BA892-02V

BA592/BA892... Silicon RF Switching Diode • For band switching in TV/VTR tuners and mobile applications • Very low forward resistance (typ. 0.45 Ω @ 3 mA) • Small capacitance • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BA592 BA892/-02L BA892-02V  Type BA592 BA892 BA892-02L BA892-02V Package SOD323 SCD80 TSLP-2-1 SC79 Configuration single single single, leadless single LS(nH) 1.8 0.6 0.4 0.6 Marking blue S AA AA A Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage Forward current Junction temperature Operating temperature range Storage temperature 1Pb-containing Symbol VR IF Tj Top Tstg Value 35 100 150 -55 ... 125 -55 ... 150 Unit V mA °C package may be available upon special request 1 2007-04-19 BA592/BA892... Thermal Resistance Parameter Junction - soldering point1) BA592 BA892, BA892-02V BA892-02L Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Reverse current VR = 20 V Forward voltage IF = 100 mA 1For Symbol RthJS Value ≤ 135 ≤ 120 ≤ 70 Unit K/W Symbol min. IR VF - Values typ. max. 20 1 Unit nA V calculation of RthJA please refer to Application Note Thermal Resistance 2 2007-04-19 BA592/BA892... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter AC Characteristics Diode capacitance VR = 1 V, f = 1 MHz VR = 3 V, f = 1 MHz VR = 0 V, f = 100 MHz Reverse parallel resistance VR = 0 V, f = 100 MHz Forward resistance I F = 3 mA, f = 100 MHz I F = 10 mA, f = 100 MHz Charge carrier life time I F = 10 mA, IR = 6 mA, measured at IR = 3mA, RL = 100 Ω I-region width Insertion loss1) I F = 0.1 mA, f = 1.8 GHz I F = 3 mA, f = 1.8 GHz I F = 10 mA, f = 1.8 GHz Isolation1) VR = 0 V, f = 100 MHz VR = 0 V, f = 470 MHz VR = 0 V, f = 1 GHz 1BA892-02L Symbol min. CT 0.65 0.6 RP rf τ rr Values typ. max. Unit pF 0.92 0.85 1 100 1.4 1.1 kΩ Ω - 0.45 0.36 120 0.7 0.5 ns - WI IL - 3 0.1 0.5 0.4 - µm dB ISO 23.5 10.5 5.5 - in series configuration, Z = 50Ω 3 2007-04-19 BA592/BA892... Diode capacitance CT = ƒ (VR) f = Parameter 2 Reverse parallel resistance RP = ƒ(V R) f = Parameter 10 3 KOhm 100 MHz pF 10 2 CT 1.2 Rp 10 1 1 GHz 1 MHz ... 1 GHz 0.8 10 0 0.4 0 0 5 10 15 20 V 30 10 -1 0 5 10 15 20 V 30 VR VR Forward resistance rf = ƒ (IF ) f = 100MHz 10 2 Forward current IF = ƒ (VF) TA = Parameter 10 0 A Ohm 10 -1 10 1 10 -2 rf IF 10 -3 10 0 10 -4 -40 °C 25 °C 85 °C 125 °C 10 -5 10 -1 -2 10 10 -1 10 0 10 1 mA 10 2 10 -6 0 0.2 0.4 0.6 0.8 V 1.2 IF VF 4 2007-04-19 BA592/BA892... Insertion loss IL = -|S21|2 = ƒ(f) IF = Parameter BA892-02L in series configuration, Z = 50Ω 0 Isolation ISO = -|S21| 2 = ƒ(f) VR = Paramter BA892-02L in series configuration, Z = 50Ω 0 dB dB |S 21| 2 |S 21| 2 -10 -0.2 10 mA 3 mA 1 mA 0.1 mA 0V 1V 10 V -15 -20 -0.3 -25 -0.4 0 0.5 1 1.5 2 GHz 3 -30 0 0.5 1 1.5 2 GHz 3 f f 5 2007-04-19 Package SC79 BA592/BA892... Package Outline 0.2 0.8 ±0.1 10˚MAX. M A 0.13 -0.03 +0.05 2 1.6 ±0.1 0.55 ±0.04 Foot Print 1.35 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.33 1.96 Cathode marking 0.4 0.93 8 0.2 ±0.05 0.66 Cathode marking 1 0.3 ±0.05 Cathode marking 10˚MAX. 1.2 ±0.1 A 6 2007-04-19 Package SCD80 BA592/BA892... Package Outline 0.2 0.8 ±0.1 10˚MAX. M A +0.05 0.13 -0.03 A 7˚ ±1.5˚ 1.3 ±0.1 2 1.7 ±0.1 0.7 ±0.1 Foot Print 1.45 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.45 2.5 8 0.2 ±0.05 Cathode marking 1 0.3 ±0.05 Cathode marking 0.4 0.9 Cathode marking 0.7 7 2007-04-19 BA592/BA892... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code M onth 2 0 03 01 02 03 04 05 06 07 08 09 10 11 12 a b c d e f g h j k l n 2 0 04 p q r s t u v x y z 2 3 2005 A B C D E F G H J K L N 2006 P Q R S T U V X Y Z 4 5 2 0 07 a b c d e f g h j k l n 2008 p q r s t u v x y z 2 3 2009 A B C D E F G H J K L N 2010 P Q R S T U V X Y Z 4 5 2011 a b c d e f g h j k l n 2012 p q r s t u v x y z 2 3 2 0 13 A B C D E F G H J K L N 2014 P Q R S T U V X Y Z 4 5 1 ) New Marking Layout for SC75, implemented at October 2005. . 8 2007-04-19 Package SOD323 BA592/BA892... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 ±0.05 A 1.7 +0.2 -0.1 +0.05 0.3 -0.2 2 Cathode marking 1 0.3 +0.1 -0.05 0.25 M A 0.45 ±0.15 2.5 ±0.2 0.15 +0.1 -0.06 Foot Print 0.6 Marking Layout (Example) 0.8 1.7 0.8 BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 2 2.9 8 Cathode marking 0.65 1.35 1 9 2007-04-19 Package TSLP-2-1 BA592/BA892... Package Outline Top view 0.05 MAX. 2 0.4 +0.1 Bottom view 0.6 ±0.05 0.65±0.05 2 1 1 1) 1) Cathode marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.45 0.275 0.6 0.35 0.35 0.925 0.3 1 Copper Solder mask Stencil apertures Marking Layout (Example) BAS16-02L Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 4 0.5 1.16 Cathode marking 0.76 8 0.275 0.375 0.25 ±0.035 0.5 ±0.035 1 ±0.05 10 2007-04-19 BA592/BA892... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 11 2007-04-19