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BAL99_07

BAL99_07

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    BAL99_07 - Silicon Switching Diode - Infineon Technologies AG

  • 数据手册
  • 价格&库存
BAL99_07 数据手册
BAL99... Silicon Switching Diode • For high-speed switching applications • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAL99 !  Type BAL99 Parameter Diode reverse voltage Peak reverse voltageForward current Peak forward current Package SOT23 Configuration single Symbol VR VRM IF IFM IFS Ptot Tj Tstg Value 80 85 250 4.5 370 150 -65 ... 150 Marking JFs Unit V mA A mW °C Maximum Ratings at TA = 25°C, unless otherwise specified Surge forward current, t = 1 µs Total power dissipation TS ≤ 54°C Junction temperature Storage temperature Thermal Resistance Parameter Junction - soldering point 2) 1Pb-containing 2For Symbol RthJS Value ≤ 260 Unit K/W package may be available upon special request calculation of RthJA please refer to Application Note Thermal Resistance 1 2007-04-19 BAL99... Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. DC Characteristics 85 V Breakdown voltage V(BR) I(BR) = 100 µA Reverse current VR = 70 V VR = 25 V, TA = 150 °C VR = 70 V, TA = 150 °C Forward voltage IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA , RL = 100 Ω Test circuit for reverse recovery time D.U.T. IR VF 715 855 1000 1250 1 30 50 µA mV CT trr - - 1.5 4 pF ns Puls generator: tp = 100ns, D = 0.05, tr = 0.6ns, Ri = 50Ω Oscillograph ΙF EHN00014 Oscillograph: R = 50, tr = 0.35ns C ≤ 1pf 2 2007-04-19 BAL99... Reverse current IR = ƒ (TA) VR = Parameter 10 5 nA BAL 99 EHB00007 Forward Voltage VF = ƒ (TA) IF = Parameter 1.0 V BAL 99 EHB00010 ΙR 10 4 5 max. VR = 70 V VF Ι F = 100 mA 10 mA 70V 25V 10 3 5 typ. 0.5 1 mA 0.1 mA 10 2 5 10 1 0 50 100 TA ˚C 150 0 0 50 100 TA ˚C 150 Forward current IF = ƒ (VF) Peak forward current IFM = ƒ (tp) TA = 25°C 150 BAL 99 EHB00008 10 2 BAL 99 EHB00009 ΙF mA Ι FM A 10 1 D = 0.005 0.01 0.02 0.05 0.1 0.2 100 typ max 10 0 50 10 -1 tp D= T tp T 0 0 0.5 1.0 V VF 1.5 10-2 10-6 10-5 10-4 10-3 10-2 10-1 s 100 t 3 2007-04-19 BAL99... Forward current IF = ƒ (T S) 300 mA 200 IF 150 100 50 0 0 15 30 45 60 75 90 105 120 °C 150 TS 4 2007-04-19 Package SOT23 BAL99... Package Outline 0.15 MIN. 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.9 ±0.1 3 B 2.4 ±0.15 10˚ MAX. 0.4 +0.1 -0.05 1) 1 2 10˚ MAX. C 0.95 1.9 0.08...0.1 A 5 0...8˚ 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 5 2007-04-19 BAL99... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-19
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