IDT72201L12PFB

IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 CMOS SyncFIFO™ 64 X 9, 256 x 9, 512 x 9, 1024 X 9, 2048 X 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES Integrated Device Technology, Inc. IDT72421 IDT72201 IDT72211 IDT72221 IDT72231 IDT72241 FEATURES: • • • • • • • • • • • • • • • • • • 64 x 9-bit organization (IDT72421) 256 x 9-bit organization (IDT72201) 512 x 9-bit organization (IDT72211) 1024 x 9-bit organization (IDT72221) 2048 x 9-bit organization (IDT72231) 4096 x 9-bit organization (IDT72241) 12 ns read/write cycle time (IDT72421/72201/72211) 15 ns read/write cycle time (IDT72221/72231/72241) Read and write clocks can be independent Dual-Ported zero fall-through time architecture Empty and Full flags signal FIFO status Programmable Almost-Empty and Almost-Full flags can be set to any depth Programmable Almost-Empty and Almost-Full flags default to Empty+7, and Full-7, respectively Output enable puts output data bus in high-impedance state Advanced submicron CMOS technology Available in 32-pin plastic leaded chip carrier (PLCC), ceramic leadless chip carrier (LCC), and 32-pin Thin Quad Flat Pack (TQFP) For Through-Hole product please see the IDT72420/ 72200/72210/72220/72230/72240 data sheet Military product compliant to MIL-STD-883, Class B DESCRIPTION: T he IDT72421/72201/72211/72221/72231/72241 SyncFIFO™ are very high-speed, low-power First-In, First- Out (FIFO) memories with clocked read and write controls. The IDT72421/72201/72211/72221/72231/72241 have a 64, 256, 512, 1024, 2048, and 4096 x 9-bit memory array, respectively. These FIFOs are applicable for a wide variety of data buffering needs such as graphics, local area networks and interprocessor communication. These FIFOs have 9-bit input and output ports. The input port is controlled by a free-running clock (WCLK), and two write enable pins (WEN1, WEN2). Data is written into the Synchronous FIFO on every rising clock edge when the write enable pins are asserted. The output port is controlled by another clock pin (RCLK) and two read enable pins (REN1, REN2). The read clock can be tied to the write clock for single clock operation or the two clocks can run asynchronous of one another for dual-clock operation. An output enable pin (OE) is provided on the read port for three-state control of the output. The Synchronous FIFOs have two fixed flags, Empty (EF) and Full (FF). Two programmable flags, Almost-Empty (PAE) and Almost-Full (PAF), are provided for improved system control. The programmable flags default to Empty+7 and Full7 for PAE and PAF, respectively. The programmable flag offset loading is controlled by a simple state machine and is initiated by asserting the load pin (LD). The IDT72421/72201/72211/72221/72231/72241 are fabricated using IDT’s high-speed submicron CMOS technology. Military grade product is manufactured in compliance with the latest revision of MIL-STD-883, Class B. FUNCTIONAL BLOCK DIAGRAM WCLK D0 - D8 WEN1 WEN2 INPUT REGISTER LD OFFSET REGISTER WRITE CONTROL LOGIC RAM ARRAY 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9 FLAG LOGIC EF PAE PAF FF WRITE POINTER READ POINTER READ CONTROL LOGIC OUTPUT REGISTER RESET LOGIC RCLK RS REN1 REN2 OE Q0 - Q8 2655 drw 01 SyncFIFO is a trademark and the IDT logo is a registered trademark of Integrated Device Technology, Inc. MILITARY AND COMMERCIAL TEMPERATURE RANGES ©1996 Integrated Device Technology, Inc For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391. DECEMBER 1995 DSC-2655/6 5.07 1 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES PIN CONFIGURATION D2 D3 D4 D5 D6 D7 D8 RS D2 D3 D4 D5 D6 D7 INDEX 32 31 30 29 28 27 26 25 4 D1 5 6 7 8 9 10 11 12 13 24 23 22 21 20 19 18 17 WEN1 WCLK WEN2/LD VCC Q8 Q7 Q6 Q5 3 2 1 32 31 30 29 28 27 26 25 24 23 22 21 D8 INDEX RS WEN1 WCLK WEN2/LD VCC Q8 Q7 Q6 Q5 D1 D0 PAF PAE GND REN1 RCLK REN2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PR32-1 D0 PAF PAE GND REN1 RCLK REN2 OE J32-1 L32-1 14 15 16 17 18 19 20 EF FF Q3 Q0 Q1 Q2 Q4 OE EF FF Q0 Q1 Q2 Q3 Q4 2655 drw 02a TQFP TOP VIEW LCC/PLCC TOP VIEW 2655 drw 02 PIN DESCRIPTIONS RS Symbol D0-D8 Name Data Inputs Reset WCLK Write Clock Write Enable 1 WEN1 WEN2/LD Write Enable 2/ Load Q0-Q8 RCLK Data Outputs Read Clock Read Enable 1 Read Enable 2 Output Enable Empty Flag REN1 REN2 OE EF PAE PAF FF VCC GND Programmable Almost-Empty Flag Programmable O Almost-Full Flag Full Flag O Power Ground I/O Description I Data inputs for a 9-bit bus. I When RS is set LOW, internal read and write pointers are set to the first location of the RAM array, FF and PAF go HIGH, and PAE and EF go LOW. A reset is required before an initial WRITE after power-up. I Data is written into the FIFO on a LOW-to-HIGH transition of WCLK when the Write Enable(s) are asserted. I If the FIFO is configured to have programmable flags, WEN1 is the only write enable pin. When WEN1 is LOW, data is written into the FIFO on every LOW-to-HIGH transition WCLK. If the FIFO is configured to have two write enables, WEN1 must be LOW and WEN2 must be HIGH to write data into the FIFO. Data will not be written into the FIFO if the FF is LOW. I The FIFO is configured at reset to have either two write enables or programmable flags. If WEN2/ LD is HIGH at reset, this pin operates as a second write enable. If WEN2/LD is LOW at reset, this pin operates as a control to load and read the programmable flag offsets. If the FIFO is configured to have two write enables, WEN1 must be LOW and WEN2 must be HIGH to write data into the FIFO. Data will not be written into the FIFO if the FF is LOW. If the FIFO is configured to have programmable flags, WEN2/LD is held LOW to write or read the programmable flag offsets. O Data outputs for a 9-bit bus. I Data is read from the FIFO on a LOW-to-HIGH transition of RCLK when REN1 and REN2 are asserted. I When REN1 and REN2 are LOW, data is read from the FIFO on every LOW-to-HIGH transition of RCLK. Data will not be read from the FIFO if the EF is LOW. I When REN1 and REN2 are LOW, data is read from the FIFO on every LOW-to-HIGH transition of RCLK. Data will not be read from the FIFO if the EF is LOW. I When OE is LOW, the data output bus is active. If OE is HIGH, the output data bus will be in a high-impedance state. O When EF is LOW, the FIFO is empty and further data reads from the output are inhibited. When EF is HIGH, the FIFO is not empty. EF is synchronized to RCLK. O When PAE is LOW, the FIFO is almost empty based on the offset programmed into the FIFO. The default offset at reset is Empty+7. PAE is synchronized to RCLK. When PAF is LOW, the FIFO is almost full based on the offset programmed into the FIFO. The default offset at reset is Full-7. PAF is synchronized to WCLK. When FF is LOW, the FIFO is full and further data writes into the input are inhibited. When FF is HIGH, the FIFO is not full. FF is synchronized to WCLK. One +5 volt power supply pin. One 0 volt ground pin. 2655 tbl 01 5.07 2 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES ABSOLUTE MAXIMUM RATINGS(1) Symbol VTERM Rating Terminal Voltage with Respect to GND Operating Temperature Temperature Under Bias Storage Temperature DC Output Current Commercial –0.5 to +7.0 Military –0.5 to +7.0 Unit V RECOMMENDED OPERATING CONDITIONS Symbol VCCM VCCC Parameter Military Supply Voltage Commercial Supply Voltage Supply Voltage Input High Voltage Commercial Input High Voltage Military Input Low Voltage Commercial & Military Min. 4.5 4.5 0 2.0 2.2 — Typ. 5.0 5.0 0 — — — Max. 5.5 5.5 0 — — 0.8 Unit V V V V V V 2655 tbl 03 TA TBIAS TSTG IOUT 0 to +70 –55 to +125 –55 to +125 50 –55 to +125 –65 to +135 –65 to +135 50 °C °C GND VIH VIH °C VIL mA 2655 tbl 02 NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. CAPACITANCE (TA = +25°C, f = 1.0MHz) Symbol CIN(2) COUT (1,2) Parameter Input Capacitance Output Capacitance Conditions VIN = 0V VOUT = 0V Max. 10 10 Unit pF pF 2655 tbl 04 NOTES: 1. With output deselected (OE = HIGH). 2. Characterized values, not currently tested. DC ELECTRICAL CHARACTERISTICS (Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Military: VCC = 5V ± 10%, TA = -55°C to +125°C) IDT72421 IDT72201 IDT72211 Commercial tCLK = 12, 15, 20, 25,35, 50ns Min. Typ. Max. –1 –10 2.4 — — — — — — — 1 10 — 0.4 80 IDT72421 IDT72201 IDT72211 Military tCLK = 20, 25,35, 50ns Min. Typ. Max. –10 –10 2.4 — — — — — — — 10 10 — 0.4 100 Symbol ILI(1) ILO(2) VOH VOL ICC(3) Parameter Input Leakage Current (Any Input) Output Leakage Current Output Logic “1” Voltage, IOH = –2mA Output Logic “0” Voltage, IOL = 8mA Active Power Supply Current Unit µA µA V V mA 2655 tbl 05 Symbol ILI(1) ILO(2) VOH VOL ICC1(4) Parameter Input Leakage Current (Any Input) Output Leakage Current Output Logic “1” Voltage, IOH = –2mA Output Logic “0” Voltage, IOL = 8mA Active Power Supply Current IDT72221 IDT72231 IDT72241 Commercial tCLK = 15, 20, 25, 35, 50ns Min. Typ. Max. –1 –10 2.4 — — — — — — — 1 10 — 0.4 80 IDT72221 IDT72231 IDT72241 Military tCLK = 25, 35, 50ns Min. Typ. Max. –10 –10 2.4 — — — — — — — 10 10 — 0.4 100 Unit µA µA V V mA 2655 tbl 06 NOTES: 1. Measurements with 0.4 ≤ VIN ≤ VCC. 2. OE ≥ VIH, 0.4 ≤ VOUT ≤ VCC. 3 & 4. Measurements are made with outputs unloaded. Tested at fCLK = 20MHz. (3) Typical ICC1 = 30 + (fCLK*0.5/MHz) + (fCLK*CL*0.02/MHz-pF) mA (4) Typical ICC1 = 32 + (fCLK*0.6/MHz) + (fCLK*CL*0.02/MHz-pF) mA fCLK = 1/tCLK. CL = external capacitive load (30pF typical) 5.07 3 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES AC ELECTRICAL CHARACTERISTICS (Commercial: VCC = 5V ± 10%, TA = 0°C to + 70°C; Military: VCC = 5V ± 10%, TA = –55°C to +125°C) Com'l. 72421L12 72421L15 72201L12 72201L15 72211L12 72211L15 Symbol fS tA tCLK tCLKH tCLKL tDS tDH tENS tENH tRS tRSS tRSR tRSF tOLZ tOE tOHZ tWFF tREF tAF tAE tSKEW1 tSKEW2 Parameter Clock Cycle Frequency Data Access Time Clock Cycle Time Clock High Time Clock Low Time Data Set-up Time Data Hold Time Enable Set-up Time Enable Hold Time Reset Pulse Width(1) Reset Set-up Time Reset Recovery Time Reset to Flag and Output Time Output Enable to Output in Low-Z(2) Output Enable to Output Valid Output Enable to Output in High-Z(2) Write Clock to Full Flag Read Clock to Empty Flag Write Clock to Almost-Full Flag Read Clock to Almost-Empty Flag Skew time between Read Clock & Write Clock for Empty Flag &Full Flag Skew time between Read Clock & Write Clock for Almost-Empty Flag & Almost-Full Flag — 2 12 5 5 3 0 3 0 12 12 12 — 0 3 3 — — — — 5 22 83.3 8 — — — — — — — — — — 12 — 7 7 8 8 8 8 — — — 2 15 6 6 4 1 4 1 15 15 15 — 0 3 3 — — — — 6 28 66.7 10 — — — — — — — — — — 15 — 8 8 10 10 10 10 — — 72421L20 72201L20 72211L20 — 2 20 8 8 5 1 5 1 20 20 20 — 0 3 3 — — — — 8 35 50 12 — — — — — — — — — — 20 — 10 10 12 12 12 12 — — Commercial & Military 72421L25 72421L35 72201L25 72201L35 72211L25 72211L35 — 3 25 10 10 6 1 6 1 25 25 25 — 0 3 3 — — — — 10 40 40 15 — — — — — — — — — — 25 — 13 13 15 15 15 15 — — — 3 35 14 14 8 2 8 2 35 35 35 — 0 3 3 — — — — 12 42 28.6 20 — — — — — — — — — — 35 — 15 15 20 20 20 20 — — 72421L50 72201L50 72211L50 Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns — 3 50 20 20 10 2 10 2 50 50 50 — 0 3 3 — — — — 15 45 20 25 — — — — — — — — — — 50 — 28 28 30 30 30 30 — — Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. NOTES: 1. Pulse widths less than minimum values are not allowed. 2. Values guaranteed by design, not currently tested. 2655 tbl 07 5.07 4 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES AC ELECTRICAL CHARACTERISTICS (Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Military: VCC = 5V ± 10%, TA = –55°C to +125°C) Commercial Commercial and Military 72221L15 72221L20 72221L25 72221L35 72221L50 72231L15 72231L20 72231L25 72231L35 72231L50 72241L15 72241L20 72241L25 72241L35 72241L50 Symbol fS tA tCLK tCLKH tCLKL tDS tDH tENS tENH tRS tRSS tRSR tRSF tOLZ tOE tOHZ tWFF tREF tPAF tPAE Data Access Time Clock Cycle Time Clock HIGH Time Clock LOW Time Data Set-up Time Data Hold Time Enable Set-up Time Enable Hold Time Reset Pulse Width(1) Reset Set-up Time Reset Recovery Time Reset to Flag Time and Output Time Output Enable to Output in Low-Z(2) Output Enable to Output Valid Output Enable to Output in High-Z(2) Write Clock to Full Flag Read Clock to Empty Flag Write Clock to Programmable Almost-Full Flag Read Clock to Programmable Almost-Empty Flag Parameter Clock Cycle Frequency Min. Max. Min. Max. — 2 15 6 6 4 1 4 1 15 15 15 — 0 3 3 — — — — 6 28 66.7 10 — — — — — — — — — — 15 — 8 8 10 10 10 10 — — — 2 20 8 8 5 1 5 1 20 20 20 — 0 3 3 — — — — 8 35 50 12 — — — — — — — — — — 20 — 10 10 12 12 12 12 — — Min. Max. Min. Max. Min. Max. — 3 25 10 10 6 1 6 1 25 25 25 — 0 3 3 — — — — 10 40 40 15 — — — — — — — — — — 25 — 13 13 15 15 15 15 — — — 3 35 14 14 8 2 8 2 35 35 35 — 0 3 3 — — — — 12 42 28.6 20 — — — — — — — — — — 35 — 15 15 20 20 20 20 — — — 3 50 20 20 10 2 10 2 50 50 50 — 0 3 3 — — — — 15 45 20 25 — — — — — — — — — — 50 — 28 28 30 30 30 30 — — Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns tSKEW1 Skew Time Between Read Clock and Write Clock for Empty Flag and Full Flag tSKEW2 Skew Time Between Read Clock and Write Clock for Programmable Almost-Empty Flag and Programmable Almost-Full Flag NOTES: 1. Pulse widths less than minimum values are not allowed. 2. Values guaranteed by design, not currently tested. 2655 tbl 08 5V 1.1K D.U.T. AC TEST CONDITIONS In Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.0V 3ns 1.5V 1.5V See Figure 1 2655 tbl 09 680Ω 30pF* 2655 drw 03 or equivalent circuit Figure 1. Output Load *Includes jig and scope capacitances. 5.07 5 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES SIGNAL DESCRIPTIONS INPUTS: Data In (D0 - D8) — Data inputs for 9-bit wide data. CONTROLS: Reset (RS) — Reset is accomplished whenever the Reset (RS) input is taken to a LOW state. During reset, both internal read and write pointers are set to the first location. A reset is required after power-up before a write operation can take place. The Full Flag (FF) and Programmable Almost-Full Flag (PAF) will be reset to HIGH after tRSF. The Empty Flag (EF) and Programmable Almost-Empty Flag (PAE) will be reset to LOW after tRSF. During reset, the output register is initialized to all zeros and the offset registers are initialized to their default values. Write Clock (WCLK) — A write cycle is initiated on the LOW-to-HIGH transition of the write clock (WCLK). Data setup and hold times must be met in respect to the LOW-to-HIGH transition of the write clock (WCLK). The Full Flag (FF) and Programmable Almost-Full Flag (PAF) are synchronized with respect to the LOW-to-HIGH transition of the write clock (WCLK). The write and read clocks can be asynchronous or coincident. Write Enable 1 (WEN1) — If the FIFO is configured for programmable flags, Write Enable 1 (WEN1) is the only enable control pin. In this configuration, when Write Enable 1 (WEN1) is low, data can be loaded into the input register and RAM array on the LOW-to-HIGH transition of every write clock (WCLK). Data is stored in the RAM array sequentially and independently of any on-going read operation. In this configuration, when Write Enable 1 (WEN1) is HIGH, the input register holds the previous data and no new data is allowed to be loaded into the register. If the FIFO is configured to have two write enables, which allows for depth expansion, there are two enable control pins. See Write Enable 2 paragraph below for operation in this configuration. To prevent data overflow, the Full Flag (FF) will go LOW, inhibiting further write operations. Upon the completion of a valid read cycle, the Full Flag (FF) will go HIGH after tWFF, allowing a valid write to begin. Write Enable 1 (WEN1) is ignored when the FIFO is full. Read Clock (RCLK) — Data can be read on the outputs on the LOW-to-HIGH transition of the read clock (RCLK). The Empty Flag (EF) and Programmable Almost-Empty Flag (PAE) are synchronized with respect to the LOW-to-HIGH transition of the read clock (RCLK). The write and read clocks can be asynchronous or coincident. Read Enables (REN1, REN2) — When both Read Enables REN2 (REN1, REN2) are LOW, data is read from the RAM array to the output register on the LOW-to-HIGH transition of the read clock (RCLK). When either Read Enable (REN1, REN2) is HIGH, the output register holds the previous data and no new data is allowed to be loaded into the register. When all the data has been read from the FIFO, the Empty Flag (EF) will go LOW, inhibiting further read operations. Once a valid write operation has been accomplished, the Empty Flag (EF) will go HIGH after tREF and a valid read can begin. The Read Enables (REN1, REN2) are ignored when the FIFO is empty. Output Enable (OE) — When Output Enable (OE) is enabled (LOW), the parallel output buffers receive data from the output register. When Output Enable (OE) is disabled (HIGH), the Q output data bus is in a high-impedance state. Write Enable 2/Load (WEN2/LD) — This is a dualpurpose pin. The FIFO is configured at Reset to have programmable flags or to have two write enables, which allows depth expansion. If Write Enable 2/Load (WEN2/LD) is set high at Reset (RS = LOW), this pin operates as a second write enable pin. If the FIFO is configured to have two write enables, when Write Enable (WEN1) is LOW and Write Enable 2/Load (WEN2/ LD) is HIGH, data can be loaded into the input register and RAM array on the LOW-to-HIGH transition of every write clock (WCLK). Data is stored in the RAM array sequentially and independently of any on-going read operation. In this configuration, when Write Enable (WEN1) is HIGH and/or Write Enable 2/Load (WEN2/LD) is LOW, the input register holds the previous data and no new data is allowed to be loaded into the register. To prevent data overflow, the Full Flag (FF) will go LOW, inhibiting further write operations. Upon the completion of a valid read cycle, the Full Flag (FF) will go HIGH after tWFF, allowing a valid write to begin. Write Enable 1 (WEN1) and Write Enable 2/Load (WEN2/LD) are ignored when the FIFO is full. The FIFO is configured to have programmable flags when the Write Enable 2/Load (WEN2/LD) is set LOW at Reset (RS=low). The IDT72421/72201/72211/72221/72231/72241 devices contain four 8-bit offset registers which can be loaded with data on the inputs, or read on the outputs. See Figure 3 for details of the size of the registers and the default values. If the FIFO is configured to have programmable flags when the Write Enable 1 (WEN1) and Write Enable 2/Load (WEN2/ LD) are set low, data on the inputs D is written into the Empty (Least Significant Bit) offset register on the first LOW-to-HIGH transition of the write clock (WCLK). Data is written into the Empty (Most Significant Bit) offset register on the second LOW-to-HIGH transition of the write clock (WCLK), into the Full (Least Significant Bit) offset register on the third transition, and into the Full (Most Significant Bit) offset register on the fourth transition. The fifth transition of the write clock (WCLK) again writes to the Empty (Least Significant Bit) offset register. 5.07 6 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES However, writing all offset registers does not have to occur at one time. One or two offset registers can be written and then by bringing the Write Enable 2/Load (WEN2/LD) pin HIGH, the FIFO is returned to normal read/write operation. When the Write Enable 2/Load (WEN2/LD) pin is set LOW, and Write Enable 1 (WEN1) is LOW, the next offset register in sequence is written. The contents of the offset registers can be read on the output lines when the Write Enable 2/Load (WEN2/LD) pin is set low and both Read Enables (REN1, REN2) are set LOW. Data can be read on the LOW-to-HIGH transition of the read clock (RCLK). A read and write should not be performed simultaneously to the offset registers. LD 0 WEN1 0 WCLK(1) Selection Empty Offset (LSB) Empty Offset (MSB) Full Offset (LSB) Full Offset (MSB) No Operation Write Into FIFO No Operation 0 1 1 1 0 1 NOTE: 2655 drw 04 1. The same selection sequence applies to reading from the registers. REN1 and REN2 are enabled and read is performed on the LOW-to-HIGH transition of RCLK. Figure 2. Write Offset Register 8 72421 - 64 x 9-BIT 65 0 Empty Offset (LSB) Reg. Default Value 007H 72201 - 256 x 9-BIT 8 7 Empty Offset (LSB) Reg. Default Value 007H 0 8 7 72211 - 512 x 9-BIT 0 Empty Offset (LSB) Default Value 007H 0 8 1 (MSB) 0 0 8 0 8 8 65 Full Offset (LSB) Reg. Default Value 007H 0 8 7 Full Offset (LSB) Reg. Default Value 007H 0 8 7 Full Offset (LSB) Default Value 007H 0 8 0 8 0 8 1 (MSB) 0 0 72221 - 1024 x 9-BIT 8 7 Empty Offset (LSB) Reg. Default Value 007H 8 1 (MSB) 00 8 7 Full Offset (LSB) Reg. Default Value 007H 8 1 (MSB) 00 0 8 0 8 7 0 8 0 8 7 72231 - 2048 x 9-BIT 0 Empty Offset (LSB) Reg. Default Value 007H 2 (MSB) 000 0 Full Offset (LSB) Reg. Default Value 007H 2 (MSB) 000 Figure 3. Offset Register Location and Default Values 72241 - 4096 x 9-BIT 8 7 Empty Offset (LSB) Default Value 007H 0 8 3 (MSB) 0000 8 7 Full Offset (LSB) Default Value 007H 0 8 3 (MSB) 0000 0 0 0 0 2655 drw 05 5.07 7 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES OUTPUTS: Full Flag (FF) — The Full Flag (FF) will go LOW, inhibiting further write operation, when the device is full. If no reads are performed after Reset (RS), the Full Flag (FF) will go LOW after 64 writes for the IDT72421, 256 writes for the IDT72201, 512 writes for the IDT72211, 1024 writes for the IDT72221, 2048 writes for the IDT72231, and 4096 writes for the IDT72241. The Full Flag (FF) is synchronized with respect to the LOWto-HIGH transition of the write clock (WCLK). Empty Flag (EF) — The Empty Flag (EF) will go LOW, inhibiting further read operations, when the read pointer is equal to the write pointer, indicating the device is empty. The Empty Flag (EF) is synchronized with respect to the LOW-to-HIGH transition of the read clock (RCLK). Programmable Almost-Full Flag ( PAF ) — T he Programmable Almost-Full Flag (PAF) will go LOW when the FIFO reaches the Almost-Full condition. If no reads are performed after Reset (RS), the Programmable Almost-Full Flag (PAF) will go LOW after (64-m) writes for the IDT72421, (256-m) writes for the IDT72201, (512-m) writes for the IDT72211, (1024-m) writes for the IDT72221, (2048-m) writes for the IDT72231, and (4096-m) writes for the IDT72241. The offset “m” is defined in the Full offset registers. If there is no Full offset specified, the Programmable Almost-Full Flag (PAF) will go LOW at Full-7 words. The Programmable Almost-Full Flag (PAF) is synchronized with respect to the LOW-to-HIGH transition of the write clock (WCLK). Programmable Almost-Empty Flag (PAE) — T he Programmable Almost-Empty Flag (PAE) will go LOW when the read pointer is "n+1" locations less than the write pointer. The offset "n" is defined in the Empty offset registers. If no reads are performed after Reset the Programmable AlmostEmpty Flag (PAE) will go HIGH after "n+1" for the IDT72421/ 72201/72211/72221/72231/72241. If there is no Empty offset specified, the Programmable Almost-Empty Flag (PAE) will go LOW at Empty+7 words. The Programmable Almost-Empty Flag ( PAE ) is synchronized with respect to the LOW-to-HIGH transition of the read clock (RCLK). Data Outputs (Q0 - Q8) — Data outputs for a 9-bit wide data. TABLE 1: STATUS FLAGS 72421 0 1 to n (1) (n+1) to (64-(m+1)) (2) (64-m) to 63 64 NUMBER OF WORDS IN FIFO 72201 0 1 to n (1) (n+1) to (256-(m+1)) (256-m)(2) to 255 256 72211 0 1 to n (1) (n+1) to (512-(m+1)) (2) (512-m) to 511 512 FF H H H H L PAF H H H L L PAE L L H H H EF L H H H H 2655 tbl 10 NUMBER OF WORDS IN FIFO 72221 0 1 to n(1) (n+1) to (1024-(m+1)) (1024-m)(2) to 1023 1024 NOTES: 1. n = Empty Offset (n = 7 default value) 2. m = Full Offset (m = 7 default value) 72231 0 1 to n(1) (n+1) to (2048-(m+1)) (2048-m)(2) to 2047 2048 72241 0 1 to n(1) (n+1) to (4096-(m+1)) (4096-m)(2) to 4095 4096 FF H H H H L PAF H H H L L PAE L L H H H EF L H H H H 2655 tbl 11 5.07 8 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES tRS RS tRSS tRSR REN1, REN2 tRSS tRSR WEN1 tRSS WEN2/LD (1) tRSR tRSF EF, PAE tRSF FF, PAF tRSF Q0 - Q8 OE = 1 OE = 0 (2) 2655 drw 06 NOTES: 1. Holding WEN2/LD HIGH during reset will make the pin act as a second write enable pin. Holding WEN2/LD LOW during reset will make the pin act as a load enable for the programmable flag offset registers. 2. After reset, the outputs will be LOW if OE = 0 and tri-state if OE = 1. 3. The clocks (RCLK, WCLK) can be free-running during reset. Figure 4. Reset Timing 5.07 9 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES tCLK tCLKH WCLK tDH tDS D0 - D 8 DATA IN VALID tENS tENH NO OPERATION tCLKL WEN1 WEN2/ (If Applicable) tWFF tWFF NO OPERATION FF tSKEW1(1) RCLK REN1, REN2 2655 drw 07 NOTE: 1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge for FF to change during the current clock cycle. If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW1, then EF may not change state until the next RCLK edge. Figure 5. Write Cycle Timing 5.07 10 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES tCLK tCLKH RCLK tENH tCLKL REN1, REN2 tENS NO OPERATION tREF tREF EF tA Q0 - Q8 tOLZ tOHZ tOE VALID DATA OE tSKEW1 (1) WCLK WEN1 WEN2 2655 drw 08 NOTE: 1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge for EF to change during the current clock cycle. If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW1, then EF may not change state until the next RCLK edge. Figure 6. Read Cycle Timing Figure 6. Read Cycle Timing 5.07 11 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES WCLK tDS D0 - D8 D0 (First Valid tENS D1 D2 D3 WEN1 WEN2 (If Applicable) tFRL (1) tSKEW1 RCLK tREF EF REN1, REN2 tA Q 0 - Q8 tOLZ tOE D0 tA D1 OE 2655 drw 09 NOTE: 1. When tSKEW1 ≥ minimum specification, tFRL = tCLK + tSKEW1 When tSKEW1 < minimum specification, tFRL = 2tCLK + tSKEW1 or tCLK + tSKEW1 The Latency Timings apply only at the Empty Boundary (EF = LOW). Figure 7. First Data Word Latency Timing 5.07 12 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES NO WRITE WCLK tSKEW1 D0 - D8 tWFF tWFF tDS NO WRITE tSKEW1 tDS DATA WRITE tWFF FF WEN1 WEN2 (If Applicable) RCLK tENS tENH tENS tENH REN1, REN2 LOW tA OE tA Q0 - Q8 DATA IN OUTPUT REGISTER DATA READ NEXT DATA READ 2655 drw 10 Figure 8. Full Flag Timing 5.07 13 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES WCLK tDS tDS D 0 - D8 tENS DATA WRITE 1 tENH tENS DATA WRITE 2 tENH WEN1 tENS WEN2 (If Applicable) tSKEW1 RCLK tREF tREF tREF tENH tENS tENH tFRL(1) tSKEW1 tFFL (1) EF REN1, REN2 OE LOW tA Q 0 - Q8 DATA IN OUTPUT REGISTER DATA READ 2655 drw 11 NOTE: 1. When tSKEW1 ≥ minimum specification, tFRL maximum = tCLK + tSKEW1 When tSKEW1 < minimum specification, tFRL maximum = 2tCLK + tSKEW1 or tCLK + tSKEW1 The Latency Timings apply only at at the Empty Boundary (EF = LOW). Figure 9. Empty Flag Timing 5.07 14 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES tCLKH WCLK tCLKL (4) tENS tENH WEN1 tENS WEN2 (If Applicable) tPAF (1) tENH PAF Full - (m+1) words in FIFO Full - m words in FIFO(2) tSKEW2 (3) tPAF RCLK REN1, REN2 tENS tENH 2655 drw 12 NOTES: 1. PAF offset = m. 2. 64 - m words in for IDT72421, 256 - m words in FIFO for IDT72201, 512 - m words for IDT72211, 1024 - m words for IDT72221, 2048 - m words for IDT72231, 4096 - m words for IDT72241. 3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge for PAF to change during that clock cycle. If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW2, then PAF may not change state until the next WCLK rising edge. 4. If a write is performed on this rising edge of the write clock, there will be Full - (m-1) words in the FIFO when PAF goes LOW. Figure 10. Programmable Full Flag Timing 5.07 15 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES tCLKH WCLK tCLKL tENS tENH WEN1 tENS WEN2 (If Applicable) tENH (1) PAE n words in FIFO tSKEW2 (2) tPAE n+1 words in FIFO tPAE (3) RCLK REN1, REN2 tENS tENH 2655 drw 13 NOTES: 1. PAE offset = n. 2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge for PAE to change during that clock cycle. If the time between the rising edge of WCLK and the rising edge of RCLK is less than tSKEW2, then PAE may not change state until the next RCLK rising edge. 3. If a read is performed on this rising edge of the read clock, there will be Empty + (n-1) words in the FIFO when PAE goes LOW. Figure 11. Programmable Empty Flag Timing 5.07 16 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES tCLK tCLKH WCLK tENS tENH tCLKL LD tENS WEN1 tDS tDH D 0 - D7 PAE OFFSET (LSB) PAE OFFSET (MSB) PAF OFFSET (LSB) PAF OFFSET (MSB) 2655 drw 14 Figure 12. Write Offset Registers Timing tCLK tCLKH RCLK tENS tENH tCLKL LD tENS REN1, REN2 tA Q0 - Q7 DATA IN OUTPUT REGISTER EMPTY OFFSET (LSB) EMPTY OFFSET (MSB) FULL OFFSET (LSB) FULL OFFSET (MSB) 2655 drw 15 Figure 13. Read Offset Registers Timing 5.07 17 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES OPERATING CONFIGURATIONS SINGLE DEVICE CONFIGURATION - A single IDT72421/ 72201/72211/72221/72231/72241 may be used when the application requirements are for 64/256/512/1024/2048/4096 words or less. When the IDT72421/72201/72211/72221/ 72231/72241 are in a Single Device Configuration, the Read Enable 2 (REN2) control input can be grounded (see Figure 14). In this configuration, the Write Enable 2/Load (WEN2/LD) pin is set LOW at Reset so that the pin operates as a control to load and read the programmable flag offsets. RESET (RS) WRITE CLOCK (WCLK) WRITE ENABLE 1 (WEN1) WRITE ENABLE 2/LOAD (WEN2/LD) DATA IN (D0 - D8) PROGRAMMABLE ALMOST FULL (PAF) FULL FLAG (FF) IDT 72421/ 72201/ 72211/72221/ 72231/ 72241 READ CLOCK (RCLK) READ ENABLE 1 (REN1) OUTPUT ENABLE (OE) DATA OUT (Q0 - Q8) EMPTY FLAG (EF) PROGRAMMABLE ALMOST EMPTY (PAE) 2655 drw 16 READ ENABLE 2 (REN2) Figure 14. Block Diagram of Single 64 x 9/256 x 9/512 x 9/1024 x 9/2048 x 9/4096 x 9 Synchronous FIFO WIDTH EXPANSION CONFIGURATION - Word width may be increased simply by connecting the corresponding input controls signals of multiple devices. A composite flag should be created for each of the end-point status flags (EF and FF). The partial status flags (AE and AF) can be detected from any one device. Figure 15 demonstrates a 18-bit word width by using two IDT72421/72201/72211/72221/72231/72241s. Any word width can be attained by adding additional IDT72421/ 72201/72211/72221/72231/72241s. When the IDT72421/72201/72211/72221/72231/72241 are in a Width Expansion Configuration, the Read Enable 2 (REN2) control input can be grounded (see Figure 15). In this configuration, the Write Enable 2/Load (WEN2/LD) pin is set LOW at Reset so that the pin operates as a control to load and read the programmable flag offsets. RESET (RS) DATA IN (D) 18 9 9 RESET (RS) READ CLOCK (RCLK) WRITE CLOCK (WCLK) WRITE ENABLE1 (WEN1) WRITE ENABLE2/LOAD (WEN2/LD) FULL FLAG (FF) #2 FULL FLAG (FF) #1 IDT 72421/ 72201/ 72211/ 72221/ 72231/ 72241 IDT 72421/ 72201/ 72211/ 72221/ 72231/ 72241 READ ENABLE (REN) PROGRAMMABLE (PAE) EMPTY FLAG (EF) #1 EMPTY FLAG (EF) #2 9 DATA OUT (Q) OUTPUT ENABLE (OE) PROGRAMMABLE (PAF) 9 18 READ ENABLE 2 (REN2) READ ENABLE 2 (REN2) 2655 drw 17 Figure 15. Block Diagram of 64 x 18/256 x 18/512 x 18/1024 x 18/2048 x 18/4096 x 18 Synchronous FIFO Used in a Width Expansion Configuration 5.07 18 IDT72421/72201/72211/72221/72231/72241 CMOS SyncFIFO™ 64 x 9, 256 x 9, 512 x 9, 1024 x 9, 2048 x 9 and 4096 x 9 MILITARY AND COMMERCIAL TEMPERATURE RANGES DEPTH EXPANSION - The IDT72421/7221/72211/72221/ 72231/72241 can be adapted to applications when the requirements are for greater than 64/256/512/1024/2048/4096 words. The existence of two enable pins on the read and write port allow depth expansion. The Write Enable 2/Load pin is used as a second write enable in a depth expansion configuration thus the Programmable flags are set to the default values. Depth expansion is possible by using one enable input for system control while the other enable input is controlled by expansion logic to direct the flow of data. A typical application would have the expansion logic alternate data access from one device to the next in a sequential manner. The IDT72421/7221/72211/72221/72231/72241 operates in the Depth Expansion configuration when the following conditions are met: 1. The WEN2/ LD pin is held HIGH during Reset so that this pin operates a second Write Enable. 2. External logic is used to control the flow of data. Please see the Applicatioin Note" DEPTH EXPANSION OF IDT'S SYNCHRONOUS FIFOs USING THE RING COUNTER APPROACH" for details of this configuration. ORDERING INFORMATION IDT XXXXX Device Type X Power XX Speed X Package X Process/ Temperature Range BLANK Commercial (0°C to +70°C) Military (–55°C to +125°C) B Compliant to MIL-STD-883, Class B J L PF 12 15 20 25 35 50 L 72421 72201 72211 72221 Plastic Leaded Chip Carrier (PLCC) Leadless Chip Carrier (LCC) Thin Quad Flat Pack (TQFP) Com'l. (72421/72201/72211) Only Com'l. Only All except 72221/72231/72241 Military Clock Cycle Time (tCLK) Speed in ns Low Power 64 x 9 Synchronous FIFO 256 x 9 Synchronous FIFO 512 x 9 Synchronous FIFO 1024 x 9 Synchronous FIFO 2048 x 9 Synchronous FIFO 4096 x 9 Synchronous FIFO 2655 drw 18 5.07 19