128K x 36, 256K x 18 3.3V Synchronous ZBT SRAMs 3.3V I/O, Burst Counter Pipelined Outputs
x x
IDT71V3556S IDT71V3558S IDT71V3556SA IDT71V3558SA
Features
128K x 36, 256K x 18 memory configurations Supports high performance system speed - 200 MHz (3.2 ns Clock-to-Data Access) ZBTTM Feature - No dead cycles between write and read cycles Internally synchronized output buffer enable eliminates the need to control OE OE Single R/W (READ/WRITE) control pin Positive clock-edge triggered address, data, and control signal registers for fully pipelined applications 4-word burst capability (interleaved or linear) Individual byte write (BW 1 - BW4) control (May tie active) BW Three chip enables for simple depth expansion 3.3V power supply (±5%), 3.3V I/O Supply (VDDQ) Optional- Boundary Scan JTAG Interface (IEEE 1149.1 compliant) Packaged in a JEDEC standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA)
Description
The IDT71V3556/58 are 3.3V high-speed 4,718,592-bit (4.5 Megabit) synchronous SRAMS. They are designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, they have been given the name ZBTTM, or Zero Bus Turnaround. Address and control signals are applied to the SRAM during one clock cycle, and two cycles later the associated data cycle occurs, be it read or write. The IDT71V3556/58 contain data I/O, address and control signal registers. Output enable is the only asynchronous signal and can be used to disable the outputs at any given time. A Clock Enable (CEN) pin allows operation of the IDT71V3556/58 to be suspended as long as necessary. All synchronous inputs are ignored when (CEN) is high and the internal device registers will hold their previous values. There are three chip enable pins (CE1, CE2, CE2) that allow the user to deselect the device when desired. If any one of these three are not asserted when ADV/LD is low, no new memory operation can be initiated. However, any pending data transfers (reads or writes) will be completed. The data bus will tri-state two cycles after chip is deselected or a write is initiated.
x
x
x x
x x x x x
x
Pin Description Summary
A0-A17 Address Inputs Chip Enables Output Enable Read/Write Signal Clock Enable Individual Byte Write Selects Clock Advance b urst address / Load new address Linear / Interleaved Burst Order Test Mode Select Test Data Input Test Clock Test Data Output JTAG Reset (Optional) Sleep Mode Data Input / Output Core Power, I/O Power Ground Input Input Input Input Input Input Input Input Input Input Input Input Output Input Input I/O Supply Supply Synchronous Synchronous Asynchronous Synchronous Synchronous Synchronous N/A Synchronous Static Synchronous Synchronous N/A Synchronous Asynchronous Synchronous Synchronous Static Static
5281 tbl 01
CE1, CE2, C E2 OE
R/W
CEN BW1, BW2, BW3, BW4
CLK ADV/LD
LBO
TMS TDI TCK TDO
TRST
ZZ I/O0-I/O31, I/OP1-I/OP4 VDD, VSS VDDQ
SEPTEMBER 2004
1
©2004 Integrated Device Technology, Inc. DSC-5281/08
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Description continued
The IDT71V3556/58 has an on-chip burst counter. In the burst mode, the IDT71V3556/58 can provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by the LBO input pin. The LBO pin selects between linear and interleaved burst sequence. The ADV/LD signal is used to load a new external address (ADV/LD = LOW) or increment the internal burst counter (ADV/LD = HIGH). The IDT71V3556/58 SRAMs utilize IDT's latest high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and a 165 fine pitch ball grid array (fBGA).
Pin Definition(1)
Symbol A 0-A 17 Pin Function Address Inputs I/O I Active N/A Description
Synchronous Address inputs. The address register is triggered by a combination of the rising edge of CLK, ADV/LD low, CEN low, and true chip enables. ADV/LD is a synchronous input that is used to load the internal registers with new addres s and control when it is sampled low at the rising edge of clock with the chip selected. When ADV/ LD is low with the chip deselected, any burst in progress is terminated. When ADV/ LD is sampled high then the internal burst counter is advanced for any burst that was in progress. The external addresses are ignored when ADV/ LD is sampled high. R/W signal is a synchronous input that identifies whether the current load cycle initiated is a Read or Write access to the memory array. The data bus activity for the current cycle takes place two clock cycles later. Sync hronous Clock Enable Input. When CEN is sampled high, all other synchronous inputs, including clock are ignored and outputs remain unchanged. The effect of CEN sampled high on the device outputs is as if the low to high clock transition did not occur. For normal operation, CEN must be sampled low at rising edge of clock. Synchronous byte write enables. Each 9-bit b yte has its own active low byte write enable. On load write cycles (When R/W and ADV/LD are sampled low) the appropriate byte write signal (BW1-BW4) must be valid. The byte write signal must also be valid on each cycle of a burst write. Byte Write signals are ignored when R/ W is sampled high. The appropriate byte(s) of data are written into the de vice two cycles later. BW1-BW4 c an all be tied low if always doing write to the entire 36-bit word. Synchronous active low chip enable. C E1 and C E2 are used with CE 2 to enable the IDT71V3556/58. (CE1 or CE2 s ampled high or CE 2 s ampled low) and ADV/LD low at the rising edge of clock, initiates a deselect cycle. The ZBTTM has a two cycle deselect, i.e., the data bus will tri-state two clo ck cycles after deselect is initiated. Sync hronous active high chip enable. CE 2 is used with C E1 and C E2 to enable the chip. CE 2 has inverted polarity but otherwise identical to C E1 and C E2. This is the clock input to the IDT71V3556/58. Except for OE, all timing references for the device are made with respect to the rising edge of CLK. Synchronous data input/output (I/O) pins . Both the data input path and data output path are registered and triggered by the rising edge of CLK. Burst order selection input. When LBO is high the Interleaved burst sequence is selected. When LBO is low the Linear burst sequence is selected. LBO is a static input and it must not change during device operation. Asynchronous output enable. OE must be low to read data from the 71V3556/58. When OE is high the I/O pins are in a high-impedance state. OE does not need to be actively controlled for read and write cycles. In normal operation, OE c an be tied low. Gives input command for TAP controller. Sampled on rising edge of TDK. This pin has an internal pullup. Serial input of registers placed between TDI and TDO. Sampled on rising edge of TCK. This pin has an internal pullup. Clock input of TAP controller. Each TAP event is clocked. Test inputs are captured o n rising edge of TCK, while test outputs are d riven from the falling edge of TCK. This pin has an internal pullup. Serial output of registers placed between TDI and TDO. This output is active depending on the state of the TAP controller. Optional Asynchronous JTAG reset. Can be used to reset the TAP controller, but not required. JTAG reset occurs automatically at power up and also resets using TMS and TCK per IEEE 1149.1. If not used TRST can be left floating. This pin has an internal pullup. Only available in BGA package. Synchronous sleep mode input. ZZ HIGH will gate the CLK internally and power down the IDT71V3556/3558 to its lowest power consumption level. Data retention is guaranteed in Sleep Mode. This pin has an internal pulldown. 3.3V core power supply. 3.3V I/O Supply. Ground.
5281 tbl 02
ADV/LD
Advance / Load
I
N/A
R/W
Read / Write
I
N/A
CEN
Clock Enable
I
LOW
BW1-BW4
Individual Byte Write Enables
I
LOW
CE1, C E2
Chip Enables
I
LOW
CE 2 CLK I/O0-I/O31 I/OP1-I/OP4
Chip Enable Clock Data Input/Output Linear Burst Order
I I I/O I
HIGH N/A N/A LOW
LBO OE
TMS TDI TCK TDO
Output Enable Test Mode Select Test Data Input Test Clock Test Data Output JTAG Reset (Optional)
I I I I O
LOW N/A N/A N/A N/A
TRST
I
LOW
ZZ V DD V DDQ V SS
Sleep Mode Power Supply Power Supply Ground
I N/A N/A N/A
HIGH N/A N/A N/A
NOTE:
1. All synchronous inputs must meet specified setup and hold times with respect to CLK. 6.42 2
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Functional Block Diagram
LBO Address A [0:16] C E 1, CE2, C E 2 R/W C EN ADV/LD BW x
D Clk D Q Control D Q
128Kx36 BIT MEMORY ARRAY
Address
Input Register
DI
DO
Q
Control Logic
Mux
Sel
D Clk
Clock
Output Register Q
OE
Gate
5281 drw 01a
,
(optional)
TMS TDI TCK TR S T
JTAG (SA Version)
TDO
Data I/O [0:31], I/O P[1:4]
6.42 3
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Functional Block Diagram
LBO Address A [0:17] C E 1, CE2, C E 2 R/W C EN ADV/LD BW x
D Clk D Q Control D Q
256x18 BIT MEMORY ARRAY
Address
Input Register
DI
DO
Q
Control Logic
Mux
Sel
D Clk
Clock
Output Register Q
OE
Gate
5281 drw 01b
,
(optional)
TMS TDI TCK TR S T
JTAG (SA Version)
TDO
Data I/O [0:15], I/O P[1:2]
Recommended DC Operating Conditions
Symbol VDD VDDQ VSS VIH VIH VIL Parameter Core Supply Voltage I/O Supply Voltage Supply Voltage Input High Voltage - Inputs Input High Voltage - I/O Input Low Voltage Min. 3.135 3.135 0 2.0 2.0 -0.3
(1)
Typ. 3.3 3.3 0
____ ____ ____
Max. 3.465 3.465 0 VDD +0.3 VDDQ +0.3 0.8
(2)
Unit V V V V V V
5281 tbl 04
NOTES: 1. VIL (min.) = –1.0V for pulse width less than tCYC /2, once per cycle. 2. VIH (max.) = +6.0V for pulse width less than tCYC/2, once per cycle.
6.42 4
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Recommended Operating Temperature and Supply Voltage
Grade Commercial Industrial Temperature(1) 0°C to +70°C -40°C to +85°C VSS 0V 0V VDD 3.3V± 5% 3.3V± 5% VDDQ 3.3V± 5% 3.3V± 5%
5281 tbl 05
NOTES: 1. TA is the "instant on" case temperature.
Pin Configuration - 128K x 36
CE2 BW 4 BW 3 BW 2 BW 1 CE 2 VDD VSS CLK R/W CEN OE ADV/LD NC(2) NC(2) A8 A9 A6 A7 CE 1
I/OP3 I/O16 I/O17 VDDQ VSS I/O18 I/O19 I/O20 I/O21 VSS VDDQ I/O22 I/O23 VDD(1) VDD VDD(1) VSS I/O24 I/O25 VDDQ VSS I/O26 I/O27 I/O28 I/O29 VSS VDDQ I/O30 I/O31 I/OP4
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
5281 drw 02
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
I/OP2 I/O15 I/O14 VDDQ VSS I/O13 I/O12 I/O11 I/O10 VSS VDDQ I/O9 I/O8 VSS VDD(1) VDD VSS/ZZ(3) I/O7 I/O6 VDDQ VSS I/O5 I/O4 I/O3 I/O2 VSS VDDQ I/O1 I/O0 I/OP1
,
NOTES: 1. Pins 14, 16 and 66 do not have to be connected directly to VDD as long as the input voltage is ≥ VIH. 2. Pins 83 and 84 are reserved for future 8M and 16M respectively. 3. Pin 64 does not have to be connected directly to V SS as long as the input voltage is ≤ VIL; on the latest die revision this pin supports ZZ (sleep mode).
LBO A5 A4 A3 A2 A1 A0 NC NC VSS VDD NC NC A10 A11 A12 A13 A14 A15 A16
Top View 100 TQFP
6.42 5
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Pin Configuration - 256K x 18
VDD VSS CLK R/W CEN OE ADV/LD NC(2) NC(2) A8 A9 CE2 NC NC BW 2 BW 1 C E2 A6 A7 C E1
Absolute Maximum Ratings (1)
Symbol VTERM(2)
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
Rating Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Terminal Voltage with Respect to GND Commercial Operating Temperature Industrial Operating Temperature
Commercial & Industrial Values -0.5 to +4.6 -0.5 to VDD -0.5 to VDD +0.5 -0.5 to VDDQ +0.5 -0 to +70 -40 to +85 -55 to +125 -55 to +125 2.0 50
Unit V V V V
o
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
NC NC NC VDDQ VSS NC NC I/O8 I/O9 VSS VDDQ I/O10 I/O11 VDD(1) VDD VDD(1) VSS I/O12 I/O13 VDDQ VSS I/O14 I/O15 I/OP2 NC VSS VDDQ NC NC NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A10 NC NC VDDQ VSS NC I/OP1 I/O7 I/O6 VSS VDDQ I/O5 I/O4 VSS VDD(1) VDD VSS/ZZ(3) I/O3 I/O2 VDDQ VSS I/O1 I/O0 NC NC VSS VDDQ NC NC NC
VTERM(3,6) VTERM(4,6) VTERM(5,6)
C C C C
TA
(7)
o
TBIAS TSTG PT IOUT
Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
o
o
,
W mA
5281 tbl 06
5281 drw 02a
Top View 100 TQFP
NOTES: 1. Pins 14, 16 and 66 do not have to be connected directly to VDD as long as the input voltage is ≥ VIH . 2. Pins 83 and 84 are reserved for future 8M and 16M respectively. 3. Pin 64 does not have to be connected directly to VSS as long as the input voltage is ≤ VIL; on the latest die revision this pin supports ZZ (sleep mode).
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VDD terminals only. 3. VDDQ terminals only. 4. Input terminals only. 5. I/O terminals only. 6. This is a steady-state DC parameter that applies after the power supply has reached its nominal operating value. Power sequencing is not necessary; however, the voltage on any input or I/O pin cannot exceed VDDQ during power supply ramp up. 7. TA is the "instant on" case temperature.
100 Pin TQFP Capacitance(1)
(TA = +25° C, f = 1.0MHz)
Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. 5 7 Unit pF pF
5281 tbl 07
LBO A5 A4 A3 A2 A1 A0 NC NC VSS VDD NC NC A11 A12 A13 A14 A15 A16 A17
119 BGA Capacitance(1)
(TA = +25° C, f = 1.0MHz)
Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. 7 7 Unit pF pF
5281 tbl 07a
165 fBGA Capacitance(1)
(TA = +25° C, f = 1.0MHz)
Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 3dV VOUT = 3dV Max. TBD TBD Unit pF pF
5281 tb l 07b
NOTE: 1. This parameter is guaranteed by device characterization, but not production tested.
6.42 6
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Pin Configuration - 128K x 36, 119 BGA
1 A B C D E F G H J K L M N P R T U VDDQ NC NC I/O16 I/O17 VDDQ I/O20 I/O22 VDDQ I/O24 I/O25 VDDQ I/O29 I/O31 NC NC VDDQ 2 A6 CE 2 A7 I/OP3 I/O18 I/O19 I/O21 I/O23 V DD I/O26 I/O27 I/O28 I/O30 I/OP4 A5 NC 3 A4 A3 A2 VSS VSS VSS BW 3 VSS VDD(1) VSS BW 4 VSS VSS VSS LBO A 10 4 NC(2) ADV/LD VDD NC C E1 OE NC(2) R/W VDD CLK NC C EN A1 A0 VDD A11 5 A8 A9 A12 VSS VSS VSS BW 2 VSS VDD(1) VSS BW 1 VSS VSS VSS VDD(1) A14 6 A16 C E2 A15 I/OP2 I/O13 I/O12 I/O11 I/O9 VDD I/O6 I/O4 I/O3 I/O2 I/OP1 A13 NC 7 VDDQ NC NC I/O15 I/O14 VDDQ I/O10 I/O8 VDDQ I/O7 I/O5 VDDQ I/O1 I/O 0 NC NC/ZZ(5) VDDQ
5281 drw 13A
,
NC/TMS(3) NC/TDI(3) NC/TCK(3) NC/TDO(3) NC/TRST(3,4)
Top View Pin Configuration - 256K x 18, 119 BGA
1 A B C D E F G H J K L M N P R T U VDDQ NC NC I/O8 NC VDDQ NC I/O11 VDDQ NC I/O13 VDDQ I/O15 NC NC NC VDDQ 2 A6 CE2 A7 NC I/O9 NC I/O10 NC VDD I/O12 NC I/O14 NC I/OP2 A5 A 10 3 A4 A3 A2 VSS VSS VSS BW 2 VSS VDD(1) VSS VSS VSS VSS VSS LBO A15 4 NC(2) ADV/LD VDD NC CE 1 OE NC(2) R/W VDD CLK NC CEN A1 A0 VDD NC 5 A8 A9 A13 VSS VSS VSS VSS VSS VDD(1) VSS BW 1 VSS VSS VSS V DD(1) A14 6 A16 C E2 A17 I/OP1 NC I/O6 NC I/O4 VDD NC I/O2 NC I/O1 NC A12 A11 7 VDDQ NC NC NC I/O7 VDDQ I/O5 NC VDDQ I/O3 NC VDDQ NC I/O0 NC NC/ZZ(5)
NC/TMS(3) NC/TDI(3) NC/TCK(3) NC/TDO(3) NC/TRST(3,4) VDDQ
5281drw 13B
,
Top View
NOTES: 1. J3, J5, and R5 do not have to be directly connected to VDD as long as the input voltage is ≥ VIH . 2. G4 and A4 are reserved for future 8M and 16M respectively. 3. These pins are NC for the "S" version or the JTAG signal listed for the "SA" version. 4. TRST is offered as an optional JTAG reset if required in the application. If not needed, can be left floating and will internally be pulled to VDD. 5. Pin T7 does not have to be connected directly to VSS as long as the input voltage is ≤ VIL; on the latest die revision this pin supports ZZ (sleep mode).
6.42 7
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Pin Configuration - 128K x 36, 165 fBGA
1 A B C D E F G H J K L M N P R NC(2) NC I/OP3 I/O17 I/O19 I/O21 I/O23 VDD(1) I/O25 I/O27 I/O29 I/O31 I/OP4 NC 2 A7 A6 NC I/O16 I/O18 I/O20 I/O22 VDD(1) I/O24 I/O26 I/O28 I/O30 NC NC(2) NC(2) 3 4 5 6 7 8 ADV/LD 9 NC(2) NC(2) VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A13 A12 10 A8 A9 NC I/O15 I/O13 I/O11 I/O9 NC I/O7 I/O5 I/O3 I/O1 NC A14 A15 11 NC NC(2) I/OP2 I/O14 I/O12 I/O10 I/O8 NC/ZZ(5) I/O6 I/O4 I/O2 I/O0 I/OP1 NC A16
5281 tbl 25
CE1
CE2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A5 A4
BW3 BW4
VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A2 A3
BW2 BW1
VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
NC/TRST (3,4)
CE2
CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0
CEN
R/W VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD(1) NC/TDO(3) NC/TCK(3)
OE
VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A10 A11
NC/TDI(3) NC/TMS (3)
LBO
Pin Configuration - 256K x 18, 165 fBGA
1 A B C D E F G H J K L M N P R NC
(2)
2 A7 A6 NC I/O8 I/O9 I/O10 I/O11 VDD(1) NC NC NC NC NC NC
(2)
3
4
5 NC
6
7
8 ADV/LD
9 NC
(2)
10 A8 A9 NC NC NC NC NC NC I/O3 I/O2 I/O1 I/O0 NC A15 A16
11 A10 NC(2) I/OP1 I/O7 I/O6 I/O5 I/O4 NC/ZZ(5) NC NC NC NC NC NC A17
CE1
CE2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A5 A4
BW2
NC VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A2 A3
CE2
CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0
CEN
R/W VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD(1) NC/TDO NC/TCK
(3)
NC NC NC NC NC NC VDD(1) I/O12 I/O13 I/O14 I/O15 I/OP2 NC
BW1
VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
NC/TRST (3, 4)
OE
VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A11 A12
NC(2) VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A14 A13
NC/TDI
(3)
LBO
NC
(2)
NC/TMS
(3)
(3)
5281 tbl 25a NOTES: 1. H1, H2, and N7 do not have to be directly connected to VDD as long as the input voltage is ≥ VIH. 2. A9, B9, B11, A1, R2 and P2 are reserved for future 9M, 18M, 36M, 72M, 144M and 288M respectively. 3. These pins are NC for the "S" version or the JTAG signal listed for the "SA" version. 4. TRST is offered as an optional JTAG reset if required in the application. If not needed, can be left floating and will internally be pulled to VDD. 5. Pin H11 does not have to be connected directly to VSS as long as the input voltage is ≤ VIL; on the latest die revision this pin supports ZZ (sleep mode).
6.42 8
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Synchronous Truth Table (1)
CEN
L L L L L L H R/W L H X X X X X Chip(5) Enable Select Select X X Deselect X X ADV/ LD L L H H L H X
BWx
Valid X Valid X X X X
ADDRESS USED External External Internal Internal X X X
PREVIOUS CYCLE X X LOAD WRITE / BURST WRITE LOAD READ / BURST READ X DESELECT / NOOP X
CURRENT CYCLE LOAD WRITE LOAD READ BURST WRITE (Advance burst counter)(2) BURST READ (Advance burst counter)(2) DESELECT or STOP(3) NOOP SUSPEND(4)
I/O (2 cycles later) D(7) Q(7) D(7) Q(7) HiZ HiZ Previous Value
5281 tbl 08
NOTES: 1. L = VIL, H = VIH, X = Don’t Care. 2. When ADV/LD signal is sampled high, the internal burst counter is incremented. The R/ W signal is ignored when the counter is advanced. Therefore the nature of the burst cycle (Read or Write) is determined by the status of the R/W signal when the first address is loaded at the beginning of the burst cycle. 3. Deselect cycle is initiated when either (CE1, or CE2 is sampled high or CE2 is sampled low) and ADV/LD is sampled low at rising edge of clock. The data bus will tri-state two cycles after deselect is initiated. 4. When CEN is sampled high at the rising edge of clock, that clock edge is blocked from propogating through the part. The state of all the internal registers and the I/ Os remains unchanged. 5. To select the chip requires CE1 = L, CE2 = L, CE2 = H on these chip enables. Chip is deselected if any one of the chip enables is false. 6. Device Outputs are ensured to be in High-Z after the first rising edge of clock upon power-up. 7. Q - Data read from the device, D - data written to the device.
Partial Truth Table for Writes
OPERATION READ WRITE ALL BYTES WRITE BYTE 1 (I/O[0:7], I/OP1)
(2)
(1)
R/W H L L L L L L
BW1
X L L H H H H
BW2
X L H L H H H
BW3(3)
X L H H L H H
BW4(3)
X L H H H L H
5281 tbl 09
WRITE BYTE 2 (I/O[8:15], I/OP2)(2) WRITE BYTE 3 (I/O[16:23], I/OP3) WRITE BYTE 4 (I/O[24:31], I/OP4) NO WRITE
NOTES: 1. L = VIL, H = VIH, X = Don’t Care. 2. Multiple bytes may be selected during the same cycle. 3. N/A for X18 configuration.
(2,3) (2,3)
6.42 9
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Interleaved Burst Sequence Table (LBO=V DD)
Sequence 1 A1 First Address Second Address Third Address Fourth Address (1) 0 0 1 1 A0 0 1 0 1 Sequence 2 A1 0 0 1 1 A0 1 0 1 0 Sequence 3 A1 1 1 0 0 A0 0 1 0 1 Sequence 4 A1 1 1 0 0 A0 1 0 1 0
5281 tbl 10
NOTE: 1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting.
Linear Burst Sequence Table (LBO=V SS)
Sequence 1 A1 First Address Second Address Third Address Fourth Address
(1)
Sequence 2 A1 0 1 1 0 A0 1 0 1 0
Sequence 3 A1 1 1 0 0 A0 0 1 0 1
Sequence 4 A1 1 0 0 1 A0 1 0 1 0
5281 tbl 11
A0 0 1 0 1
0 0 1 1
NOTE: 1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting.
Functional Timing Diagram (1)
CYCLE CLOCK ADDRESS (A0 - A16)
(2)
n+29
n+30
n+31
n+32
n+33
n+34
n+35
n+36
n+37
A29
A30
A31
A32
A33
A34
A35
A36
A37
CONTROL (R/W , ADV/LD , BW x)
(2)
(2)
C29
C30
C31
C32
C33
C34
C35
C36
C37
DATA I/O [0:31], I/O P[1:4]
D/Q27
D/Q28
D/Q29
D/Q30
D/Q31
D/Q32
D/Q33
D/Q34
D/Q35
5281 drw 03
,
NOTES: 1. This assumes CEN, CE1, CE2, CE2 are all true. 2. All Address, Control and Data_In are only required to meet set-up and hold time with respect to the rising edge of clock. Data_Out is valid after a clock-to-data delay from the rising edge of clock.
6.42 10
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Device Operation - Showing Mixed Load, Burst, Deselect and NOOP Cycles (2)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 n+10 n+11 n+12 n+13 n+14 n+15 n+16 n+17 n+18 n+19 Address A0 X A1 X X A2 X X A3 X A4 X X A5 A6 A7 X A8 X A9 R/ W H X H X X H X X L X L X X L H L X H X L ADV/LD L H L L H L H L L H L L H L L L H L H L
CE(1)
L X L H X L X H L X L H X L L L X L X L
CEN
L L L L L L L L L L L L L L L L L L L L
BWx
X X X X X X X X L L L X X L X L L X X L
OE
X X L L L X X L L X X X X X X X L X X L
I/O X X Q0 Q0+1 Q1 Z Z Q2 Q2+1 Z D3 D3+1 D4 Z Z D5 Q6 D7 D7+1 Q8
Comments Load read Burst read Load read Deselect or STOP NOOP Load read Burst read Deselect or STOP Load write Burst write Load write Deselect or STOP NOOP Load write Load read Load write Burst write Load read Burst read Load write
5281 tbl 12
NOTES: 1. CE = L is defined as CE1 = L, CE2 = L and CE 2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 2. H = High; L = Low; X = Don’t Care; Z = High Impedance.
Read Operation (1)
Cycle n n+1 n+2 Address A0 X X R/ W H X X ADV/LD L X X
CE(2)
L X X
CEN
L L X
BWx
X X X
OE
X X L
I/O X X Q0
Comments Address and Control meet setup Clock Setup Valid Contents of Address A0 Read Out
5281 tbl 13
NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
6.42 11
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Burst Read Operation (1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 Address A0 X X X X A1 X X A2 R/ W H X X X X H X X H ADV/LD L H H H H L H H L
CE(2)
L X X X X L X X L
CEN
L L L L L L L L L
BWx
X X X X X X X X X
OE
X X L L L L L L L
I/O X X Q0 Q0+1 Q0+2 Q0+3 Q0 Q1 Q1+1
Comments Address and Control meet setup Clock Setup Valid, Advance Counter Address A0 Read Out, Inc. Count Address A0+1 Read Out, Inc. Count Address A0+2 Read Out, Inc. Count Address A0+3 Read Out, Load A1 Address A0 Read Out, Inc. Count Address A1 Read Out, Inc. Count Address A1+1 Read Out, Load A2
5281 tbl 14
NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance.. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
Write Operation
Cycle n n+1 n+2 Address A0 X X R/ W L X X
(1)
ADV/LD L X X
CE(2)
L X X
CEN
L L L
BWx
L X X
OE
X X X
I/O X X D0
Comments Address and Control meet setup Clock Setup Valid Write to Address A0
5281 tbl 15
NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
Burst Write Operation
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 Address A0 X X X X A1 X X A2 R/ W L X X X X L X X L ADV/LD L H H H H L H H L
(1)
CE(2)
L X X X X L X X L
CEN
L L L L L L L L L
BWx
L L L L L L L L L
OE
X X X X X X X X X
I/O X X D0 D0+1 D0+2 D0+3 D0 D1 D1+1
Comments Address and Control meet setup Clock Setup Valid, Inc. Count Address A0 Write, Inc. Count Address A0+1 Write, Inc. Count Address A0+2 Write, Inc. Count Address A0+3 Write, Load A1 Address A0 Write, Inc. Count Address A1 Write, Inc. Count Address A1+1 Write, Load A2
5281 tbl 16
NOTES: 1. H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
6.42 12
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Read Operation with Clock Enable Used (1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 Address A0 X A1 X X A2 A3 A4 R/ W H X H X X H H H ADV/LD L X L X X L L L
CE(2)
L X L X X L L L
CEN
L H L H H L L L
BWx
X X X X X X X X
OE
X X X L L L L L
I/O X X X Q0 Q0 Q0 Q1 Q2
Comments Address and Control meet setup Clock n+1 Ignored Clock Valid Clock Ignored. Data Q0 is on the bus. Clock Ignored. Data Q0 is on the bus. Address A0 Read out (bus trans.) Address A1 Read out (bus trans.) Address A2 Read out (bus trans.)
5281 tbl 17
NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
Write Operation with Clock Enable Used (1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 Address A0 X A1 X X A2 A3 A4 R/ W L X L X X L L L ADV/LD L X L X X L L L
CE(2)
L X L X X L L L
CEN
L H L H H L L L
BWx
L X L X X L L L
OE
X X X X X X X X
I/O X X X X X D0 D1 D2
Comments Address and Control meet setup. Clock n+1 Ignored. Clock Valid. Clock Ignored. Clock Ignored. Write Data D0 Write Data D1 Write Data D2
5281 tbl 18
NOTES: 1. H = High; L = Low; X = Don’t Care; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
6.42 13
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Read Operation with CHIP Enable Used (1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 Address X X A0 X A1 X X A2 X X R/ W X X H X H X X H X X ADV/LD L L L L L L L L L L
CE(2)
H H L H L H H L H H
CEN
L L L L L L L L L L
BWx
X X X X X X X X X X
OE
X X X X L X L X X L
I/O(3) ? ? Z Z Q0 Z Q1 Z Z Q2
Comments Deselected. Deselected. Address and Control meet setup Deselected or STOP. Address A0 Read out. Load A 1. Deselected or STOP. Address A1 Read out. Deselected. Address and control meet setup. Deselected or STOP. Address A2 Read out. Deselected.
5281 tbl 19
NOTES: 1. H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L. 3. Device Outputs are ensured to be in High-Z after the first rising edge of clock upon power-up.
Write Operation with Chip Enable Used (1)
Cycle n n+1 n+2 n+3 n+4 n+5 n+6 n+7 n+8 n+9 Address X X A0 X A1 X X A2 X X R/ W X X L X L X X L X X ADV/LD L L L L L L L L L L
CE(2)
H H L H L H H L H H
CEN
L L L L L L L L L L
BWx
X X L X L X X L X X
OE
X X X X X X X X X X
I/O(3) ? ? Z Z D0 Z D1 Z Z D2
Comments Deselected. Deselected. Address and Control meet setup Deselected or STOP. Address D0 Write in. Load A 1. Deselected or STOP. Address D1 Write in. Deselected. Address and control meet setup. Deselected or STOP. Address D2 Write in. Deselected.
5281 tbl 20
NOTES: 1. H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance. 2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
6.42 14
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V +/-5%)
Symbol |ILI| |ILI| |ILO| VOL VOH Parameter Input Leakage Current LBO, JTAG and ZZ Input Leakage Current(1) Output Leakage Current Output Low Voltage Output High Voltage Test Conditions VDD = Max., VIN = 0V to V DD VDD = Max., VIN = 0V to V DD VOUT = 0V to V DDQ , Device Deselected IOL = + 8mA, VDD = M in. IOH = -8mA, VDD = M in. Min.
___
Max. 5 30 5 0.4
___
Unit µA µA µA V V
5281 tbl 21
___
___
___
2.4
NOTE: 1. The LBO, TMS, TDI, TCK and TRST pins will be internally pulled to VDD and ZZ will be internally pulled if they are not actively driven in the application.
DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (1) (VDD = 3.3V +/-5%)
200MHz Symbol IDD Parameter Operating Power Supply Current Test Conditions Device Selected, Outputs Open, ADV/LD = X, VDD = Max., VIN > VIH o r < VIL, f = fMAX(2) Com'l Only 400 166MHz Com'l 350 Ind 360 133MHz Com'l 300 Ind 310 100MHz Com'l 250 Ind 255 Unit mA
ISB1
Device Deselected, Outputs Open, CMOS Standby Power Supply Current VDD = Max., VIN > VHD o r < VLD, f = 0(2,3) Clock Running Power Device Deselected, Outputs Open, VDD = Max., VIN > VHD o r < VLD, f Supply Current = fMAX(2.3) Idle Power Supply Current Device Selected, Outputs Open, CEN > VIH, VDD = Max., VIN > VHD o r < VLD, f = fMAX(2,3)
40
40
45
40
45
40
45
mA
ISB2
130
120
130
110
120
100
110
mA
ISB3
40
40
45
40
45
40
45
mA
NOTES: 1. All values are maximum guaranteed values. 2. At f = f MAX, inputs are cycling at the maximum frequency of read cycles of 1/tCYC; f=0 means no input lines are changing. 3. For I/Os VHD = VDDQ – 0.2V, VLD = 0.2V. For other inputs VHD = VDD – 0.2V, VLD = 0.2V.
5281 tbl 22
AC Test Loads
I/O Z0 = 50Ω
VDDQ/2 50Ω
AC Test Conditions
(VDDQ = 3.3V)
Input Pulse Levels 0 to 3V 2ns 1.5V 1.5V See Figure 1
5281 tbl 23
6 5 4 ∆tCD 3 (Typical, ns) 2 1 20 30 50
5281 drw 04
,
Input Rise/Fall Times Input Timing Reference Levels Output Timing Reference Levels AC Test Load
Figure 1. AC Test Load
80 100 Capacitance (pF)
200
5281 drw 05
,
6.42 15
Figure 2. Lumped Capacitive Load, Typical Derating
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(VDD = 3.3V +/-5%, Commercial and Industrial Temperature Ranges)
200MHz(6) Symbol Parameter Min. Max. 166MHz Min. Max. 133MHz Min. Max. 100MHz Min. Max. Unit
tCYC tF(1) tCH(2) tCL(2)
Clock Cycle Time Clock Frequence Clock High Pulse Width Clock Low Pulse Width
5
____
____
6
____
____
7.5
____
____
10
____
____
ns MHz ns ns
200
____
166
____
133
____
100
____
1.8 1.8
1.8 1.8
2.2 2.2
3.2 3.2
____
____
____
____
Output Parameters
tCD tCDC tCLZ(3,4,5) tCHZ(3,4,5) tOE tOLZ(3,4) tOHZ(3,4) Clock High to Valid Data Clock High to Data Change Clock High to Output Active Clo ck High to Data High-Z Output Enable Access Time Output Enable Low to Data Active Output Enable High to Data High-Z
____
3.2
____
____
3.5
____
____
4.2
____
____
5
____
ns ns ns ns ns ns ns
1 1 1
____
1 1 1
____
1 1 1
____
1 1 1
____
____
____
____
____
3 3.2
____
3 3.5
____
3 4.2
____
3.3 5
____
0
____
0
____
0
____
0
____
3.5
3.5
4.2
5
Set Up Times
tSE tSA tSD tSW tSADV tSC tSB Clock Enable Setup Time Address Setup Time Data In Setup Time Read/Write (R/W) Setup Time Advance/Load (ADV/ LD) Setup Time Chip Enable/Select Setup Time Byte Write Enable (BWx) Setup Time 1.5 1.5 1.5 1.5 1.5 1.5 1.5
____
1.5 1.5 1.5 1.5 1.5 1.5 1.5
____
1.7 1.7 1.7 1.7 1.7 1.7 1.7
____
2.0 2.0 2.0 2.0 2.0 2.0 2.0
____
ns ns ns ns ns ns ns
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
Hold Times
tHE tHA tHD tHW tHADV tHC tHB Clock Enable Hold Time Address Hold Time Data In Hold Time Read/Write (R/W) Hold Time Advance/Load (ADV/ LD) Hold Time Chip Enable/Select Hold Time Byte Write Enable (BWx) Hold Time 0.5 0.5 0.5 0.5 0.5 0.5 0.5
____
0.5 0.5 0.5 0.5 0.5 0.5 0.5
____
0.5 0.5 0.5 0.5 0.5 0.5 0.5
____
0.5 0.5 0.5 0.5 0.5 0.5 0.5
____
ns ns ns ns ns ns ns
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
5281 tbl 24 NOTES: 1. tF = 1/tCYC. 2. Measured as HIGH above 0.6VDDQ and LOW below 0.4VDDQ. 3. Transition is measured ±200mV from steady-state. 4. These parameters are guaranteed with the AC load (Figure 1) by device characterization. They are not production tested. 5. To avoid bus contention, the output buffers are designed such that tCHZ (device turn-off) is about 1ns faster than tCLZ (device turn-on) at a given temperature and voltage. The specs as shown do not imply bus contention because tCLZ is a Min. parameter that is worse case at totally different test conditions (0 deg. C, 3.465V) than tCHZ, which is a Max. parameter (worse case at 70 deg. C, 3.135V). 6. Commercial temperature range only.
6.42 16
tCYC
CLK tSE tHE tCH tCL
C EN tHADV
tSADV
ADV/LD tSW tHW
R/W tSA tHA A2 tSC tHC
ADDRESS
A1
C E 1, CE 2
(2)
Timing Waveform of Read Cycle (1,2,3,4)
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
6.42 17
tCLZ tCD Q(A1) Pipeline Read Pipeline Read Q(A2) tCDC Q(A2+1) tCDC tCD
(CEN high, eliminates current L-H clock edge) (Burst Wraps around to initial state)
BW
1
- BW
4
OE tCHZ Q(A2+2) Burst Pipeline Read
5281 drw 06
DATAOUT
Q(A2+2)
Q(A2+3)
Q(A2)
,
NOTES: 1. Q (A1) represents the first output from the external address A1. Q (A2) represents the first output from the external address A2; Q (A2+1) represents the next output data in the burst sequence of the base address A2, etc. where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW. 4. R/W is don't care when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the R/W signal when new address and control are loaded into the SRAM.
,
tCYC
CLK tSE tHE tCH tCL
C EN tHADV
tSADV
ADV/LD tSW tHW
R/W tSA tHA A2 tSC tHC
ADDRESS
A1
Timing Waveform of Write Cycles
C E 1, C E 2 tSB tHB
(2)
(1,2,3,4,5)
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
6.42 18
tSD tHD D(A2) D(A1)
Pipeline Write Pipeline Write (CEN high, eliminates current L-H clock edge)
BW 1 - BW 4
OE tSD tHD D(A2+2)
Burst Pipeline Write
5281 drw 07
(Burst Wraps around to initial state)
DATAIN
D(A2+1)
D(A2+3)
D(A2)
,
NOTES: 1. D (A1) represents the first input to the external address A1. D (A2) represents the first input to the external address A2; D (A2+1) represents the next input data in the burst sequence of the base address A2, etc. where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW. 4. R/W is don't care when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the R/W signal when new address and control are loaded into the SRAM. 5. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM.
,
tCYC
CLK tSE tHE tCH tCL
C EN tHADV
tSADV
ADV/LD tSW tHW
R/W tSA tHA A2 A3 A6 A7 A4 A5 tSC tHC tSB tHB A8 A9
ADDRESS
A1
C E 1, C E 2(2)
Timing Waveform of Combined Read and Write Cycles (1,2,3)
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
6.42 19
tSD tHD D(A2) Write tCD Q(A1) Read Read tCHZ tCLZ Q(A3) Write tCDC D(A4)
BW
1-
BW
4
OE
DATAIN
D(A5)
DATAOUT
Q(A6) Read
Q(A7)
5281 drw 08
NOTES: 1. Q (A1) represents the first output from the external address A1. D (A2) represents the input data to the SRAM corresponding to address A2. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM.
, , ,
tCYC
CLK tSE tHE tCH tCL
C EN
tSADV
tHADV
ADV/LD tSW tHW
R/W tSA tHA A2 A3 tSC tHC A4 A5
ADDRESS
A1
C E 1, C E 2(2) tSB tHB B(A2)
Timing Waveform of CEN Operation (1,2,3,4)
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
6.42 20
tCHZ tCD Q(A1) tCLZ tCDC Q(A1)
BW 1 - BW 4
OE tSD tHD D(A2)
DATAIN
DATAOUT
Q(A3)
5281 drw 09
NOTES: 1. Q (A1) represents the first output from the external address A1. D (A2) represents the input data to the SRAM corresponding to address A2. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. CEN when sampled high on the rising edge of clock will block that L-H transition of the clock from propogating into the SRAM. The part will behave as if the L-H clock transition did not occur. All internal registers in the SRAM will retain their previous state. 4. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM.
,
tCYC
CLK tSE tHE tCH tCL
C EN tHADV
tSADV
ADV/LD tSW tHW
R/W tSA tHA A2 A3 A4 tSC tHC A5
ADDRESS
A1
C E 1, C E 2 tSB tHB
(2)
Timing Waveform of CS Operation (1,2,3,4)
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
6.42 21
tCHZ tCD tCLZ Q(A1) tCDC Q(A2)
BW 1 - BW 4
OE tSD tHD D(A3)
DATAIN
DATAOUT
Q(A4)
5281 drw 10
NOTES: 1. Q (A1) represents the first output from the external address A1. D (A3) represents the input data to the SRAM corresponding to address A3. 2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH. 3. CEN when sampled high on the rising edge of clock will block that L-H transition of the clock from propogating into the SRAM. The part will behave as if the L-H clock transition did not occur. All internal registers in the SRAM will retain their previous state. 4. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information comes in two cycles before the actual data is presented to the SRAM.
,
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
JTAG Interface Specification (SA Version only)
tJF TCK tJCYC tJR
tJCL
tJCH
Device Inputs(1)/ TDI/TMS tJS Device Outputs(2)/ TDO tJH tJDC
tJRSR
tJCD x
M5281 drw 01
3 TRST( )
tJRST
NOTES: 1. Device inputs = All device inputs except TDI, TMS and TRST. 2. Device outputs = All device outputs except TDO. 3. During power up, TRST could be driven low or not be used since the JTAG circuit resets automatically. TRST is an optional JTAG reset.
JTAG AC Electrical Characteristics(1,2,3,4)
Symbol tJCYC tJCH tJCL tJR tJF tJRST tJRSR tJCD tJDC tJS tJH Parameter JTAG Clock Input Period JTAG Clock HIGH JTAG Clock Low JTAG Clock Rise Time JTAG Clock Fall Time JTAG Reset JTAG Reset Recovery JTAG Data Output JTAG Data Output Hold JTAG Setup JTAG Hold Min. 100 40 40
____ ____
Max.
____ ____ ____
Units ns ns ns ns ns ns ns ns ns ns ns
I5281 tbl 01
Scan Register Sizes
Register Name Instruction (IR) Bypass (BYR) JTAG Identification (JIDR) Boundary Scan (BSR) Bit Size 4 1 32 Note (1)
I5281 tbl 03
5(1) 5(1)
____ ____
50 50
____
20
____ ____
NOTE: 1. The Boundary Scan Descriptive Language (BSDL) file for this device is available by contacting your local IDT sales representative.
0 25 25
____
NOTES: 1. Guaranteed by design. 2. AC Test Load (Fig. 1) on external output signals. 3. Refer to AC Test Conditions stated earlier in this document. 4. JTAG operations occur at one speed (10MHz). The base device may run at any speed specified in this datasheet.
6.42 22
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
JTAG Identification Register Definitions (SA Version only)
Instruction Field Revision Number (31:28) IDT Device ID (27:12) IDT JEDEC ID (11:1) ID Register Indicator Bit (Bit 0) Value 0x2 0x208, 0x20A 0x33 1 Reserved for version number. Defines IDT part number 71V3556SA and 71V3558SA, respectively. Allows unique identification of device vendor as IDT. Indicates the presence of an ID register.
I5281 tbl 02
Description
Available JTAG Instructions
Instruction EXTEST Description Forces contents of the boundary scan cells onto the device o utputs (1). Places the boundary scan register (BSR) between TDI and TDO. Places the boundary scan register (BSR) between TDI and TDO. SAMPLE allows data from device inputs(2) and outputs(1) to be captured in the boundary scan cells and shifted serially through TDO. PRELOAD allows data to be input serially into the boundary scan cells via the TDI. Loads the JTAG ID register (JIDR) with the vendor ID code and places the register between TDI and TDO. Places the bypass register (BYR) between TDI and TDO. Forces all device o utput drivers to a High-Z state. OPCODE 0000
SAMPLE/PRELOAD
0001
DEVICE_ID HIGHZ RESERVED RESERVED RESERVED RESERVED CLAMP RESERVED RESERVED
0010 0011 0100
Several combinations are reserved. Do not use codes other than those identified for EXTEST, SAMPLE/PRELOAD, DEVICE_ID, HIGHZ, CLAMP, VALIDATE and BYPASS instructions.
0101 0110 0111
Uses BYR. Forces contents of the boundary scan cells onto the device outputs. Places the byp ass registe r (BYR) between TDI and TDO.
1000 1001 1010
Same as above. RESERVED RESERVED VALIDATE RESERVED BYPASS Automatically loaded into the instruction register whenever the TAP controller passes through the CAPTURE-IR state. The lower two bits '01' are mand ated by the IEEE std. 1149.1 specification. Same as above. The BYPASS instruction is used to truncate the boundary scan register as a single bit in length. 1011 1100 1101 1110 1111
I5281 tbl 04
NOTES: 1. Device outputs = All device outputs except TDO. 2. Device inputs = All device inputs except TDI, TMS, and TRST.
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IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
100-Pin Plastic Thin Quad Flatpack (TQFP) Package Diagram Outline
6.42 24
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
119 Ball Grid Array (BGA) Package Diagram Outline
6.42 25
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
6.42 26
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Timing Waveform of OE Operation (1)
OE tOE tOHZ tOLZ Valid
5281 drw 11
DATAOUT
,
NOTE: 1. A read operation is assumed to be in progress.
Ordering Information
IDT XXXX Device Type XX Power XX Speed XX Package X X
Process/ Process/ Temperature Temperature Range Range
Blank I
Commercial (0°C to +70°C) Industrial (-40°C to +85°C)
G PF** BG BQ 200* 166 133 100 S SA IDT71V3556 IDT71V3558
Restricted Hazardous Substance Device
,
100-pin Plastic Thin Quad Flatpack (TQFP) 119 Ball Grid Array (BGA) 165 Fine Pitch Ball Grid Array (fBGA)
Clock Frequency in Megahertz
Standard Power Standard Power with JTAG interface 128Kx36 Pipelined ZBT SRAM with 3.3V I/O 256Kx18 Pipelined ZBT SRAM with 3.3V I/O
5281 drw 12
* C o m m e rc ia l te m p e ra tu re ra n g e o n l y ** J T A G ( S A V e rs io n ) is n o t a va ila b le w ith 1 0 0 -p in T Q FP p a c k a g e
6.42 27
IDT71V3556, IDT71V3558, 128K x 36, 256K x 18, 3.3V Synchronous SRAMS with ZBT™ Feature, 3.3V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges
Datasheet Document History
6/30/99 8/23/99 Pg. 4, 5 Pg. 6 Pg. 14 Pg. 15 Updated to new format Added Smart ZBT functionality Added Note 4 and changed Pins 38, 42, and 43 to DNU Changed U2–U6 to DNU Added Smart ZBT AC Electrical Characteristics Improved tCD and tOE(MAX) at 166MHz Revised tCHZ(MIN) for f ≤ 133 MHz Revised tOHZ (MAX) for f ≤ 133 MHz Improved tCH, tCL for f ≤ 166 MHz Improved setup times for 100–200 MHz Added BGA package diagrams Added Datasheet Document History Revised AC Electrical Characteristics table Revised tCHZ to match tCLZ and tCDC at 133MHz and 100MHz Removed Smart functionality Added Industrial Temperature range offerings at the 100 to 166MHz speed grades. Insert clarification note to Recommended Operating Temperature and Absolute Max Ratings tables Add BGA capacitance table Add note to TQFP and BGA Pin Configurations; corrected typo in pinout Add 100pinTQFP package Diagram Outline Add new package offering, 13 x 15mm 165 fBGA Correct 119BGA Package Diagram Outline Add ZZ sleep mode reference note to BG119, PK100 and BQ165 pinouts Update BQ165 pinout Update BG119 package diagram outline dimensions Remove Preliminary status Add note to pin N5 on BQ165, reserved for JTAG TRST Added JTAG "SA" version functionality Updated pin configuration for the 119 BGA-reordered I/O signals on P6, P7 (128K x 36) and P7, N6, L6, K7, H6, G7, F6, E7, D6 (256K x 18). Adding "Restricted hazardous substance device" to ordering information.
10/4/99 12/31/99 04/30/00
Pg. 22 Pg. 24 Pg. 14 Pg. 15
Pg. 5, 6 Pg. 6 Pg. 5,6, 7 Pg. 21
05/26/00 07/26/00 Pg. 23 Pg. 5-8 Pg. 8 Pg. 23 Pg. 8 Pg. 1-8, 15,22,23,27 Pg. 7 Pg. 27
10/25/00 1/24/02 9/30 /04
CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054
for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com
for Tech Support: sramhelp@idt.com 800-544-7726
The IDT logo is a registered trademark of Integrated Device Technology, Inc. ZBT® and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola Inc.
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