BAL74

BAL74/BAR74... Silicon Switching Diode • For high-speed switching applications • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAL74 ! BAR74 !   Type BAL74 BAR74 Parameter Diode reverse voltage Peak reverse voltage Forward current Peak forward current Package SOT23 SOT23 Configuration single single Symbol VR VRM IF IFM IFS IFSM Ptot Tj Tstg Value 50 50 250 4.5 370 150 -65 ... 150 Marking JCs JBs Unit V mA A mW °C Maximum Ratings at TA = 25°C, unless otherwise specified Surge forward current, t = 1 µs Non-repetitive peak surge forward current Total power dissipation TS ≤ 54°C Junction temperature Storage temperature Thermal Resistance Parameter Junction - soldering point 2), BAL74, BAR74 1Pb-containing 2For Symbol RthJS Value ≤ 260 Unit K/W package may be available upon special request calculation of RthJA please refer to Application Note Thermal Resistance 1 2007-04-19 BAL74/BAR74... Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. DC Characteristics 50 V Breakdown voltage V(BR) I(BR) = 100 µA Reverse current VR = 50 V VR = 50 V, TA = 150 °C Forward voltage IF = 100 mA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA, RL = 100 Ω Test circuit for reverse recovery time D.U.T. IR VF 0.1 100 1 µA V CT trr - - 2 4 pF ns Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns, Ri = 50Ω Oscillograph ΙF EHN00015 Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF 2 2007-04-19 BAL74/BAR74... Reverse current IR = ƒ (TA) VR = Parameter 10 5 nA BAR 74 EHB00012 Forward Voltage VF = ƒ (TA) IF = Parameter 1.0 V BAR 74 EHB00015 ΙR 10 4 5 max. VF V R = 70 V Ι F = 100 mA 10 mA 1 mA 10 3 5 typ. 70V 25V 0.5 0.1 mA 10 2 5 10 1 0 50 100 TA ˚C 150 0 0 50 100 TA ˚C 150 Forward current IF = ƒ (VF) Peak forward current IFM = ƒ (tp) 150 BAR 74 EHB00013 10 2 BAR 74 EHB00014 ΙF mA Ι FM A 10 1 D = 0.005 0.01 0.02 0.05 0.1 0.2 100 typ max 10 0 50 10 -1 tp D= T tp T 0 0 0.5 1.0 V VF 1.5 10-2 10-6 10-5 10-4 10-3 10-2 10-1 s 100 t 3 2007-04-19 BAL74/BAR74... Forward current IF = ƒ (T S) BAL74, BAR74 300 mA 200 IF 150 100 50 0 0 15 30 45 60 75 90 105 120 °C 150 TS 4 2007-04-19 Package SOT23 BAL74/BAR74... Package Outline 0.15 MIN. 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.9 ±0.1 3 B 2.4 ±0.15 10˚ MAX. 0.4 +0.1 -0.05 1) 1 2 10˚ MAX. C 0.95 1.9 0.08...0.1 A 5 0...8˚ 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 5 2007-04-19 BAL74/BAR74... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-19