HC49US-FF5F18-6.000MHZ

HC49US Series Product Feature: Low Cost Package RoHs Compliant Compatible with Leadfree Processing Frequency Applications: Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1.T3/E3 System Clock 3.2 MHz to 100 MHz ESR (Equivalent Series Resistance) 3.2 MHz - 3.49 MHz 3.5 MHz - 3.99 MHz 4.0 MHz - 4.99 MHz 5.0 MHz - 5.99 MHz 6.0 MHz - 6.99 MHz 7.0 MHz - 8.9 MHz 9.0 MHz - 12.9 MHz 13 MHz- 19.9 MHz 20 MHz - 36 MHz 27 MHz – 100.0 MHz (3rd O.T.) 300 Ω Max. 200 Ω Max. 150 Ω Max. 120 Ω Max. 100 Ω Max. 80 Ω Max. 60 Ω Max. 40 Ω Max. 30 Ω Max. 100 Ω Max. Shunt Capacitance (C0) 7 pF Max. Frequency Tolerance @ 25° C ±30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature ±50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 1 mW Max. Aging ±5 ppm Max. / Year Standard Dimension Units: mm Temperature Operating 0° C to +70° C Standard (see Part Number Guide for more options) Storage -40° C to +85° C Standard Part Number Guide Package HC49US­ (3.5 mm H) HC49US2(2.5 mm H) HC49US3(2.0 mm H)- Tolerance (ppm) at Room Temperature B = ±50ppm F = ±30ppm G = ±25ppm H = ±20ppm I = ±15ppm J = ±10ppm* Sample Part Number: HC49USM - FB1F18 - 20.000 Stability Operating Mode Load (ppm) over Operating Temperature Range (overtone) Capacitance Temperature (pF) B = ±50ppm 0 = 0°C to +50°C F = Fundamental F = ±30ppm 1 = 0°C to +70°C 3 = Third Overtone G = ±25ppm 2 = -10°C to +60°C 18pF Standard Or Specify H = ±20ppm 3 = -20°C to +70°C I = ±15ppm 5 = -40°C to +85°C J = ±10ppm 9 = -10°C to +50°C Frequency -20.000 MHz * Not available at all frequencies. ** Not available for all temperature ranges. Revised A: 06/09 Page 1 of 2 www.ilsiamerica.com HC49US Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Sn / Cu/ Ag over Ni over Kovar base metal). Environmental Specifications: Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance Revised A: 06/09 MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Page 2 of 2 www.ilsiamerica.com