IDT71V3548 can provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by the LBO input pin. The LBO pin selects between linear and interleaved burst sequence. The ADV/LD signal is used to load a new external address (ADV/LD = LOW) or increment the internal burst counter (ADV/LD = HIGH). The IDT71V3548 SRAMs utilize IDT's latest high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100- pin plastic thin quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA). Input Input Input Input Input Input Input Input Input Input Input Input Output Input Input I/O Supply Supply Synchronous Synchronous Asynchronous Synchronous Synchronous Synchronous N/A Synchronous Static Synchronous Synchronous N/A Synchronous Asynchronous Synchronous Synchronous Static Static 5296 tbl 01 Pin Description Summary A0-A17 CE1, CE2, C E2 OE R/ W CEN BW1, BW2, BW3, BW4 CLK ADV/ LD LBO TMS TDI TCK TDO TRST ZZ I/O0-I/O15, I/OP1-I/OP2 VDD, VDDQ VSS Address Inputs Chip Enables Output Enable Read/Write Signal Clock Enable Individual Byte Write Selects Clock Advance burst addre ss / Load new address Linear / Interleaved Burst Order Test Mode Select Test Data Input Test Clock Test Data Output JTAG Reset (Optional) Sleep Mode Data Input / Output Core Power, I/O Power Ground MAY 2002 1 ©2002 Integrated Device Technology, Inc. DSC-5296/03 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Pin Definition(1) Symbol A0-A17 ADV/LD Pin Function Address Inputs Advance / Load I/O I I Active N/A N/A Description Synchronous Address inputs. The address register is triggered by a combination of the rising edge of CLK, ADV/LD low, CEN low, and true chip enables. ADV/ LD is a synchronous input that is used to load the internal registers with new address and control when it is sampled low at the rising edge of clock with the chip selected. When ADV/ LD is low with the chip deselected, any burst in progress is terminated. When ADV/ LD is sampled high then the internal burst counter is advanced for any burst that was in progress. The external addresses are ignored when ADV/ LD is sampled high. R/ W s ignal is a synchronous input that identifies whether the current load cycle initiated is a Read or Write access to the memory array. The data bus activity for the current cycle takes place two clock cycles later. Synchronous Clock Enable Input. When CEN is sampled high, all other synchronous inputs, including clock are ignored and outputs remain unchang ed. The effect of CEN s ampled high on the device outputs is as if the low to high clock transition did not occur. For normal operation, CEN must be sampled low at rising edge of clock. Synchronous byte write enables. Each 9-bit byte has its own active low byte write enable. On load write cycles (When R/W and ADV/LD are samp led low) the appropriate byte write signal (BW1-BW4) must be valid. The byte write signal must also be valid on each cycle of a burst write. Byte Write signals are ignored when R/ W is sampled high. The appropriate byte(s) of data are written into the device two cycles later. BW1-BW4 c an all be tied low if always doing write to the entire 36-bit word. Synchro nous active low chip enable. C E1 and C E2 are used with CE2 to enable the IDT71V3548. (CE1 o r C E2 s ampled high or CE2 s ampled low) and ADV/LD low at the rising edge of clock, initiates a deselect cycle. The ZBTTM has a two cycle deselect, i.e., the data bus will tri-state two clock cycles after deselect is initiated. Synchronous active high chip enable. CE 2 is used with C E1 and C E2 to enable the chip. CE 2 has inverted polarity but otherwise identical to C E1 and C E2. This is the clock input to the IDT71V3548. Except for OE, all timing references for the device are made with respect to the rising edge of CLK. Synchronous data input/output (I/O) pins. Both the data input path and data output path are registered and triggered by the rising edge of CLK. Burst order selection input. When LBO is high the Interleaved burst sequence is selected. When LBO is low the Linear burst sequence is selected. LBO is a static inp ut and it must not change during device operation. Asynchronous output enable. OE must be low to read d ata from the 71V3548. When OE is high the I/O pins are in a high-impedance state. OE d oes not need to be actively controlled for read and write cycles. In normal operation, OE c an be tied low. Gives input command for TAP controller. Sampled on rising edge of TDK. This pin has an internal pullup. Serial input of registers placed between TDI and TDO. Sampled on rising edge of TCK. This pin has an internal pullup. Clo ck input of TAP controller. Each TAP event is clocked. Test inputs are captured on rising edge of TCK, while test outputs are driven from the falling edge of TCK. This pin has an internal pullup. Serial output of registers placed between TDI and TDO. This outp ut is active depending on the state of the TAP controller. Optional Asynchronous JTAG reset. Can be used to reset the TAP controller, but not required. JTAG reset occurs automatically at power up and also resets using TMS and TCK per IEEE 1149.1. If not used TRST c an be left floating. This pin has an internal pullup. Synchronous sleep mode input. ZZ HIGH will gate the CLK internally and power down the IDT71V3548 to its lowest power consumption le vel. Data retention is guaranteed in Sleep Mode. This pin has an internal pulldown 3.3V core power supply. 3.3V I/O Supply. Ground. 5296 tbl 02 R/ W Read / Write I N/A CEN Clock Enable I LOW BW1-BW4 Individual Byte Write Enables I LOW CE1, C E2 Chip Enables I LOW CE2 CLK I/O0-I/O31 I/OP1-I/OP4 LBO Chip Enable Clock Data Input/Output Linear Burst Order I I I/O I HIGH N/A N/A LOW OE Output Enable I LOW TMS TDI Test Mode Select Test Data Input I I N/A N/A TCK Test Clock I N/A TDO Test Data Output JTAG Reset (Optional) O N/A TRST I LOW ZZ VDD VDDQ VSS Sleep Mode Power Supply Power Supply Ground I N/A N/A N/A HIGH N/A N/A N/A NOTE: 1. All synchronous inputs must meet specified setup and hold times with respect to CLK. 6.42 2 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Functional Block Diagram LBO Address A [0:17] CE1, CE2, CE2 R/W CEN ADV/LD BWx D Clk D Q Control D Q 256x18 BIT MEMORY ARRAY Address Input Register DI DO Q Control Logic Mux Sel D Clk Clock Output Register Q OE Gate 5296 drw 01 , TMS TDI TCK TRST (optional) JTAG (SA Version) Data I/O [0:15], I/O P[1:2] TDO Recommended DC Operating Conditions Symbol VDD VDDQ VSS VIH VIH VIL Parameter Core Supply Voltage I/O Supply Voltage Supply Voltage Input High Voltage - Inputs Input High Voltage - I/O Input Low Voltage Min. 3.135 3.135 0 2.0 2.0 -0.3 (1) Recommended Operating Temperature and Supply Voltage Unit V V V V V V 5296 tbl 04 Typ. 3.3 3.3 0 ____ ____ ____ Max. 3.465 3.465 0 VDD +0.3 VDDQ +0.3(2) 0.8 Grade Commercial Industrial Temperature(1) 0°C to +70°C -40°C to +85°C VSS 0V 0V VDD 3.3V±5% 3.3V±5% VDDQ 3.3V±5% 3.3V±5% 5296 tbl 05 NOTES: 1. TA is the "instant on" case temperature. NOTES: 1. VIL (min.) = –1.0V for pulse width less than tCYC/2, once per cycle. 2. VIH (max.) = +6.0V for pulse width less than tCYC/2, once per cycle. 6.42 3 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Pin Configuration - 256K x 18 CE2 NC NC BW2 BW1 CE2 VDD VSS CLK R/W CEN OE ADV/LD NC(2) NC(2) A8 A9 A6 A7 CE1 Absolute Maximum Ratings (1) Symbol VTERM(2) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 Rating Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Commercial Operating Temperature Industrial Operating Temperature Commercial & Industrial Values -0.5 to +4.6 -0.5 to VDD -0.5 to VDD +0.5 -0.5 to VDDQ +0.5 -0 to +70 -40 to +85 -55 to +125 -55 to +125 2.0 50 Unit V V V V o 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 NC NC NC VDDQ VSS NC NC I/O8 I/O9 VSS VDDQ I/O10 I/O11 VDD(1) VDD VDD(1) VSS I/O12 I/O13 VDDQ VSS I/O14 I/O15 I/OP2 NC VSS VDDQ NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 A10 NC NC VDDQ VSS NC I/OP1 I/O7 I/O6 VSS VDDQ I/O5 I/O4 VSS VDD(1) VDD VSS/ZZ(3) I/O3 I/O2 VDDQ VSS I/O1 I/O0 NC NC VSS VDDQ NC NC NC VTERM(3,6) VTERM(4,6) VTERM(5,6) C C C C TA (7) o TBIAS TSTG PT IOUT Temperature Under Bias Storage Temperature Power Dissipation DC Output Current o o , W mA 5296 tbl 06 5296 drw 02 Top View 100 TQFP NOTES: 1. Pins 14, 16 and 66 do not have to be connected directly to VDD as long as the input voltage is ≥ VIH. 2. Pins 83 and 84 are reserved for future 8M and 16M respectively. 3. Pin 64 does not have to be connected directly to VSS as long as the input voltage is ≤ VIL; on the latest die revision this pin supports ZZ (sleep mode). 100 Pin TQFP Capacitance(1) (TA = +25° C, f = 1.0MHz) Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. 5 7 Unit pF pF 5296 tbl 07 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VDD terminals only. 3. VDDQ terminals only. 4. Input terminals only. 5. I/O terminals only. 6. This is a steady-state DC parameter that applies after the power supply has reached its nominal operating value. Power sequencing is not necessary; however, the voltage on any input or I/O pin cannot exceed VDDQ during power supply ramp up. 7. TA is the "instant on" case temperature. LBO A5 A4 A3 A2 A1 A0 NC NC VSS VDD NC NC A11 A12 A13 A14 A15 A16 A17 119 BGA Capacitance(1) (TA = +25° C, f = 1.0MHz) Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. 7 7 Unit pF pF 5296 tbl 07a 165 fBGA Capacitance(1) (TA = +25° C, f = 1.0MHz) Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. TBD TBD Unit pF pF 5296 tbl 07b NOTE: 1. This parameter is guaranteed by device characterization, but not production tested. 6.42 4 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Pin Configuration - 256K x 18, 119 BGA 1 A B C D E F G H J K L M N P R T U VDDQ NC NC I/O8 NC VDDQ NC I/O11 VDDQ NC I/O13 VDDQ I/O15 NC NC NC VDDQ 2 A6 CE2 A7 NC I/O9 NC I/O10 NC VDD I/O12 NC I/O14 NC I/OP2 A5 A10 NC/TMS(3) 3 A4 A3 A2 VSS VSS VSS BW2 VSS VDD(1) VSS VSS VSS VSS VSS LBO A15 NC/TDI(3) 4 NC(2) ADV/LD VDD NC CE1 OE NC(2) R/W VDD CLK NC CEN A1 A0 VDD NC NC/TCK(3) 5 A8 A9 A13 VSS VSS VSS VSS VSS VDD(1) VSS BW1 VSS VSS VSS VDD(1) A14 NC/TDO(3) 6 A16 CE2 A17 I/O7 NC I/O5 NC I/O3 VDD NC I/O1 NC I/O0 NC A12 A11 7 VDDQ NC NC NC I/O6 VDDQ I/O4 NC VDDQ I/O2 NC VDDQ NC I/OP1 NC NC/ZZ(5) , NC/TRST(3,4) VDDQ 5296 drw 13 Top View NOTES: 1. J3, J5, and R5 do not have to be directly connected to VDD as long as the input voltage is ≥ VIH. 2. G4 and A4 are reserved for future 8M and 16M respectively. 3. These pins are NC for the "S" version and the JTAG signal listed for the "SA" version. 4. TRST is offered as an optional JTAG reset if required in the application. If not needed, can be left floating and will internally be pulled to VDD. 5. Pin T7 supports ZZ (sleep mode) on the latest die revision. 6.42 5 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Pin Configuration - 256K x 18, 165 fBGA 1 A B C D E F G H J K L M N P R NC (2) 2 A7 A6 NC I/O8 I/O9 I/O10 I/O11 VDD(1) NC NC NC NC NC NC (2) (2) 3 CE1 CE2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A5 A4 4 BW2 NC VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A2 A3 5 NC BW1 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC/TRST (3,4) (3) (3) 6 CE2 CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0 7 CEN R/W VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD (1) (3) 8 ADV/LD OE VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A11 A12 9 NC NC (2) 10 A8 A9 NC NC NC NC NC NC I/O3 I/O2 I/O1 I/O0 NC A15 A16 11 A10 NC(2) I/OP1 I/O7 I/O6 I/O5 I/O4 NC/ZZ(5) NC NC NC NC NC NC A17 5296 tbl 25 NC NC NC NC NC NC VDD(1) I/O12 I/O13 I/O14 I/O15 I/OP2 NC LBO (2) VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A14 A13 NC/TDI NC/TDO NC/TCK NC NC/TMS (3) NOTES: 1. H1, H2, and N7 do not have to be directly connected to VDD as long as the input voltage is ≥ VIH. 2. A9, B9, B11, A1, R2 and P2 are reserved for future 9M, 18M, 36M, 72M, 144M, and 288M respectively respectively. 3. These pins are NC for the "S" version and the JTAG signal listed for the "SA" version. 4. TRST is offered as an optional JTAG reset if required in the application. If not needed, can be left floating and will internally be pulled to VDD. 5. Pin H11 supports ZZ (sleep mode) on the latest die revision. 6.42 6 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Synchronous Truth Table (1) CEN L L L L L L H R/W L H X X X X X Chip(5) Enable Select Select X X Deselect X X ADV/LD L L H H L H X BWx Valid X Valid X X X X ADDRESS USED External External Internal Internal X X X PREVIOUS CYCLE X X LOAD WRITE / BURST WRITE LOAD READ / BURST READ X DESELECT / NOOP X CURRENT CYCLE LOAD WRITE LOAD READ BURST WRITE (Advance burst counter)(2) BURST READ (Advance burst counter)(2) DESELECT or STOP(3) NOOP SUSPEND(4) I/O (2 cycles later) D(7) Q(7) D(7) Q(7) HiZ HiZ Previous Value 5296 tbl 08 NOTES: 1. L = VIL, H = VIH, X = Don’t Care. 2. When ADV/LD signal is sampled high, the internal burst counter is incremented. The R/ W signal is ignored when the counter is advanced. Therefore the nature of the burst cycle (Read or Write) is determined by the status of the R/W signal when the first address is loaded at the beginning of the burst cycle. 3. Deselect cycle is initiated when either (CE1, or CE2 is sampled high or CE2 is sampled low) and ADV/LD is sampled low at rising edge of clock. The data bus will tri-state two cycles after deselect is initiated. 4. When CEN is sampled high at the rising edge of clock, that clock edge is blocked from propogating through the part. The state of all the internal registers and the I/ Os remains unchanged. 5. To select the chip requires CE1 = L, CE2 = L, CE2 = H on these chip enables. Chip is deselected if any one of the chip enables is false. 6. Device Outputs are ensured to be in High-Z after the first rising edge of clock upon power-up. 7. Q - Data read from the device, D - data written to the device. Partial Truth Table for Writes OPERATION READ WRITE ALL BYTES WRITE BYTE 1 (I/O[0:7], I/OP1) (2) (1) R/W H L L L L BW 1 X L L H H BW 2 X L H L H BW 3(3) X L H H H BW 4(3) X L H H H 5296 tbl 09 WRITE BYTE 2 (I/O[8:15], I/OP2)(2) NO WRITE NOTES: 1. L = VIL, H = VIH, X = Don’t Care. 2. Multiple bytes may be selected during the same cycle. 3. N/A for X18 configuration. 6.42 7 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Interleaved Burst Sequence Table (LBO=VDD) Sequence 1 A1 First Address Second Address Third Address Fourth Address (1) 0 0 1 1 A0 0 1 0 1 Sequence 2 A1 0 0 1 1 A0 1 0 1 0 Sequence 3 A1 1 1 0 0 A0 0 1 0 1 Sequence 4 A1 1 1 0 0 A0 1 0 1 0 5296 tbl 10 NOTE: 1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting. Linear Burst Sequence Table (LBO=VSS) Sequence 1 A1 First Address Second Address Third Address Fourth Address (1) Sequence 2 A1 0 1 1 0 A0 1 0 1 0 Sequence 3 A1 1 1 0 0 A0 0 1 0 1 Sequence 4 A1 1 0 0 1 A0 1 0 1 0 5296 tbl 11 A0 0 1 0 1 0 0 1 1 NOTE: 1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting. Functional Timing Diagram (1) CYCLE CLOCK ADDRESS (A0 - A17) (2) n+29 n+30 n+31 n+32 n+33 n+34 n+35 n+36 n+37 A29 A30 A31 A32 A33 A34 A35 A36 A37 CONTROL (R/W, ADV/LD, BWx) (2) (2) C29 C30 C31 C32 C33 C34 C35 C36 C37 DATA I/O [0:15], I/O P[1:2] D/Q27 D/Q28 D/Q29 D/Q30 D/Q31 D/Q32 D/Q33 D/Q34 D/Q35 5296 drw 03 , NOTES: 1. This assumes CEN, CE1, CE2, CE2 are all true. 2. All Address, Control and Data_In are only required to meet set-up and hold time with respect to the rising edge of clock. Data_Out is valid after a clock-to-data delay from the rising edge of clock. 6.42 8 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Device Operation - Showing Mixed Load, Burst, Deselect and NOOP Cycles (2) Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 n+10 n+11 n+12 n+13 n+14 n+15 n+16 n+17 n+18 n+19 Address A0 X A1 X X A2 X X A3 X A4 X X A5 A6 A7 X A8 X A9 R/W H X H X X H X X L X L X X L H L X H X L ADV/LD L H L L H L H L L H L L H L L L H L H L CE (1) L X L H X L X H L X L H X L L L X L X L CEN L L L L L L L L L L L L L L L L L L L L BWx X X X X X X X X L L L X X L X L L X X L OE X X L L L X X L L X X X X X X X L X X L I/O X X Q0 Q0+1 Q1 Z Z Q2 Q2+1 Z D3 D3+1 D4 Z Z D5 Q6 D7 D7+1 Q8 Comments Load read Burst read Load read Deselect or STOP NOOP Load read Burst read Deselect or STOP Load write Burst write Load write Deselect or STOP NOOP Load write Load read Load write Burst write Load read Burst read Load write 5296 tbl 12 NOTES: 1. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 2. H = High; L = Low; X = Don’t Care; Z = High Impedance. Read Operation (1) Cycle n n+1 n+2 Address A0 X X R/W H X X ADV/LD L X X CE (2) L X X CEN L L X BWx X X X OE X X L I/O X X Q0 Comments Address and Control meet setup Clock Setup Valid Contents of Address A0 Read Out 5296 tbl 13 NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 6.42 9 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Burst Read Operation (1) Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 Address A0 X X X X A1 X X A2 R/W H X X X X H X X H ADV/LD L H H H H L H H L CE (2) L X X X X L X X L CEN L L L L L L L L L BWx X X X X X X X X X OE X X L L L L L L L I/O X X Q0 Q0+1 Q0+2 Q0+3 Q0 Q1 Q1+1 Comments Address and Control meet setup Clock Setup Valid, Advance Counter Address A0 Read Out, Inc. Count Address A0+1 Read Out, Inc. Count Address A0+2 Read Out, Inc. Count Address A0+3 Read Out, Load A1 Address A0 Read Out, Inc. Count Address A1 Read Out, Inc. Count Address A1+1 Read Out, Load A2 5296 tbl 14 NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance.. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. Write Operation (1) Cycle n n+1 n+2 Address A0 X X R/W L X X ADV/LD L X X CE (2) L X X CEN L L L BWx L X X OE X X X I/O X X D0 Comments Address and Control meet setup Clock Setup Valid Write to Address A0 5296 tbl 15 NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. Burst Write Operation Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 Address A0 X X X X A1 X X A2 R/W L X X X X L X X L ADV/LD L H H H H L H H L (1) CE (2) L X X X X L X X L CEN L L L L L L L L L BWx L L L L L L L L L OE X X X X X X X X X I/O X X D0 D0+1 D0+2 D0+3 D0 D1 D1+1 Comments Address and Control meet setup Clock Setup Valid, Inc. Count Address A0 Write, Inc. Count Address A0+1 Write, Inc. Count Address A0+2 Write, Inc. Count Address A0+3 Write, Load A1 Address A0 Write, Inc. Count Address A1 Write, Inc. Count Address A1+1 Write, Load A2 5296 tbl 16 NOTES: 1. H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 6.42 10 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Read Operation with Clock Enable Used (1) Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 Address A0 X A1 X X A2 A3 A4 R/W H X H X X H H H ADV/LD L X L X X L L L CE (2) L X L X X L L L CEN L H L H H L L L BWx X X X X X X X X OE X X X L L L L L I/O X X X Q0 Q0 Q0 Q1 Q2 Comments Address and Control meet setup Clock n+1 Ignored Clock Valid Clock Ignored. Data Q0 is on the bus. Clock Ignored. Data Q0 is on the bus. Address A0 Read out (bus trans.) Address A1 Read out (bus trans.) Address A2 Read out (bus trans.) 5296 tbl 17 NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. Write Operation with Clock Enable Used (1) Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 Address A0 X A1 X X A2 A3 A4 R/W L X L X X L L L ADV/LD L X L X X L L L CE (2) L X L X X L L L CEN L H L H H L L L BWx L X L X X L L L OE X X X X X X X X I/O X X X X X D0 D1 D2 Comments Address and Control meet setup. Clock n+1 Ignored. Clock Valid. Clock Ignored. Clock Ignored. Write Data D0 Write Data D1 Write Data D2 5296 tbl 18 NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 6.42 11 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Read Operation with CHIP Enable Used (1) Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 Address X X A0 X A1 X X A2 X X R/W X X H X H X X H X X ADV/LD L L L L L L L L L L CE (2) H H L H L H H L H H CEN L L L L L L L L L L BWx X X X X X X X X X X OE X X X X L X L X X L I/O(3) ? ? Z Z Q0 Z Q1 Z Z Q2 Comments Deselected. Deselected. Address and Control meet setup Deselected or STOP. Address A0 Read out. Load A 1. Deselected or STOP. Address A1 Read out. Deselected. Address and control meet setup. Deselected or STOP. Address A2 Read out. Deselected. 5296 tbl 19 NOTES: 1. H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 3. Device Outputs are ensured to be in High-Z after the first rising edge of clock upon power-up. Write Operation with Chip Enable Used (1) Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 Address X X A0 X A1 X X A2 X X R/W X X L X L X X L X X ADV/LD L L L L L L L L L L CE (2) H H L H L H H L H H CEN L L L L L L L L L L BWx X X L X L X X L X X OE X X X X X X X X X X I/O(3) ? ? Z Z D0 Z D1 Z Z D2 Comments Deselected. Deselected. Address and Control meet setup Deselected or STOP. Address D0 Write in. Load A 1. Deselected or STOP. Address D1 Write in. Deselected. Address and control meet setup. Deselected or STOP. Address D2 Write in. Deselected. 5296 tbl 20 NOTES: 1. H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 6.42 12 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V +/-5%) Sym bol |IL I| |IL I| |ILO | VOL V OH Param eter Inp ut Le ak ag e Curre nt LBO, JTA G and ZZ Inp ut Le akag e Curre nt(1) O utp ut Le akag e Curre nt O utp ut Lo w Vo ltag e O utp ut Hig h Vo ltag e Test Conditions V DD = M ax., V IN = 0 V to V DD V DD = M ax., V IN = 0 V to V DD V O UT = 0 V to V DDQ , De v ice De se le cte d IO L = + 8m A , V DD = M in. IOH = -8m A , V DD = M in. M in. ___ M ax. 5 30 5 0.4 ___ Unit µA µA µA V V 5296 tb l 2 1 ___ ___ ___ 2.4 NOTE: 1. The LBO, TMS, TDI, TCK and TRST pins will be internally pulled to VDD and ZZ will be internally pulled to VSS if it is not actively driven in the application. DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (1) (VDD = 3.3V +/-5%) 133MHz Symbol IDD Parameter Operating Power Supply Current Test Conditions Device Selected, Outputs Open, ADV/LD = X, VDD = Max., VIN > VIH o r < VIL, f = fMAX(2) Device Deselected, Outputs Open, VDD = Max., VIN > VHD o r < VLD, f = 0(2,3) Device Deselected, Outputs Open, VDD = Max., VIN > VHD o r < VLD, f = fMAX(2.3) Device Selected, Outputs Open, CEN > VIH, VDD = Max., VIN > VHD o r < VLD, f = fMAX(2,3) Com'l 300 Ind 310 100MHz Com'l 250 Ind 255 Unit mA ISB1 CMOS Standby Power Supply Current 40 45 40 45 mA ISB2 Clock Running Power Supply Current 110 120 100 110 mA ISB3 Idle Power Supply Current 40 45 40 45 mA NOTES: 1. All values are maximum guaranteed values. 2. At f = fMAX, inputs are cycling at the maximum frequency of read cycles of 1/tCYC; f=0 means no input lines are changing. 3. For I/Os VHD = VDDQ – 0.2V, VLD = 0.2V. For other inputs VHD = VDD – 0.2V, VLD = 0.2V. 5296 tbl 22 AC Test Loads 6 5 4 ∆tCD 3 (Typical, ns) 2 1 20 30 50 80 100 Capacitance (pF) I/O Z0 = 50Ω VDDQ/2 50Ω AC Test Conditions (VDDQ = 3.3V) 5296 drw 04 , Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Timing Reference Levels AC Test Load 0 to 3V 2ns 1.5V 1.5V See Figure 1 5296 tbl 23 Figure 1. AC Test Load 200 5296 drw 05 , 6.42 13 Figure 2. Lumped Capacitive Load, Typical Derating IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges AC Electrical Characteristics (VDD = 3.3V +/-5%, Commercial and Industrial Temperature Ranges) 133MHz Symbol Parameter Min. Max. 100MHz Min. Max. Unit tCYC tF(1) tCH(2) tCL(2) Clock Cycle Time Clock Frequence Clock High Pulse Width Clock Low Pulse Width 7.5 ____ ____ 10 ____ ____ ns MHz ns ns 133 ____ 100 ____ 2.2 2.2 3.2 3.2 ____ ____ Output Parameters tCD tCDC tCLZ(3,4,5) tCHZ(3,4,5) tOE tOLZ(3,4) tOHZ(3,4) Clock High to Valid Data Clock High to Data Change Clock High to Output Active Clock High to Data High-Z Output Enable Access Time Output Enable Low to Data Active Output Enable High to Data High-Z ____ 4.2 ____ ____ 5 ____ ns ns ns ns ns ns ns 1.5 1.5 1.5 ____ 1.5 1.5 1.5 ____ ____ ____ 3 4.2 ____ 3.3 5 ____ 0 ____ 0 ____ 4.2 5 Set Up Times tSE tSA tSD tSW tSADV tSC tSB Clock Enable Setup Time Address Setup Time Data In Setup Time Read/Write (R/ W) Setup Time Advance/Load (ADV/ LD) Setup Time Chip Enable/Select Setup Time Byte Write Enable (BWx) Setup Time 1.7 1.7 1.7 1.7 1.7 1.7 1.7 ____ ____ 2.0 2.0 2.0 2.0 2.0 2.0 2.0 ____ ____ ns ns ns ns ns ns ns ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ Hold Times tHE tHA tHD tHW tHADV tHC tHB Clock Enable Hold Time Address Hold Time Data In Hold Time Read/Write (R/ W) Hold Time Advance/Load (ADV/ LD) Hold Time Chip Enable/Select Hold Time Byte Write Enable (BWx) Hold Time 0.5 0.5 0.5 0.5 0.5 0.5 0.5 ____ ____ ____ ____ ____ ____ ____ 0.5 0.5 0.5 0.5 0.5 0.5 0.5 ____ ____ ____ ____ ____ ____ ____ ns ns ns ns ns ns ns 5296 tbl 24 NOTES: 1. tF = 1/tCYC. 2. Measured as HIGH above 0.6VDDQ and LOW below 0.4VDDQ. 3. Transition is measured ±200mV from steady-state. 4. These parameters are guaranteed with the AC load (Figure 1) by device characterization. They are not production tested. 5. To avoid bus contention, the output buffers are designed such that tCHZ (device turn-off) is about 1ns faster than tCLZ (device turn-on) at a given temperature and voltage. The specs as shown do not imply bus contention because tCLZ is a Min. parameter that is worse case at totally different test conditions (0 deg. C, 3.465V) than t CHZ, which is a Max. parameter (worse case at 70 deg. C, 3.135V). 6.42 14 tCYC CLK tSE tHE tCH tCL CEN tHADV tSADV ADV/LD tSW tHW R/W tSA tHA A2 tSC tHC ADDRESS A1 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs CE1, CE2 (2) Timing Waveform of Read Cycle (1,2,3,4) 6.42 15 tCLZ tCD Q(A1) Pipeline Read Pipeline Read Q(A2) tCDC Q(A2+1) tCDC tCD (CEN high, eliminates current L-H clock edge) (Burst Wraps around to initial state) BW1 - BW4 OE tCHZ Q(A2+2) Burst Pipeline Read 5296 drw 06 DATAOUT Q(A2+2) Q(A2+3) Q(A2) , Commercial and Industrial Temperature Ranges NOTES: 1. Q (A1) represents the first output from the external address A1. Q (A2) represents the first output from the external address A2; Q (A2+1) represents the next output data in the burst sequence of the base address A2, etc. where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW. 4. R/W is don't care when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the R/W signal when new address and control are loaded into the SRAM. , tCYC CLK tSE tHE tCH tCL CEN tHADV tSADV ADV/LD tSW tHW R/W tSA tHA A2 tSC tHC ADDRESS A1 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs CE1, CE2 tSB tHB (2) Timing Waveform of Write Cycles (1,2,3,4,5) 6.42 16 tSD tHD D(A2) D(A1) Pipeline Write Pipeline Write (CEN high, eliminates current L-H clock edge) BW1 - BW4 OE tSD tHD D(A2+2) Burst Pipeline Write 5296 drw 07 (Burst Wraps around to initial state) DATAIN D(A2+1) D(A2+3) D(A2) , Commercial and Industrial Temperature Ranges NOTES: 1. D (A1) represents the first input to the external address A1. D (A2) represents the first input to the external address A2; D (A2+1) represents the next input data in the burst sequence of the base address A2, etc. where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW. 4. R/W is don't care when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the R/W signal when new address and control are loaded into the SRAM. 5. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM. , tCYC CLK tSE tHE tCH tCL CEN tHADV tSADV ADV/LD tSW tHW R/W tSA tHA A2 A3 A6 A7 A4 A5 tSC tHC tSB tHB A8 A9 ADDRESS A1 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs CE1, CE2(2) Timing Waveform of Combined Read and Write Cycles (1,2,3) 6.42 17 tSD tHD D(A2) Write tCD Q(A1) Read Read tCHZ tCLZ Q(A3) Write tCDC D(A4) BW1 - BW4 OE DATAIN D(A5) DATAOUT Q(A6) Read Q(A7) 5296 drw 08 Commercial and Industrial Temperature Ranges NOTES: 1. Q (A1) represents the first output from the external address A1. D (A2) represents the input data to the SRAM corresponding to address A2. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM. , , , tCYC CLK tSE tHE tCH tCL CEN tSADV tHADV ADV/LD tSW tHW R/W tSA tHA A2 A3 tSC tHC tSB tHB B(A2) A4 A5 ADDRESS A1 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs CE1, CE2(2) Timing Waveform of CEN Operation (1,2,3,4) 6.42 18 tCHZ tCD Q(A1) tCLZ tCDC Q(A1) BW1 - BW4 OE tSD tHD D(A2) DATAIN DATAOUT Q(A3) 5296 drw 09 Commercial and Industrial Temperature Ranges NOTES: 1. Q (A1) represents the first output from the external address A1. D (A2) represents the input data to the SRAM corresponding to address A2. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. CEN when sampled high on the rising edge of clock will block that L-H transition of the clock from propogating into the SRAM. The part will behave as if the L-H clock transition did not occur. All internal registers in the SRAM will retain their previous state. 4. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM. , tCYC CLK tSE tHE tCH tCL CEN tHADV tSADV ADV/LD tSW tHW R/W tSA tHA A2 A3 A4 tSC tHC A5 ADDRESS A1 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs CE1, CE2 tSB tHB (2) Timing Waveform of CS Operation (1,2,3,4) 6.42 19 tCHZ tCD tCLZ Q(A1) tCDC Q(A2) BW1 - BW4 OE tSD tHD D(A3) DATAIN DATAOUT Q(A4) 5296 drw 10 Commercial and Industrial Temperature Ranges NOTES: 1. Q (A1) represents the first output from the external address A1. D (A3) represents the input data to the SRAM corresponding to address A3. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. CEN when sampled high on the rising edge of clock will block that L-H transition of the clock from propogating into the SRAM. The part will behave as if the L-H clock transition did not occur. All internal registers in the SRAM will retain their previous state. 4. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM. , IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges JTAG Interface Specification (SA Version only) tJCYC tJF TCK tJCL tJR tJCH Device Inputs(1)/ TDI/TMS tJS Device Outputs(2)/ TDO tJH tJDC tJRSR tJCD x M5296 drw 01 TRST(3) tJRST NOTES: 1. Device inputs = All device inputs except TDI, TMS and TRST. 2. Device outputs = All device outputs except TDO. 3. During power up, TRST could be driven low or not be used since the JTAG circuit resets automatically. TRST is an optional JTAG reset. JTAG AC Electrical Characteristics(1,2,3,4) Symbol tJCYC tJCH tJCL tJR tJF tJRST tJRSR tJCD tJDC tJS tJH Parameter JTAG Clock Input Period JTAG Clock HIGH JTAG Clock Low JTAG Clock Rise Time JTAG Clock Fall Time JTAG Reset JTAG Reset Recovery JTAG Data Output JTAG Data Output Hold JTAG Setup JTAG Hold Min. 100 40 40 ____ ____ Max. ____ ____ ____ Units ns ns ns ns ns ns ns ns ns ns ns I5296 tbl 01 Scan Register Sizes Register Name Instruction (IR) Bypass (BYR) JTAG Identification (JIDR) Boundary Scan (BSR) Bit Size 4 1 32 Note (1) I5296 tbl 03 5(1) 5(1) ____ ____ 50 50 ____ 20 ____ ____ ____ NOTE: 1. The Boundary Scan Descriptive Language (BSDL) file for this device is available by contacting your local IDT sales representative. 0 25 25 NOTES: 1. Guaranteed by design. 2. AC Test Load (Fig. 1) on external output signals. 3. Refer to AC Test Conditions stated earlier in this document. 4. JTAG operations occur at one speed (10MHz). The base device may run at any speed specified in this datasheet. 6.42 20 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges JTAG Identification Register Definitions (SA Version only) Instruction Field Revision Number (31:28) IDT Device ID (27:12) IDT JEDEC ID (11:1) ID Register Indicator Bit (Bit 0) Value 0x2 0x20A 0x33 1 Reserved for version number. Defines IDT part number 71V3548SA. Allows unique identification of device vendor as IDT. Indicates the presence of an ID register. I5296 tbl 02 Description Available JTAG Instructions Instruction EXTEST Description Forces contents of the bound ary scan cells onto the device outputs (1). Places the boundary scan registe r (BSR) between TDI and TDO. Places the boundary scan registe r (BSR) between TDI and TDO. SAMPLE allows data from device inputs (2) and outputs(1) to be captured in the boundary scan cells and shifted serially through TDO. PRELOAD allows data to be input serially into the bo undary scan cells via the TDI. Loads the JTAG ID register (JIDR) with the vendor ID code and places the register between TDI and TDO. Places the bypass register (BYR) be tween TDI and TDO. Forces all device o utput drivers to a High-Z state. OPCODE 0000 SAMPLE/PRELOAD 0001 DEVICE_ID HIGHZ RESERVED RESERVED RESERVED RESERVED CLAMP RESERVED RESERVED 0010 0011 0100 Several combinations are reserved. Do not use codes other than those identified for EXTEST, SAMPLE/PRELOAD, DEVICE_ID, HIGHZ, CLAMP, VALIDATE and BYPASS instructions. 0101 0110 0111 Uses BYR. Forces contents of the bound ary scan cells onto the device outputs. Places the byp ass registe r (BYR) between TDI and TDO. 1000 1001 1010 Same as above. RESERVED RESERVED VALIDATE RESERVED BYPASS Automatically loaded into the instruction register whenever the TAP controller passes through the CAPTURE-IR state. The lower two bits '01' are mand ated by the IEEE std. 1149.1 specification. Same as above. The BYPASS instruction is used to truncate the boundary scan register as a single bit in length. 1011 1100 1101 1110 1111 I5296 tbl 04 NOTES: 1. Device outputs = All device outputs except TDO. 2. Device inputs = All device inputs except TDI, TMS, and TRST. 6.42 21 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges 100-Pin Plastic Thin Quad Flatpack Package Diagram Outline 6.42 22 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges 119 Ball Grid Array (BGA) Package Diagram Outline 6.42 23 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges 165 Fine PItch Ball Grid Array (fBGA) Package Diagram Outline 6.42 24 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Timing Waveform of OE Operation (1) OE tOE tOHZ tOLZ Valid 5296 drw 11 DATAOUT , NOTE: 1. A read operation is assumed to be in progress. Ordering Information IDT 71V3548 Device Type XX Power XX Speed XX Package X Process/ Temperature Range Blank I Commercial (0°C to +70°C) Industrial (-40°C to +85°C) PF* BG BQ 100-pin Plastic Thin Quad Flatpack (TQFP) 119 Ball Grid Array (BGA) 165 fine Pitch Ball Grid Array (fBGA) , 133 100 S SA Clock Frequency in Megahertz Standard Power Standard Power with JTAG Interface * JTAG (SA version) is not available with 100-pin TQFP package 5296 drw 12 6.42 25 IDT71V3548, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Datasheet Document History 12/31/99 04/30/00 Pg. 3,4 Pg. 4 Pg. 4,5 Pg. 20 05/26/00 07/26/00 Pg. 23 Pg. 4-6 Pg. 6 Pg. 21 Pg. 6 Pg. 1-6,13,20,21,25 Created preliminary ZBT datasheet from 71V3558 datasheet. Changed tCDC, tCLZ, and tCHZ minimums from 1.0ns to 1.5ns. Add clarification note to Recommended Operating Temperature and Absolute Max Ratings tables Add BGA capacitance table Add notes to Pin configurations Insert TQFP PackageDiagram Outline Add new package offering, 13 x 15mm fBGA Correct 119 BGA Package Diagram Outline Add ZZ sleep mode reference note to TQFP, BG and BQ pinouts Update BQ165 pinout Update BG119 package diagram outline dimensions Remove Preliminary Status Add reference note to pin N5 on BQ165 pinout, reserved for JTAG TRST Added JTAG "SA" version functionality and updated ZZ pin descriptions and notes. 10/25/00 05/20/02 CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com for Tech Support: sramhelp@idt.com 800-544-7726, x4033 The IDT logo is a registered trademark of Integrated Device Technology, Inc. ZBT and ZeroBus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola Inc. 6.42 26