ILCX20-FF5F8-50.000MHZ

ILCX20 Series Applications: Product Feature: Fiber Channel Server & Storage Sonet /SDH 802.11 / Wifi Low Cost SMD Package Ultra-Miniature Package Compatible w/ Leadfree Processing RoHS compliant Frequency T1/E1, T3/E3 IoT 24MHz to 60MHz Equivalent Series Resistance 24.0MHz – 39.999999MHz 40.0MHz – 60.0MHz 150 Ohms Maximum 100 Ohms Maximum Shunt Capacitance (C0) 3.5pF Maximum Frequency Tolerance (at 25°C) See Part Number Guide Frequency Stability (over Temperature) See Part Number Guide Mode of Operation Fundamental Crystal Cut AT Cut Load Capacitance 18pF Standard Drive Level 100µWatts Maximum Aging ±3ppm/Year Maximum Operating Temperature Range See Part Number Guide Storage Temperature Range -40°C to +85°C Pin 1 Pin 2 Pin 3 Pin 4 Part Number Guide Package ILCX20- Sample Part Number: Stability (ppm) over Operating Temperature Operating Temperature Range B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm** 5 = -40°C to +85°C I = ±15 ppm J = ±10 ppm** Crystal Internally connected to case lid Crystal No Connect ILCX20-FB1F18- 20.000 MHz Tolerance (ppm) at Room Temperature J = ±10 ppm* Pin Connections Mode (overtone) F = Fundamental Load Capacitance (pF) Frequency 18pF Standard Or Specify - 20.000 MHz 7 = -30°C to +80°C 9 = -10°C to +50°C * Not available at all frequencies. ** Not available for all temperature range Revised C: 08/14/2017 Page 2 of 6 www.ilsiamerica.com ILCX20 Series Pb Free Solder Reflow Profile: Units are backward compatible with 240C reflow processes Ts max to TL (Ramp-up Rate) Preheat Temperature min (Ts min) Temperature typ (Ts typ) Temperature max (Ts max) Time (Ts) Ramp-up Tate (TL to Tp Time Maintained Above Temperature (TL) Time (TL) Peak Temperature (Tp) Time within 5ºC to Peak Temperature (Tp) Ramp-down Rate Tune 25ºC to Peak Temperature 3ºC / second max 150ºC 175ºC 200ºC 60 to180 seconds 3ºC / second max 217ºC 60 to 150 seconds 260ºC max for 10 seconds 20 to 40 seconds 6ºC / second max 8 minutes max Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A 3000 8.0±0.3 B 4.0±0.2 C 3.5±0.2 D 9.0±1.0 E 60/80 F 180 Environmental Specifications: Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Gross Leak Fine Leak Solvent Resistance Revised C: 08/14/2017 MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Page 3 of 6 www.ilsiamerica.com