BAR66_07

BAR66... Silicon PIN Diode Array • Surge protection device • Designed for surge overvoltage clamping in antiparallel connection • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAR66 ! , ,  Type BAR66 Package SOT23 Configuration series LS(nH) 1.8 Marking PMs Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage Forward current Total power dissipation Ts ≤ 25 °C ESD contact discharge2) Peak pulse current ( tp = 8 / 20 µs)3) Junction temperature Operating temperature range Storage temperature Thermal Resistance Parameter Junction - soldering point 4), BAR 66 1Pb-containing 2V 3I Symbol VR IF Ptot VESD I pp Tj T op T stg Value 150 200 250 25 12 150 -55 ... 125 -55 ... 150 Unit V mA mW kV A °C Symbol RthJS Value ≤ 290 Unit K/W package may be available upon special request according to IEC61000-4-2, only valid if pin 1 and pin 2 are connected ESD 4For pp according to IEC61000-4-5, only valid if pin 1 and pin 2 are connected calculation of RthJA please refer to Application Note Thermal Resistance 1 2007-04-19 BAR66... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Breakdown voltage I(BR) = 5 µA Reverse current VR = 100 V Forward voltage IF = 50 mA Clamping voltage VESD = ± 15 kV (contact) 1) IPP = 12 A, tp = 8/20 µs2) VCL tbd 7 VF 0.95 1.2 V IR 20 nA V(BR) 150 V Symbol min. Values typ. max. Unit AC Characteristics Diode capacitance VR = 35 V, f = 1 MHz VR = 0 V, f = 100 MHz Zero bias conductance VR = 0 V, f = 1 GHz Forward resistance I F = 5 mA, f = 100 MHz Charge carrier life time I F = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω 1V 2I CT gP rf τ rr 0.4 0.35 220 1.5 0.7 0.6 0.9 1.8 - pF µS Ω µs ESD according to IEC61000-4-2, only valid if pin 1 and pin 2 are connected pp according to IEC61000-4-5, only valid if pin 1 and pin 2 are connected 2 2007-04-19 BAR66... Diode capacitance CT = ƒ (VR) f = Parameter Forward resistance rf = ƒ (I F) f = 100MHz 10 3 Ohm 0.8 pF 0.6 10 2 CT rf 1MHz 0.5 0.4 10 1 0.3 100MHz 0.2 10 0 0.1 10 -1 -2 10 0 0 5 10 15 20 25 V 35 10 -1 10 0 10 1 mA 10 2 VR IF Forward current IF = ƒ (VF) TA = Parameter 10 0 A Forward current IF = ƒ (T S) BAR66 220 mA 10 -1 180 160 10 -2 IF IF 10 -3 10 -4 140 120 100 -40 °C 25 °C 85 °C 125 °C 80 60 40 20 10 -5 10 -6 0 0.2 0.4 0.6 0.8 V 1.2 0 0 20 40 60 80 100 120 °C 150 VF TS 3 2007-04-19 BAR66... Permissible Puls Load RthJS = ƒ (tp) BAR66 10 K/W 3 Permissible Pulse Load IFmax / I FDC = ƒ (t p) BAR66 10 2 I Fmax/IFDC 10 2 - 10 1 10 1 10 0 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 R thJS 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tP tP 4 2007-04-19 Package SOT23 BAR66... Package Outline 0.15 MIN. 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.9 ±0.1 3 B 2.4 ±0.15 10˚ MAX. 0.4 +0.1 -0.05 1) 1 2 10˚ MAX. C 0.95 1.9 0.08...0.1 A 5 0...8˚ 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 5 2007-04-19 BAR66... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-19