IDT72V70200PF

3.3 VOLT TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 .EATURES: • • • • • • • • • • • • IDT72V70200 512 x 512 channel non-blocking switching at 2.048 Mb/s Per-channel variable or constant throughput delay Automatic identification of ST-BUS®/GCI interfaces Accept 16 serial data streams of 2.048 Mb/s Automatic frame offset delay measurement Per-stream frame delay offset programming Per-channel high impedance output control Per-channel Processor Mode Control interface compatible to Intel/Motorola CPUs Connection memory block programming IEEE-1149.1 (JTAG) Test Port Available in 84-pin Plastic Leaded Chip Carrier (PLCC), • • 100-pin Ball Grid Array (BGA), 100-pin Plastic Quad Flatpack (PQFP) and 100-pin Thin Quad Flatpack (TQFP) 3.3V Power Supply Operating Temperature Range -40°C to +85°C DESCRIPTION: The IDT72V70200 is a non-blocking digital switch that has a capacity of 512 x 512 channels at 2.048 Mb/s. Some of the main features are: programmable stream and channel control, Processor Mode, input offset delay and highimpedance output control. Per-stream input delay control is provided for managing large multi-chip switches that transport both voice channel and concatenated data channels. In addition, input streams can be individually calibrated for input frame offset. .UNCTIONAL BLOCK DIAGRAM VCC GND RESET TMS TDI TDO TCK TRST IC ODE Test Port RX0 RX1 RX2 RX3 RX4 RX5 RX6 RX7 RX8 RX9 RX10 RX11 RX12 RX13 RX14 RX15 TX0 TX1 TX2 TX3 TX4 TX5 TX6 TX7 TX8 TX9 TX10 TX11 TX12 TX13 TX14 TX15 Loopback Receive Serial Data Streams Data Memory Output MUX Transmit Serial Data Streams Internal Registers Connection Memory Timing Unit Microprocessor Interface CLK F0i FE IC AS/ IM DS/ RD ALE CS R/W/ A0-A7 DTA D8-D15/ WR AD0-AD7 CCO 5711 drw01 IDT, the IDT logo are registered trademarks of Integrated Device Technology, Inc. AUGUST 2001 1 DSC-5711/3  2001 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE PIN CON.IGURATIONS A RX0 A1 BALL PAD CORNER TX13 TX11 TX10 RX1 TX14 TX12 RX4 RX8 RX9 RX3 RX6 VCC TX8 TX9 TX7 TX6 VCC GND TX4 TX5 DNC VCC TX3 TX2 TX1 DTA TX0 ODE D15 D13 D10 AD7 AD6 AD2 CCO D14 D12 D11 D9 D8 AD5 AD3 AD0 B RX2 C RX5 TX15 VCC VCC GND GND GND VCC GND GND D RX7 E RX10 GND GND VCC GND GND VCC CS VCC AD4 AD1 F RX11 RX12 VCC G RX13 RX15 CLK GND GND VCC A4 A3 H RX14 FE TDI TDO TCK RESET VCC TRST IC A0 IC A1 A2 J K F0i TMS A7 R/W/RW IM A5 A6 DS/RD AS/ALE 1 2 3 4 5 6 7 8 9 10 5711 drw02 BGA: 1mm pitch, 11mm x 11mm (BC100-1, order code: BC) TOP VIEW TX15 TX14 TX13 TX12 TX11 TX10 GND GND GND ODE VCC TX9 TX8 TX7 TX6 TX5 TX4 TX3 TX2 TX1 INDEX RX0 RX1 RX2 RX3 RX4 RX5 RX6 RX7 RX8 RX9 RX10 RX11 RX12 RX13 RX14 RX15 F0i FE GND CLK VCC 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 TX0 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 CCO DTA D15 D14 D13 D12 D11 D10 D9 D8 GND VCC AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 GND 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 R/W/RW CS TMS TDO TCK TRST IC RESET TDI A0 A1 A2 A3 A4 A5 A6 A7 AS/ALE DS/RD IM 5711 drw03 NOTES: PLCC: 0.05in. pitch, 1.15in. x 1.15in. (PL84-1, order code: J) 1. DNC - Do Not Connect TOP VIEW 2. IC - Internal Connection, tie to GROUND for normal operation. 3. All I/O pins are 5V tolerant except for TMS, TDI and TRST. IC 2 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE PIN CON.IGURATIONS (CONTINUED) TX12 TX15 TX14 TX11 TX13 TX10 DNC GND DNC GND GND ODE DNC 52 DNC 51 VCC TX5 TX7 TX4 TX3 TX9 TX6 TX2 TX8 TX1 TX0 66 57 75 71 62 70 61 74 65 69 60 59 56 68 73 64 55 72 63 DNC DNC RX0 RX1 RX2 RX3 RX4 RX5 RX6 RX7 RX8 RX9 RX10 RX11 RX12 RX13 RX14 RX15 F0i FE/HCLK GND CLK VCC DNC DNC 76 77 78 79 90 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 67 58 54 53 DNC DNC CCO DTA D15 D14 D13 D12 D11 D10 D9 D8 GND VCC AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 GND DNC DNC 18 14 23 15 10 19 11 20 24 16 12 21 13 A0 A1 A4 A5 17 4 22 3 7 R/W/RW CS DS/RD IM DNC A2 A3 A6 A7 TRST DNC DNC TMS TDI INDEX AS/ALE RESET DNC TDO TCK IC IC 25 8 5 1 2 6 9 5711 drw04 TQFP: 0.50mm pitch, 14mm x 14mm (PN100-1, order code: PF) TOP VIEW TX13 TX12 TX15 TX11 TX14 TX10 TX9 GND GND GND CCO DNC DNC ODE DNC 53 DNC DNC 52 DNC DNC TX8 VCC TX7 TX6 TX2 61 TX1 55 64 73 78 69 60 77 68 59 72 63 62 71 80 76 67 58 75 79 70 66 57 74 65 56 54 51 DNC TX5 TX4 TX3 TX0 RX0 RX1 RX2 RX3 RX4 RX5 RX6 RX7 RX8 RX9 RX10 RX11 RX12 RX13 RX14 RX15 F0i FE GND CLK 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 DTA D15 D14 D13 D12 D11 D10 D9 D8 GND VCC AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 GND 23 24 10 28 11 20 25 26 29 21 22 12 13 17 14 15 18 A0 16 A4 DNC TDI TDO A5 19 9 27 3 4 8 CS AS/ALE IM DNC DNC DNC DNC DNC TRST IC RESET DS/RD INDEX R/W/WR DNC VCC DNC A1 A6 A2 TMS TCK IC A3 A7 30 5 1 2 6 7 5711 drw05 PQFP: 0.65mm pitch, 14mm x 20mm (PQ100-2, order code: PQF) TOP VIEW 3 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE PIN DESCRIPTION SYMBOL GND Vcc TX0-15(1) RX0-15(1) F0i(1) FE(1) CLK(1) TMS TDI TDO TCK(1) TRST NAME Ground. Vcc TX Output 0 to 15 (Three-state Outputs) RX Input 0 to 15 Frame Pulse Frame Evaluation Clock Test Mode Select Test Serial Data In Test Serial Data Out Test Clock Test Reset I/O DESCRIPTION Ground Rail. +3.3 Volt Power Supply. Serial data output stream. These streams have a data rate of 2.048 Mb/s. Serial data input stream. These streams have a data rate of 2.048 Mb/s. This input accepts and automatically identifies frame synchronization signals formatted according to ST-BUS® and GCI specifications. This pin is the frame measurement input. Serial clock for shifting data in/out on the serial streams (RX/TX 0-15). This input accepts a 4.096 MHz clock. JTAG signal that controls the state transitions of the TAP controller. This pin is pulled HIGH by an internal pullup when not driven. JTAG serial test instructions and data are shifted in on this pin. This pin is pulled HIGH by an internal pull-up when not driven. JTAG serial data is output on this pin on the falling edge of TCK. This pin is held in high-impedance state when JTAG scan is not enabled. Provides the clock to the JTAG test logic. Asynchronously initializes the JTAG TAP controller by putting it in the Test-Logic-reset state. This pin is pulled by an internal pull-up when not driven. This pin should be pulsed LOW on power-up, or held LOW, to ensure that the IDT72V70200 is in the normal functional mode. O I I I I I I O I I IC(1) RESET(1) Internal Connection Device Reset (Schmitt Trigger Input) I I Connect to GND for normal operation. This pin must be LOW for the IDT72V70200 to function normally and to comply with IEEE 1114 (JTAG) boundary scan requirements. This input (active LOW) puts the IDT72V70200 in its reset state that clears the device internal counters, registers and brings TX0-15 and microport data outputs to a high-impedance state. The time constant for a power up reset circuit must be a minimum of five times the rise time of the power supply. In normal operation, the RESET pin must be held LOW for a minimum of 100ns to reset the device. When non-multiplexed CPU bus operation is selected, these lines provide the A0-A7 address lines to the internal memories. For Motorola multiplexed bus operation, this input is DS. This active HIGH DS input works in conjunction with CS to enable the read and write operations. For Motorola non-multiplexed CPU bus operation, this input is DS. This active LOW input works in conjunction with CS to enable the read and write operations. For Intel multiplexed bus operation, this input is RD. This active LOW input sets the data bus lines (AD0-7, D8-15) as outputs. In the cases of Motorola non-multiplexed and multiplexed bus operations, this input is R/W. This input controls the direction of the data bus lines (AD0-7, D8-15) during a microprocessor access. For Intel multiplexed bus operation, this input is WR. This active LOW input is used with RD to control the data bus (AD0-7) lines as inputs. Active LOW input used by a microprocessor to activate the microprocessor port of IDT72V70200. This input is used if multiplexed bus operation is selected via the IM input pin. For Motorola non-multiplexed bus operation, connect this pin to ground. When IM is HIGH, the microprocessor port is in the multiplexed mode. When IM is LOW, the microprocessor port is in non-multiplexed mode. These pins are the eight least significant data bits of the microprocessor port. In multiplexed mode, these pins are also the input address bits of the microprocessor port. These pins are the eight most significant data bits of the microprocessor port. This active LOW output signal indicates that a data bus transfer is complete. When the bus cycle ends, this pin drives HIGH and then goes high-impedance, allowing for faster bus cycles with a weaker pull-up resistor. A pull-up resistor is required to hold a HIGH level when the pin is in high-impedance. This is a 4.096 Mb/s output containing 512 bits per frame respectively. The level of each bit is determined by the CCO bit in the connection memory. See External Drive Control Section. This is the output enable control for the TX0 to TX15 serial outputs. When ODE input is LOW and the OSB bit of the IMS register is LOW, TX0-15 are in a high-impedance state. If this input is HIGH, the TX0-15 output drivers are enabled. However, each channel may still be put into a high-impedance state by using the per channel control bit in the connection memory. A0-7(1) DS/RD(1) Address 0-7 Data Strobe/Read I I R/W / WR(1) Read/Write / Write I CS(1) AS/ALE(1) IM(1) AD0-7(1) D8-15(1) DTA(1) Chip Select Address Strobe or Latch Enable CPU Interface Mode I I I Address/Data Bus 0 to 7 I/O Data Bus 8-15 Data Transfer Acknowledgment Control Output Output Drive Enable I/O O CCO(1) ODE(1) O I NOTE: 1. These pins are 5V tolerant. 4 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE .UNCTIONAL DESCRIPTION The IDT72V70200 is capable of switching 512 x 512, 64 Kbit/s PCM or N x 64 Kbit/s channel data. The device maintains frame integrity in data applications and minimum throughput delay for voice applications on a per channel basis. The serial input streams of the IDT72V70200 can have a bit rate of 2.048 Mb/s and are arranged in 125µs wide frames, which contain 32 channels respectively. The data rates on input and output streams are identical. In Processor Mode, the microprocessor can access input and output timeslots on a per channel basis allowing for transfer of control and status information. The IDT72V70200 automatically identifies the polarity of the frame synchronization input signal and configures the serial streams to either ST-BUS® or GCI formats. With the variety of different microprocessor interfaces, IDT72V70200 has provided an Input Mode pin (IM) to help integrate the device into different microprocessor based environments: Non-multiplexed or Multiplexed. These interfaces provide compatibility with multiplexed and Motorola non-multiplexed buses. The device can also resolve different control signals eliminating the use of glue logic necessary to convert the signals (R/W/WR, DS/RD, AS/ALE). The frame offset calibration function allows users to measure the frame offset delay using a frame evaluation pin (FE). The input offset delay can be programmed for individual streams using internal frame input offset registers, see Table 8. The internal loopback allows the TX output data to be looped around to the RX inputs for diagnostic purposes. A functional Block Diagram of the IDT72V70200 is shown in Figure 1. DATA AND CONNECTION MEMORY The received serial data is converted to parallel format by internal serialto-parallel converters and stored sequentially in the data memory. The 8KHz input frame pulse (F0i) is used to generate channel and frame boundaries of the input serial data. Depending on the interface mode select (IMS) register, the usable data memory may be as large as 512 bytes. Data to be output on the serial streams (TX0-15) may come from either the data memory or connection memory. For data output from data memory (connection mode), addresses in the connection memory are used. For data to be output from connection memory, the connection memory control bits must set the particular TX output in Processor Mode. One time-slot before the data is to be output, data from either connection memory or data memory is read internally. This allows enough time for memory access and parallel-to-serial conversion. CONNECTION AND PROCESSOR MODES In the Connection Mode, the addresses of the input source data for all output channels are stored in the connection memory. The connection memory is mapped in such a way that each location corresponds to an output channel on the output streams. For details on the use of the source address data (CAB and SAB bits), see Table 10. Once the source address bits are programmed by the microprocessor, the contents of the data memory at the selected address are transferred to the parallel-to-serial converters and then onto a TX output stream. By having the each location in the connection memory specify an input channel, multiple outputs can specify the same input address. This can be a powerful tool used for broadcasting data. In Processor Mode, the microprocessor writes data to the connection memory. Each location in the connection memory corresponds to a particular output stream and channel number and is transferred directly to the parallel-to- serial converter one time-slot before it is to be output. This data will be output on the TX streams in every frame until the data is changed by the microprocessor. As the IDT72V70200 can be used in a wide variety of applications, the device also has memory locations to control the outputs based on operating mode. Specifically, the IDT72V70200 provides five per-channel control bits for the following functions: processor or connection mode, constant or variable delay, enables/three-state the TX output drivers and enables/disable the loopback function. In addition, one of these bits allows the user to control the CCO output. If an output channel is set to a high-impedance state through the connection memory, the TX output will be in a high-impedance state for the duration of that channel. In addition to the per-channel control, all channels on the ST-BUS® outputs can be placed in a high impedance state by either pulling the ODE input pin low or programming the Output Stand-By (OSB) bit in the interface mode selection register. This action overrides the per-channel programming in the connection memory bits. The connection memory data can be accessed via the microprocessor interface. The addressing of the devices internal registers, data and connection memories is performed through the address input pins and the Memory Select (MS) bit of the control register. For details on device addressing, see Software Control and Control Register bits description (Table 3 and 5). SERIAL DATA INTERFACE TIMING The master clock frequency must always be twice the data rate. For serial data rates of 2.048 Mb/s, the master clock (CLK) must be at 4.096 MHz. The input and output stream data rates will always be identical. The input 8 KHz frame pulse can be in either ST-BUS® or GCI format. The IDT72V70200 automatically detects the presence of an input frame pulse and identifies it as either ST-BUS® or GCI. In ST-BUS® format, every second falling edge of the master clock marks a bit boundary and the data is clocked in on the rising edge of CLK, three quarters of the way into the bit cell, see Figure 7. In GCI format, every second rising edge of the master clock marks the bit boundary and data is clocked in on the falling edge of CLK at three quarters of the way into the bit cell, see Figure 8. INPUT FRAME OFFSET SELECTION Input frame offset selection allows the channel alignment of individual input streams to be offset with respect to the output stream channel alignment (i.e. F0i). Although all input data comes in at the same speed, delays can be caused by variable path serial backplanes and variable path lengths which may be implemented in large centralized and distributed switching systems. Because data is often delayed, this feature is useful in compensating for the skew between clocks. Each input stream can have its own delay offset value by programming the frame input offset registers (FOR). The maximum allowable skew is +4.5 master clock (CLK) periods forward with resolution of ½ clock period. The output frame offset cannot be offset or adjusted. See Figure 5, Table 8 and 9 for delay offset programming. SERIAL INPUT FRAME ALIGNMENT EVALUATION The IDT72V70200 provides the frame evaluation (FE) input to determine different data input delays with respect to the frame pulse F0i. A measurement cycle is started by setting the start frame evaluation (SFE) bit low for at least one frame. When the SFE bit in the IMS register is changed from low to high, the evaluation starts. Two frames later, the complete frame evaluation (CFE) bit of the frame alignment register (FAR) changes from low to high to signal that a valid offset measurement is ready to be read from bits 0 5 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE to 11 of the FAR register. The SFE bit must be set to zero before a new measurement cycle started. In ST-BUS® mode, the falling edge of the frame measurement signal (FE) is evaluated against the falling edge of the ST-BUS® frame pulse. In GCI mode, the rising edge of FE is evaluated against the rising edge of the GCI frame pulse. See Table 7 and Figure 4 for the description of the frame alignment register. MEMORY BLOCK PROGRAMMING The IDT72V70200 provides users with the capability of initializing the entire connection memory block in two frames. To set bits 11 to 15 of every connection memory location, first program the desired pattern in bits 5 to 9 of the IMS register. The block programming mode is enabled by setting the memory block program (MBP) bit of the control register high. When the block programming enable (BPE) bit of the IMS register is set to high, the block programming data will be loaded into the bits 11 to 15 of every connection memory location. The other connection memory bits (bit 0 to bit 10) are loaded with zeros. When the memory block programming is complete, the device resets the BPE bit to zero. LOOPBACK CONTROL The loopback control (LPBK) bit of each connection memory location allows the TX output data to be looped backed internally to the RX input for diagnostic purposes. If the LPBK bit is high, the associated TX output channel data is internally looped back to the RX input channel (i.e., data from TX n channel m routes to the RX n channel m internally); if the LPBK bit is low, the loopback feature is disabled. For proper per-channel loopback operation, the contents of frame delay offset registers must be set to zero. delay mode will be one frame. For example, when input time-slot 31 is switched to output time-slot 0. The maximum delay of 94 time-slots of delay occurs when time-slot 0 in a frame is switched to time-slot 31 in the frame. See Table 2. MICROPROCESSOR INTER.ACE The IDT72V70200 provides a parallel microprocessor interface for multiplexed or non-multiplexed bus structures. This interface is compatible with Motorola non-multiplexed and multiplexed buses. If the IM pin is low a Motorola non-multiplexed bus should be connected to the device. If the IM pin is high, the device monitors the AS/ALE and DS/RD to determine what mode the IDT72V70200 should operate in. If DS/RD is low at the rising edge of AS/ALE, then the mode 1 multiplexed timing is selected. If DS/RD is high at the rising edge of AS/ALE, then the mode 2 multiplexed bus timing is selected. For multiplexed operation, the required signals are the 8-bit data and address (AD0-AD7), 8-bit Data (D8-D15), Address strobe/Address latch enable (AS/ ALE), Data strobe/Read (DS/RD), Read/Write /Write (R/W / WR), Chip select (CS) and Data transfer acknowledge (DTA). See Figure 11 and Figure 12 for multiplexed parallel microport timing. For the Motorola non-multiplexed bus, the required signals are the 16-bit data bus (AD0-AD7, D8-D15), 8-bit address bus (A0-A7) and 4 control lines (CS, DS, R/W and DTA). See Figure 13 and 14 for Motorola non-multiplexed microport timing. The IDT72V70200 microport provides access to the internal registers, connection and data memories. All locations provide read/write access except for the data memory and the frame alignment register which are read only. MEMORY MAPPING The address bus on the microprocessor interface selects the internal registers and memories of the IDT72V70200. If the A7 address input is low, then A6 through A0 are used to address the interface mode selection (IMS), control (CR), frame alignment (FAR) and frame input offset (FOR) registers (Table 4). If the A7 is high, A6 and A5 are low, then A4 through A0 are used to select 32 locations corresponding to data rate of the ST-BUS®. The address input lines and the stream address bits (STA) of the control register allow access to the entire data and connection memories. The control and IMS registers together control all the major functions of the device, see Figure 3. As explained in the Serial Data Interface Timing and Switching Configurations sections, after system power-up, the IMS register should be programmed immediately to establish the desired switching configuration. The data in the control register consists of the memory block programming bit (MBP), the memory select bit (MS) and the stream address bits (STA). As explained in the Memory Block Programming section, the MBP bit allows the entire connection memory block to be programmed. The memory select bit is used to designate the connection memory or the data Memory. The stream address bits select internal memory subsections corresponding to input or output serial streams. The data in the IMS register consists of block programming bits (BPD0BPD4), block programming enable bit (BPE), output stand by bit (OSB) and start frame evaluation bit (SFE). The block programming and the block programming enable bits allows users to program the entire connection memory (see Memory Block Programming section). If the ODE pin is low, the OSB bit enables (if high) or disables (if low) all ST-BUS® output drivers. If the ODE pin is high, the contents of the OSB bit is ignored and all TX output drivers are enabled. DELAY THROUGH THE IDT72V70200 The switching of information from the input serial streams to the output serial streams results in a throughput delay. The device can be programmed to perform time-slot interchange functions with different throughput delay capabilities on the per-channel basis. For voice applications, variable throughput delay is best as it ensures minimum delay between input and output data. In wideband data applications, constant throughput delay is best as the frame integrity of the information is maintained through the switch. The delay through the device varies according to the type of throughput delay selected in the V/C bit of the connection memory. VARIABLE DELAY MODE (V/C BIT = 0) In this mode, the delay is dependent only on the combination of source and destination channels and is independent of input and output streams. The minimum delay achievable in the IDT72V70200 is three time-slots. If the input channel data is switched to the same output channel (channel n, frame p), it will be output in the following frame (channel n, frame p+1). The same is true if input channel n is switched to output channel n+1 or n+2. If the input channel n is switched to output channel n+3, n+4,..., the new output data will appear in the same frame. Table 1 shows the possible delays for the IDT72V70200 in the variable delay mode. CONSTANT DELAY MODE (V/C BIT = 1) In this mode, frame integrity is maintained in all switching configurations by making use of a multiple data memory buffer. Input channel data is written into the data memory buffers during frame n will be read out during frame n+2. In the IDT72V70200, the minimum throughput delay achievable in the constant 6 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE CONNECTION MEMORY CONTROL The CCO pin is a 4.096 Mb/s output, which carries 512 bits. The contents of the CCO bit of each connection memory location are output on the CCO pin once every frame. The contents of the CCO bits of the connection memory are transmitted sequentially on to the CCO pin and are synchronous with the data rates on the other serial streams. The CCO bit is output one channel before the corresponding channel on the serial streams. For example, the contents of the CCO bit in position 0 (TX0, CH0) of the connection memory is output on the first clock cycle of channel 31 through CCO pin. The contents of the CCO bit in position 32 (TX1, CH0) of the connection memory is output on the second clock cycle of channel 31 via CCO pin. If the ODE pin or the OSB bit is high, the OE bit of each connection memory location controls the output drivers-enables (if high) or disables (if low). See Table 4 for detail. The processor channel (PC) bit of the connection memory selects between Processor Mode and Connection Mode. If high, the contents of the connection memory are output on the TX streams. If low, the stream address bit (SAB) and the channel address bit (CAB) of the connection memory defines the source information (stream and channel) of the time-slot that will be switched to the output from data memory. The V/C (Variable/Constant Delay) bit in each connection memory location allows the per-channel selection between variable and constant throughput delay modes. If the LPBK bit is high, the associated TX output channel data is internally looped back to the RX input channel (i.e., RX n channel m data comes from the TX n channel m). If the LPBK bit is low, the loopback feature is disabled. For proper per-channel loopback operation, the contents of the frame delay offset registers must be set to zero. INITIALIZATION O. THE IDT72V70200 After power up, the state of the connection memory is unknown. As such, the outputs should be put in high impedance by holding the ODE low. While the ODE is low, the microprocessor can initialize the device, program the active paths, and disable unused outputs by programming the OE bit in connection memory. Once the device is configured, the ODE pin (or OSB bit depending on initialization) can be switched. 7 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 Control Register CRb7 CRb6 CRb5 CRb4 COMMERCIAL TEMPERATURE RANGE CRb3 CRb2 CRb1 CRb0 CRb4 1 0 The Control Register is only accessed when A7-A0 are all zeroed. When A7 =1, up to 32 bytes are randomly accessable via A0-A4 at any one instant. Of which stream these bytes (channels) are accessed is determined by the state of CRb3 -CRb0. Connection Memory Data Memory Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 0 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 1 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 2 Channel 31 Channel 31 Channel Channel Channel Channel Channel Channel Channel Channel Channel Channel Channel Channel Channel Channel 31 31 31 31 31 31 31 31 31 31 31 31 31 31 CRb3 CRb2 CRb1 CRb0 Stream 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 10000000 10000001 10000010 10011111 External Address Bits A7-A0 5711 drw06 Figure 3. Addressing Internal Memories 8 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE TABLE 1 — VARIABLE THROUGHPUT DELAY VALUE Input Rate Delay for Variable Throughput Delay Mode (m – output channel number) (n – input channel number) m n+2 2.048 Mb/s 32 – (n-m) time-slots m-n + 32 time-slots m-n time-slots TABLE 2 — CONSTANT THROUGHPUT DELAY VALUE Input Rate 2.048 Mb/s Delay for Constant Throughput Delay Mode (m – output channel number) (n – input channel number) 32 + (32 – n) + m time-slots TABLE 3 — INTERNAL REGISTER AND ADDRESS MEMORY MAPPING A7(1) 0 0 0 0 0 0 0 1 1 1 1 1 A6 0 0 0 0 0 0 0 0 0 0 0 0 A5 0 0 0 0 0 0 0 0 0 0 0 0 A4 0 0 0 0 0 0 0 0 0 . 1 1 A3 0 0 0 0 0 0 0 0 0 . 1 1 A2 0 0 0 0 1 1 1 0 0 . 1 1 A1 0 0 1 1 0 0 1 0 0 . 1 1 A0 0 1 0 1 0 1 0 0 1 . 0 1 Location Control Register, CR Interface Mode Selection Register, IMS Frame Alignment Register, FAR Frame Input Offset Register 0, FOR0 Frame Input Offset Register 1, FOR1 Frame Input Offset Register 2, FOR2 Frame Input Offset Register 3, FOR3 Ch0 Ch1 . Ch30 Ch31 NOTE: 1. Bit A7 must be high for access to data and connection memory positions. Bit A7 must be low for access to registers. TABLE 4 — OUTPUT HIGH IMPEDANCE CONTROL OE bit in Connection Memory 0 1 1 1 1 ODE pin Don’t Care 0 0 1 1 OSB bit in IMS Register Don’t Care 0 1 1 0 TX Output Driver Status Per Channel High-Impedance High-Impedance Enable Enable Enable 9 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE TABLE 5 — CONTROL REGISTER (CR) BITS Read/Write Address: Reset Value: 15 0 Bit 15-6 5 4 14 0 13 0 00H, 0000H. 12 0 11 0 10 0 9 0 8 0 7 0 6 0 5 MBP 4 MS 3 2 1 0 STA3 STA2 STA1 STA0 Name Unused MBP (Memory Block Program) MS (Memory Select) STA3-0 (Stream Address Bits) Description Must be zero for normal operation. When 1, the connection memory block programming feature is ready for the programming of Connection Memory high bits, bit 11 to bit 15. When 0, this feature is disabled. When 0, connection memory is selected for read or write operations. When 1, the data memory is selected for read operations and connection memory is selected for write operations. (No microprocessor write operation is allowed for the data memory.) The binary value expressed by these bits refers to the input or output data stream, which corresponds to the subsection of memory made accessible for subsequent operations. (STA3 = MSB, STA0 = LSB) 3-0 TABLE 6 — INTER.ACE MODE SELECTION (IMS) REGISTER BITS Read/Write Address: Reset Value: 15 0 14 0 13 0 01H, 0000H. 12 0 11 0 10 0 9 8 7 6 5 4 BPE 3 OSB 2 SFE 1 0 0 0 BPD4 BPD3 BPD2 BPD1 BPD0 Bit 15-10 9-5 Unused Name Must be zero for normal operation. BPD4-0 (Block Programming Data) Description These bits carry the value to be loaded into the connection memory block whenever the memory block programming feature is activated. After the MBP bit in the control register is set to 1 and the BPE bit is set to 1, the contents of the bits BPD4-0 are loaded into bit 15 and 11 of the connection memory. Bit 10 to bit 0 of the connection memory are set to 0. A zero to one transition of this bit enables the memory block programming function. The BPE and BPD4-0 bits in the IMS register have to be defined in the same write operation. Once the BPE bit is set HIGH, the device requires two frames to complete the block programming. After the programming function has finished, the BPE bit returns to zero to indicate the operation is completed. When the BPE = 1, the BPE or MBP can be set to 0 to ensure proper operation. When BPE = 1, the other bit in the IMS register must not be changed for two frames to ensure proper operation. When ODE = 0 and OSB = 0, the output drivers of TX0 to TX15 are in high impedance mode. When ODE= 0 and OSB = 1, the output driver of TX0 to TX15 function normally. When ODE = 1, TX0 to TX15 output drivers function normally. A zero to one transition in this bit starts the frame evaluation procedure. When the CFE bit in the FAR register changes from zero to one, the evaluation procedure stops. To start another fame evaluation cycle, set this bit to zero for at least one frame. Must be zero for normal operation. 4 BPE (Begin Block Programming Enable) 3 OSB (Output Stand By) SFE (Start Frame Evaluation) Unused 2 1-0 10 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE TABLE 7 — .RAME ALIGNMENT REGISTER (.AR) BITS Read/Write Address: Reset Value: 15 0 Bit 15-13 12 11 10-0 14 0 13 0 02H, 0000H. 12 CFE 11 10 9 FD9 8 FD8 7 FD7 6 FD6 5 FD5 4 FD4 3 FD3 2 FD2 1 FD1 0 FD0 FD11 FD10 Name Unused CFE (Complete Frame Evaluation) FD11 (Frame Delay Bit 11) FD10-0 (Frame Delay Bits) Description Must be zero for normal operation. When CFE = 1, the frame evaluation is completed and bits FD10 to FD0 bits contains a valid frame alignment offset. This bit is reset to zero, when SFE bit in the IMS register is changed from 1 to 0. The falling edge of FE (or rising edge for GCI mode) is sampled during the CLK-high phase (FD11 = 1) or during the CLK-low phase (FD11 = 0). This bit allows the measurement resolution to ½ CLK cycle. The binary value expressed in these bits refers to the measured input offset value. These bits are rest to zero when the SFE bit of the IMS register changes from 1 to 0. (FD10 – MSB, FD0 – LSB) ST-BUS Frame CLK Offset Value 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 FE Input (FD[10:0] = 06H) (FD11 = 0, sample at CLK LOW phase) GCI Frame CLK Offset Value 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 FE Input (FD[10:0] = 09H) (FD11 = 1, sample at CLK HIGH phase) 5711 drw07 Figure 4. Example for Frame Alignment Measurement 11 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE TABLE 8 — .RAME INPUT O..SET REGISTER (.OR) BITS Read/Write Address: 03H for FOR0 register, 04H for FOR1 register, 05H for FOR2 register, 06H for FOR3 register, 0000H for all FOR registers. 12 DLE3 Reset Value: 15 OF32 14 OF31 13 OF30 11 OF22 10 OF21 9 OF20 8 DLE2 7 OF12 6 OF11 5 OF10 4 DLE1 3 OF02 2 OF01 1 OF00 0 DLE0 15 OF72 14 OF71 13 OF70 12 DLE7 11 OF62 10 OF61 9 OF60 8 FOR0 Register 7 6 OF52 OF51 5 OF50 4 DLE5 3 OF42 2 OF41 1 OF40 0 DLE4 DLE6 15 14 13 12 11 10 9 8 FOR1 Register 7 6 OF92 OF91 5 OF90 4 DLE9 3 OF82 2 OF81 1 OF80 0 DLE8 OF112 OF111 OF110 DLE11 OF102 OF101 OF100 DLE10 15 14 13 12 11 10 9 8 FOR2 Register 7 6 5 4 3 2 1 0 OF152 OF151 OF150 DLE15 OF142 OF141 OF140 DLE14 OF132 OF131 OF130 DLE13 OF122 OF121 OF120 DLE12 FOR3 Register Name(1) OFn2, OFn1, OFn0 (Offset Bits 2, 1 & 0) DLEn (Data Latch Edge) Description These three bits define how long the serial interface receiver takes to recognize and store bit 0 from the RX input pin: i.e., to start a new frame. The input frame offset can be selected to +4.5 clock periods from the point where the external frame pulse input signal is applied to the F0i input of the device. See Figure 5. ST-BUS® mode: GCI mode: NOTE: 1. n denotes an input stream number from 0 to 15. DLEn = 0, if clock rising edge is at the ¾ point of the bit cell. DLEn = 1, if when clock falling edge is at the ¾ of the bit cell. DLEn = 0, if clock falling edge is at the ¾ point of the bit cell. DLEn = 1, if when clock rising edge is at the ¾ of the bit cell. 12 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE TABLE 9 — O..SET BITS (O.n2, O.n1, O.n0, DLEn) & .RAME DELAY BITS (.D11, .D2-0) Input Stream Offset No clock period shift (Default) + 0.5 clock period shift + 1.0 clock period shift + 1.5 clock period shift + 2.0 clock period shift + 2.5 clock period shift + 3.0 clock period shift + 3.5 clock period shift + 4.0 clock period shift + 4.5 clock period shift FD11 1 0 1 0 1 0 1 0 1 0 Measurement Result from Frame Delay Bits FD2 0 0 0 0 0 0 0 0 1 1 FD1 0 0 0 0 1 1 1 1 0 0 FD0 0 0 1 1 0 0 1 1 0 0 OFn2 0 0 0 0 0 0 0 0 1 1 Corresponding Offset Bits OFn1 0 0 0 0 1 1 1 1 0 0 OFn0 0 0 1 1 0 0 1 1 0 0 DLEn 0 1 0 1 0 1 0 1 0 1 ST-BUS F0i CLK RX Stream Bit 7 offset = 0, DLE = 0 RX Stream Bit 7 offset = 1, DLE = 0 RX Stream Bit 7 offset = 0, DLE = 1 RX Stream Bit 7 offset = 1, DLE = 1 denotes the 3/4 point of the bit cell GCI F0i CLK RX Stream Bit 0 offset = 0, DLE = 0 RX Stream Bit 0 offset = 1, DLE = 0 RX Stream Bit 0 offset = 0, DLE = 1 RX Stream Bit 0 offset = 1, DLE = 1 denotes the 3/4 point of the bit cell 5711 drw08 Figure 5. Examples for Input Offset Delay Timing 13 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE TABLE 10 — CONNECTION MEMORY BITS 15 LPBK 14 V/C 13 PC 12 CCO 11 OE 10 SAB3 9 SAB2 8 SAB1 7 SAB0 6 0 5 0 4 CAB4 3 CAB3 2 CAB2 1 CAB1 0 CAB0 Bit 15 14 Name LPBK (Per Channel Loopback) V/C (Variable/Constant Throughput Delay) PC (Processor Channel) CCO (Control Channel Output) OE (Output Enable) SAB3-0 (Source Stream Address Bits) Unused CAB4-0 (Source Channel Address Bits) Description When 1, the RX n channel m data comes from the TX n channel m. For proper per channel loopback operations, set the delay offset register bits OFn[2:0] to zero for the streams which are in the loopback mode. This bit is used to select between the variable (LOW) and constant delay (HIGH) mode on a per-channel basis. When 1, the contents of the connection memory are output on the corresponding output channel and stream. Only the lower byte (bit 7 – bit 0) will be output to the TX output pins. When 0, the contents of the connection memory are the data memory address of the switched input channel and stream. This bit is output on the CCO pin one channel early. The CCO bit for stream 0 is output first. This bit enables the TX output drivers on a per-channel basis. When 1, the output driver functions normally. When 0, the output driver is in a high-impedance state. The binary value is the number of the data stream for the source of the connection. Must be zero for normal operation. The binary value is the number of the channel for the source of the connection. 13 12 11 10-8,7(1) 6,5(1) 4-0(1) NOTE: 1. If bit 13 (PC) of the corresponding connection memory location is 1 (device in processor mode), then these entire 8 bits (SAB0, bits 6-5, CAB4 - CAB0) are output on the output channel and stream associated with this location. 14 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE JTAG SUPPORT The IDT72V70200 JTAG interface conforms to the Boundary-Scan standard IEEE-1149.1. This standard specifies a design-for-testability technique called Boundary-Scan Test (BST). The operation of the boundary-scan circuitry is controlled by an external test access port (TAP) Controller. TEST ACCESS PORT (TAP) The Test Access Port (TAP) provides access to the test functions of the IDT72V70200. It consists of three input pins and one output pin. •Test Clock Input (TCK) TCK provides the clock for the test logic. The TCK does not interfere with any on-chip clock and thus remain independent. The TCK permits shifting of test data into or out of the Boundary-Scan register cells concurrently with the operation of the device and without interfering with the on-chip logic. •Test Mode Select Input (TMS) The logic signals received at the TMS input are interpreted by the TAP Controller to control the test operations. The TMS signals are sampled at the rising edge of the TCK pulse. This pin is internally pulled to Vcc when it is not driven from an external source. •Test Data Input (TDI) Serial input data applied to this port is fed either into the instruction register or into a test data register, depending on the sequence previously applied to the TMS input. Both registers are described in a subsequent section. The received input data is sampled at the rising edge of TCK pulses. This pin is internally pulled to Vcc when it is not driven from an external source. •Test Data Output (TDO) Depending on the sequence previously applied to the TMS input, the contents of either the instruction register or data register are serially shifted out towards the TDO. The data out of the TDO is clocked on the falling edge of the TCK pulses. When no data is shifted through the boundary scan cells, the TDO driver is set to a high impedance state. •Test Reset (TRST) Reset the JTAG scan structure. This pin is internally pulled to VCC. INSTRUCTION REGISTER In accordance with the IEEE 1149.1 standard, the IDT72V70200 uses public instructions. The IDT72V70200 JTAG Interface contains a two-bit instruction register. Instructions are serially loaded into the instruction register from the TDI when the TAP Controller is in its shifted-IR state. Subsequently, the instructions are decoded to achieve two basic functions: to select the test data register that may operate while the instruction is current, and to define the serial test data register path, which is used to shift data between TDI and TDO during data register scanning. See Table below for Instruction decoding. Value 000 001 010 011 100 101 110 111 Instruction EXTEST EXTEST Sample/preload Sample/preload Sample/preload Sample/preload Bypass Bypass Function Select Boundary Scan Register Select Boundary Scan Register Select Boundary Scan Register Select Boundary Scan Register Select Boundary Scan Register Select Boundary Scan Register Select Bypass Register Select Bypass Register JTAG Instruction Register Decoding TEST DATA REGISTER As specified in IEEE 1149.1, the IDT72V70200 JTAG Interface contains two test data registers: •The Boundary-Scan register The Boundary-Scan register consists of a series of Boundary-Scan cells arranged to form a scan path around the boundary of the IDT72V70200 core logic. •The Bypass Register The Bypass register is a single stage shift register that provides a one-bit path from TDI to its TDO. The IDT72V70200 boundary scan register contains 118 bits. Bit 0 in Table 11 Boundary Scan Register is the first bit clocked out. All three-state enable bits are active high. 15 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE TABLE 11 — BOUNDARY SCAN REGISTER BITS Device Pin TX7 TX6 TX5 TX4 TX3 TX2 TX1 TX0 ODE CCO DTA D15 D14 D13 D12 D11 D10 D9 D8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 IM AD/ALE CS R/W / WR DS/RD A7 A6 A5 Boundary Scan Bit 0 to bit 117 Three-State Output Input Control Scan Cell Scan Cell 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 Device Pin A4 A3 A2 A1 A0 IC RESET CLK FE F0i RX15 RX14 RX13 RX12 RX11 RX10 RX9 RX8 RX7 RX6 RX5 RX4 RX3 RX2 RX1 RX0 TX15 TX14 TX13 TX12 TX11 TX10 TX9 TX8 Boundary Scan Bit 0 to bit 117 Three-State Output Input Control Scan Cell Scan Cell 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 16 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE ABSOLUTE MAXIMUM RATINGS(1) Symbol VCC Vi IO TS PD Parameter Supply Voltage Voltage on Digital Inputs Current at Digital Outputs Storage Temperature Package Power Dissapation -65  Min. -0.3 GND -0.3 Max. 5.0 5.5 20 +125 1 Unit V V mA °C W RECOMMENDED DC OPERATING CONDITIONS Symbol VCC VIH VIH VIL TOP Parameter Positive Supply Input HIGH Voltage (3.3V) Input HIGH Voltage (5.0V) Input LOW Voltage Operating Temperature Commercial Min. 3.0 2.0 2.0 GND -40 Typ.      Max. 3.6 VCC 5.5 0.8 +85 Units V V V V °C NOTE: 1. Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. NOTE: 1. Voltages are with respect to ground unless other wise stated. DC ELECTRICAL CHARACTERISTICS Symbol ICC(1) IIL(2) IBL CI IOZ VOH VOL CO Characteristics Supply Current Input Leakage (input pins) Input Leakage (I/O pins) Input Pin Capacitance High-impedance Leakage Output HIGH Voltage Output LOW Voltage Output Pin Capacitance @ 2.048 Mb/s Min.      2.4   Typ. 7        Max. 10 15 50 10 5  0.4 10 Units mA µA µA pF µA V V pF NOTE: 1. Outputs Unloaded. 2. For TDI, TMS, and TRST pins, the maximum leakage current is 50µA. Test Point VCC S1 is open circuit except when testing output levels or high impedance states. S2 is switched to VCC or GND when testing output levels or high impedance states. Output Pin S1 CL GND RL S2 GND 5711 drw09 Figure 6. Output Load 17 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE AC ELECTRICAL CHARACTERISTICS - .RAME PULSE AND CLK Symbol tFPW tFPS tFPH tCP tCH tCL tr, tf Characteristics Frame Pulse Width (ST-BUS , GCI)  Bit rate = 2.048 Mb/s ® Min. 26 5 10 190 85 85  Typ.        Max. 295   300 150 150 10 Units ns ns ns ns ns ns ns Frame Pulse Setup time before CLK falling (ST-BUS® or GCI) Frame Pulse Hold Time from CLK falling (ST-BUS or GCI) CLK Period  CLK Pulse Width HIGH  CLK Pulse Width LOW  Clock Rise/Fall Time Bit rate = 2.048 Mb/s Bit rate = 2.048 Mb/s Bit rate = 2.048 Mb/s ® AC ELECTRICAL CHARACTERISTICS - SERIAL STREAMS (1) Symbol tSIS tSIH tSOD tDZ tZD tODE tXCD Characteristics RX Setup Time RX Hold Time TX Delay – Active to Active TX Delay – Active to High-Z TX Delay – High-Z to Active Output Driver Enable (ODE) Delay CCO Output Delay Min. 0 10        Typ.          Max.   30 40 32 32 32 30 40 Unit ns ns ns ns ns ns ns ns ns CL = 30pF CL = 200pF RL = 1KΩ, CL = 200pF RL = 1KΩ, CL = 200pF RL = 1KΩ, CL = 200pF CL = 30pF CL = 200pF Test Conditions NOTE: 1. High Impedance is measured by pulling to the appropriate rail with RL, with timing corrected to cancel time taken to discharge CL. 18 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE tFPW F0i tFPS CLK tFPH tCP tCH tCL tr tf tSOD TX Bit 0, Last Ch (1) Bit 7, Channel 0 Bit 6, Channel 0 Bit 5, Channel 0 tSIS RX Bit 0, Last Ch(1) tSIH Bit 6, Channel 0 Bit 5, Channel 0 5711 drw10 Bit 7, Channel 0 NOTE: 1. last channel = ch 31. Figure 7. ST-BUS® Timing tFPW F0i tFPS CLK tFPH tCP tCH tCL tr tf tSOD TX Bit 7, Last Ch(1) Bit 0, Channel 0 Bit 1, Channel 0 Bit 2, Channel 0 tSIS RX Bit 7, Last Ch(1) tSIH Bit 0, Channel 0 Bit 1, Channel 0 Bit 2, Channel 0 5711 drw11 NOTE: 1. last channel = ch 31. Figure 8. GCI Timing CLK (ST-BUS or WFPS mode) CLK (GCI mode) tDZ TX VALID DATA tZD TX tXCD VALID DATA ODE tODE TX tODE VALID DATA 5711 drw13 CCO 5711 drw12 Figure 9. Serial Output and External Control 19 Figure 10. Output Driver Enable (ODE) IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE AC ELECTRICAL CHARACTERISTICS - MULTIPLEXED BUS TIMING (INTEL) Symbol tALW tADS tADH tALRD tDDR tCSRW tRW tCSR tDHR tWW tALWR tCSW tDSW tSWD tDHW tAKD (1) Parameter ALE Pulse Width Address Setup from ALE falling Address Hold from ALE falling RD Active after ALE falling Data Setup from DTA LOW on Read CS Hold after RD/WR RD Pulse Width (Fast Read) CS Setup from RD Data Hold after RD WR Pulse Width (Fast Write) WR Delay after ALE falling CS Setup from WR Data Setup from WR (Fast Write) Valid Data Delay on Write (Slow Write) Data Hold after WR Inactive Acknowledgment Delay: Reading/Writing Registers Reading/Writing Memory Min. 20 3 3 3 5 5 45 0 10 45 3 0 20 Typ. Max. Units ns ns ns ns ns ns ns ns Test Conditions CL = 150pF 20 ns ns ns ns ns CL = 150pF, RL = 1K 122 5 43/43 760/750 22 ns ns ns ns ns CL = 150pF CL = 150pF CL = 150pF, RL = 1K tAKH (1) Acknowledgment Hold Time NOTE: 1. High Impedance is measured by pulling to the appropriate rail with RL, with timing corrected to cancel time taken to discharge CL. tALW ALE tADS tADH AD0-AD7 D8-D15 ADDRESS DATA tALRD CS tCSRW tCSR RD tRW tDHR tCSW WR tWW tDSW tDHW tALWR DTA tSWD tAKD tDDR tAKH 5711 drw14 Figure 11. Multiplexed Bus Timing (Intel Mode) 20 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE AC ELECTRICAL CHARACTERISTICS - MULTIPLEXED BUS TIMING (MOTOROLA) Symbol tASW tADS tADH tDDR tCSH tCSS tDHW tDWS tSWD tRWS tRWH tDHR(1) tDSH tAKD Parameter ALE Pulse Width Address Setup from AS falling Address Hold from AS falling Data Setup from DTA LOW on Read CS Hold after DS falling CS Setup from DS rising Data Hold after Write Data Setup from DS – Write (Fast Write) Valid Data Delay on Write (Slow Write) R/W Setup from DS Rising R/W Hold from DS Rising Data Hold after Read DS Delay after AS falling Acknowledgment Delay: Reading/Writing Registers Reading/Writing Memory tAKH(1) Acknowledgment Hold Time 43/43 760/750 22 ns ns ns CL = 150pF CL = 150pF CL = 150pF, RL = 1K 60 5 10 10 20 Min. 20 3 3 5 0 0 5 20 122 Typ. Max. Units ns ns ns ns ns ns ns ns ns ns ns ns ns CL = 150pF, RL = 1K CL = 150pF Test Conditions NOTE: 1. High Impedance is measured by pulling to the appropriate rail with RL, with timing corrected to cancel time taken to discharge CL. DS tRWS R/W tRWH tASW AS tDSH tADS AD0-AD7 D8-D15 WR AD0-AD7 D8-D15 RD CS ADDRESS tADH tSWD tDHW tDWS DATA tDHR ADDRESS DATA tCSH tCSS tDDR DTA tAKD tAKH 5711 drw15 Figure 12. Multiplexed Bus Timing (Motorola Mode) 21 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE AC ELECTRICAL CHARACTERISTICS-MOTOROLA NON-MULTIPLEXED BUS MODE Symbol tCSS tRWS tADS tCSH tRWH tADH tDDR tDHR tDSW tSWD tDHW tAKD Parameter CS Setup from DS falling R/W Setup from DS falling Address Setup from DS falling CS Hold after DS rising R/W Hold after DS Rising Address Hold after DS Rising Data Setup from DTA LOW on Read Data Hold on Read Data Setup on Write (Fast Write) Valid Data Delay on Write (Slow Write) Data Hold on Write Acknowledgment Delay: Reading/Writing Registers Reading/Writing Memory tAKH(1) Acknowledgment Hold Time 43/43 760/750 22 ns ns ns CL = 150pF CL = 150pF CL = 150pF, RL = 1K 5 Min. 0 10 2 0 2 2 2 10 0  122 20 Typ. Max. Units ns ns ns ns ns ns ns ns ns ns ns CL = 150pF CL = 150pF, RL = 1K Test Conditions NOTE: 1. High Impedance is measured by pulling to the appropriate rail with RL, with timing corrected to cancel time taken to discharge CL. DS tCSS CS tCSH tCSS tCSH tRWS R/W tRWH tRWS tRWH tADS A0-A7 VALID WRITE ADDRESS tADH tADS VALID READ ADDRESS tADH tSWD AD0-AD7/ D8-D15 tDSW tDHW tDDR tDHR VALID READ DATA VALID WRITE DATA tAKD DTA tAKH tAKD tAKH 5711 drw16 Figure 13. Motorola Non-Multiplexed Asyncrounous Bus Timing 22 IDT72V70200 3.3V TIME SLOT INTERCHANGE DIGITAL SWITCH 512 x 512 COMMERCIAL TEMPERATURE RANGE CLK GCI CLK ST-BUS tDSS DS tDSS tDSPW tCSH tCSS tCSH tCSS CS tRWS R/W tRWH tRWS tRWH tADS A0-A7 tADH VALID WRITE ADDRESS tADS tADH VALID READ ADDRESS tSWD AD0-AD7/ D8-D15 tDHW VALID WRITE DATA tDHR VALID READ DATA tCKAK DTA tDDR tAKH tCKAK tAKH 5711 drw17 Figure 14. Motorola Non-Multiplexed Syncrounous Bus Timing 23 ORDERING IN.ORMATION IDT XXXXXX Device Type XX Package X Process/ Temperature Range BLANK Commercial (-40°C to +85°C) J BC PQF PF Plastic Leaded Chip Carrier (PLCC, J84-1) Ball Grid Array (BGA, BC100-1) Plastic Quad Flatpack (PQFP, PQ100-2) Thin Quad Flat Pack (TQFP, PN100-1) 72V70200 512 x 512  3.3V Time Slot Interchange Digital Switch 5711 drw18 DATASHEET DOCUMENT HISTORY 5/19/2000 8/15/2000 9/22/2000 1/04/2001 1/25/2001 08/06/2001 pgs. 1, 3, 17 and 23. pgs. 1, 2, 3, 5, 12 and 23. pgs. 3, 12 and 17. pgs. 6, 11, 17, 19, 20, 21 and 22. pgs. 17 and 22. pgs. 4, 10, 15, and 22. CORPORATE HEADQUARTER 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com 24 for Tech Support: 408-330-1753 email: FIFOhelp@idt.com