IL3W-HX5F12.5-32.768KHZ

IL3W Series Product Feature: 2-Pad SMD Package Ultra-Low Profile Compatible with Leadfree Processing RoHS Compliant Applications: Real Time Clock Source Metering Industrial Control Time Reference Frequency 32.768kHz Equivalent Series Resistance 90 kOhms Maximum Frequency Tolerance (at 25°C) ±10ppm, ±20ppm, or ±30ppm Frequency Stability (over Temperature) Parabolic, -0.030ppm / ° C2 ± 0.010 ppm / ° C2 Turn over Temperature +25°C ±5°C Mode of Operation Flexural Crystal Cut Tuning Fork Load Capacitance 9pF, or 12.5pF Drive Level 0.1 μW Typical, 0.5 µWatt Maximum Aging ±3ppmn Maximum / First Year Operating Temperature Range -40°C to +85°C Storage Temperature Range -40° C to +85° C Recommended land pattern Dimensions: mm Part Number Guide Package Stability (ppm) at Room Temperature Sample Part Number: Stability (ppm) over Operating Temperature Operating Temperature Range X = X Cut 5 = -40C to +85C IL3W – HX5F12.5 – 32.768 kHz Mode (Overtone) Load Capacitance (pF) Frequency 9 = 9pF 12.5 = 12.5pF -32.768 kHz F = ±30 IL3W - H = ±20 J = ±10 Revised E: 12/10/20 Page 2 of 8 F = Fundamental www.ilsiamerica.com IL3W Series Typical X Cut Temperature Coefficient: Pb Free Solder Reflow Profile: Units are backward compatible with 240C reflow processes Ts max to TL (Ramp-up Rate) Preheat Temperature min (Ts min) Temperature typ (Ts typ) Temperature max (Ts max) Time (Ts) Ramp-up Tate (TL to Tp Time Maintained Above Temperature (TL) Time (TL) Peak Temperature (Tp) Time within 5ºC to Peak Temperature (Tp) Ramp-down Rate Tune 25ºC to Peak Temperature 3ºC / second max 150ºC 175ºC 200ºC 60 to180 seconds 3ºC / second max 217ºC 60 to 150 seconds 260ºC max for 10 seconds 20 to 40 seconds 6ºC / second max 8 minutes max Package Information: MSL = This product is Hermetically Sealed and not Moisture Sensitive-MSL = N/A: Not Applicable Tape and Reel Information: Quantity per Reel A B C D E F Revised E: 12/10/20 Page 3 of 8 5000 8.0 ±0.3 4.0 ±0.2 3.5 ±0.2 9.0 ±1.0 60 / 80 180 www.ilsiamerica.com IL3W Series Environmental Specifications: Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance Revised E: 12/10/20 MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS/ Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A1 MIL-STD-202, Method 215 Page 4 of 8 www.ilsiamerica.com