BAR63-02L

BAR63... Silicon PIN Diodes • PIN diode for high speed switching of RF signals • Very low forward resistance (low insertion loss) • Very low capacitance (high isolation) • For frequencies up to 3GHz • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAR63-02.. BAR63-03W BAR63-04 BAR63-04W ! BAR63-05 BAR63-05W ! BAR63-06 BAR63-06W !  , , , , , ,    Type BAR63-02L BAR63-02V BAR63-02W BAR63-03W BAR63-04 BAR63-04W BAR63-05 BAR63-05W BAR63-06 BAR63-06W 1Pb-containing Package TSLP-2-1 SC79 SCD80 SOD323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 Configuration single, leadless single single single series series common cathode common cathode common anode common anode LS(nH) 0.4 0.6 0.6 1.8 1.8 1.4 1.8 1.4 1.8 1.4 Marking G G GG G G4s G4s G5s G5s G6s G6s package may be available upon special request 1 2007-04-19 BAR63... Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage Forward current Total power dissipation BAR63-02L, TS ≤ 118°C BAR63-02V, -02W, BAR63-03W, TS ≤ 115°C BAR63-04...BAR63-06, TS ≤ 55°C BAR63-04S, TS ≤ 115°C BAR63-04W...BAR63-06W, TS ≤ 105°C Junction temperature Operating temperature range Storage temperature Thermal Resistance Parameter Junction - soldering point1) BAR63-02L BAR63-02V, BAR63-02W BAR63-03W BAR63-04...BAR63-06 BAR63-04S BAR63-04W...BAR63-06W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Breakdown voltage I(BR) = 5 µA Reverse current VR = 35 V Forward voltage IF = 100 mA 1For Symbol VR IF Ptot Value 50 100 250 250 250 250 250 Unit V mA mW Tj Top Tstg 150 -55 ... 125 -55 ... 150 °C Symbol RthJS Value ≤ 125 ≤ 140 ≤ 155 ≤ 380 ≤ 180 ≤ 180 Unit K/W Symbol min. V(BR) IR VF 50 - Values typ. 0.95 max. 10 1.2 Unit V nA V calculation of RthJA please refer to the Technical Information 2 2007-04-19 BAR63... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter AC Characteristics Diode capacitance VR = 5 V, f = 1 MHz VR = 0 V, 100 MHz ... 1.8 GHz Reverse parallel resistance VR = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz Forward resistance I F = 5 mA, f = 100 MHz I F = 10 mA, f = 100 MHz Charge carrier life time I F = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω I-region width Insertion loss1) I F = 1 mA, f = 1.8 GHz I F = 5 mA, f = 1.8 GHz I F = 10 mA, f = 1.8 GHz Isolation1) VR = 0 V, f = 0.9 GHz VR = 0 V, f = 1.8 GHz VR = 0 V, f = 2.45 GHz 1BAR63-02L Symbol min. CT RP rf - Values typ. max. Unit pF 0.21 0.3 500 15 5 0.3 kΩ - Ω 1.2 1 75 2 ns τ rr - WI IL - 4.5 0.15 0.11 0.1 - µm dB ISO 17.9 12.3 10 - in series configuration, Z = 50Ω 3 2007-04-19 BAR63... Diode capacitance CT = ƒ (VR) f = 1MHz - 1.8GHz Reverse parallel resistance RP = ƒ(V R) f = Parameter 10 3 KOhm 100 MHz 0.5 CT pF 0.4 EHD07139 10 2 1 GHz 0.3 Rp 10 1 1.8 GHz 0.2 10 0 0.1 0 0 10 20 V VR 30 10 -1 0 5 10 15 20 V 30 VR Forward resistance rf = ƒ (IF ) f = 100MHz Forward current IF = ƒ (VF) TA = Parameter EHD07138 10 2 rf Ω ΙF 10 3 mA 10 2 BAR 63... EHD07171 10 1 10 1 10 0 10 0 10 -1 25 ˚C 40 ˚C 85 ˚C 10 -2 10 -1 -2 10 10 -1 10 0 10 1 ΙF mA 10 2 10 -3 0.3 0.5 0.8 1 V VF 1.2 4 2007-04-19 BAR63... Forward current IF = ƒ (T S) BAR63-04...BAR63-06 Forward current IF = ƒ (T S) BAR63-02V, BAR63-02W 120 120 mA mA 80 80 IF 60 IF 60 40 40 20 20 0 0 90 105 120 °C 0 0 15 30 45 60 75 150 15 30 45 60 75 90 105 120 °C 150 TS TS Forward current IF = ƒ (T S) BAR63-03W Forward current IF = ƒ (T S) BAR63-04W...BAR63-06W 120 120 mA mA 80 80 IF 60 IF 60 40 40 20 20 0 0 90 105 120 °C 0 0 15 30 45 60 75 150 15 30 45 60 75 90 105 120 °C 150 TS TS 5 2007-04-19 BAR63... Permissible Puls Load RthJS = ƒ (tp) BAR63-04...BAR63-06 5 K/W EHB07146 Permissible Pulse Load IFmax / I FDC = ƒ (t p) BAR63-04...BAR63-06 Ι F max 10 Ι F DC 5 2 EHB07147 R thJS tP t D= P T T D= 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 5 D= 0.5 0.2 0.1 0.05 0.05 0.01 0.005 0 tP D= 10 0 10 -6 -5 -4 10 1 5 10 1 5 tP T 10 -3 T 10 -2 10 10 s tP 10 0 10 0 10 -6 10 -5 10 -4 10 -3 10 -2 s tP 10 0 Permissible Puls Load RthJS = ƒ (tp) BAR63-02V, BAR63-02W 10 3 Permissible Pulse Load IFmax / I FDC = ƒ (t p) BAR63-02V, BAR63-02W 10 1 K/W IFmax/ IFDC RthJS 10 2 - 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp 6 2007-04-19 BAR63... Permissible Puls Load RthJS = ƒ (tp) BAR63-03W 10 3 Permissible Pulse Load IFmax / I FDC = ƒ (t p) BAR63-03W 10 1 K/W I Fmax/ IFDC 10 2 - 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 RthJS 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp Permissible Puls Load RthJS = ƒ (tp) BAR63-04W...BAR63-06W 10 3 Permissible Pulse Load IFmax / I FDC = ƒ (t p) BAR63-04W...BAR63-06W 10 3 K/W - IFmax/ IFDC 10 2 10 2 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 RthJS 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp 7 2007-04-19 BAR63... Insertion loss IL = -|S21|2 = ƒ(f) IF = Parameter BAR63-02L in series configuration, Z = 50Ω 0 Isolation ISO = -|S21| 2 = ƒ(f) VR = Paramter BAR63-02L in series configuration, Z = 50Ω 0 dB dB 10 mA |S 21|² 5 mA 1 mA |S 21|² -10 -0.2 -15 -20 -0.3 -25 0V 1V 10 V -0.4 0 1 2 3 4 GHz 6 -30 0 1 2 3 4 GHz 6 f f 8 2007-04-19 Package SC79 BAR63... Package Outline 0.2 0.8 ±0.1 10˚MAX. M A 0.13 -0.03 +0.05 2 1.6 ±0.1 0.55 ±0.04 Foot Print 1.35 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.33 1.96 Cathode marking 0.4 0.93 8 0.2 ±0.05 0.66 Cathode marking 1 0.3 ±0.05 Cathode marking 10˚MAX. 1.2 ±0.1 A 9 2007-04-19 Package SCD80 BAR63... Package Outline 0.2 0.8 ±0.1 10˚MAX. M A +0.05 0.13 -0.03 A 7˚ ±1.5˚ 1.3 ±0.1 2 1.7 ±0.1 0.7 ±0.1 Foot Print 1.45 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.45 2.5 8 0.2 ±0.05 Cathode marking 1 0.3 ±0.05 Cathode marking 0.4 0.9 Cathode marking 0.7 10 2007-04-19 BAR63... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code M onth 2 0 03 01 02 03 04 05 06 07 08 09 10 11 12 a b c d e f g h j k l n 2 0 04 p q r s t u v x y z 2 3 2005 A B C D E F G H J K L N 2006 P Q R S T U V X Y Z 4 5 2 0 07 a b c d e f g h j k l n 2008 p q r s t u v x y z 2 3 2009 A B C D E F G H J K L N 2010 P Q R S T U V X Y Z 4 5 2011 a b c d e f g h j k l n 2012 p q r s t u v x y z 2 3 2 0 13 A B C D E F G H J K L N 2014 P Q R S T U V X Y Z 4 5 1 ) New Marking Layout for SC75, implemented at October 2005. . 11 2007-04-19 Package SOD323 BAR63... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 ±0.05 A 1.7 +0.2 -0.1 +0.05 0.3 -0.2 2 Cathode marking 1 0.3 +0.1 -0.05 0.25 M A 0.45 ±0.15 2.5 ±0.2 0.15 +0.1 -0.06 Foot Print 0.6 Marking Layout (Example) 0.8 1.7 0.8 BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 2 2.9 8 Cathode marking 0.65 1.35 1 12 2007-04-19 Package SOT23 BAR63... Package Outline 0.15 MIN. 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.9 ±0.1 3 B 2.4 ±0.15 10˚ MAX. 0.4 +0.1 -0.05 1) 1 2 10˚ MAX. C 0.95 1.9 0.08...0.1 A 5 0...8˚ 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 13 2007-04-19 Package SOT323 BAR63... Package Outline 2 ±0.2 0.3 +0.1 -0.05 3 1.25 ±0.1 2.1 ±0.1 0.9 ±0.1 3x 0.1 M 0.1 MAX. 0.1 A 1 0.65 0.65 2 0.1 MIN. 0.15 +0.1 -0.05 0.2 M A Foot Print 0.6 0.8 0.65 0.65 Marking Layout (Example) Manufacturer 1.6 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 2.15 2.3 8 1.1 14 2007-04-19 Package TSLP-2-1 BAR63... Package Outline Top view 0.05 MAX. 2 0.4 +0.1 Bottom view 0.6 ±0.05 0.65±0.05 2 1 1 1) 1) Cathode marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.45 0.275 0.6 0.35 0.35 0.925 0.3 1 Copper Solder mask Stencil apertures Marking Layout (Example) BAS16-02L Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 4 0.5 1.16 Cathode marking 0.76 8 0.275 0.375 0.25 ±0.035 0.5 ±0.035 1 ±0.05 15 2007-04-19 BAR63... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 16 2007-04-19