BAR89...
Silicon PIN Diode • Optimized for antenna switches in hand held applications • Very low capacitance at zero volts reverse bias at frequencies above 1GHz (typ. 0.19 pF) • Low forward resistance (typ. 0.8Ω @ IF = 10mA) • Very low signal distortion • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101
BAR89-02LRH
Type BAR89-02LRH
Package TSLP-2-7
Configuration single, leadless
LS(nH) 0.4
Marking R
Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage Forward current Total power dissipation Ts ≤ 133°C Junction temperature Operating temperature range Storage temperature Thermal Resistance Parameter Junction - soldering point2)
1Pb-containing 2For
Symbol VR IF Ptot Tj Top Tstg
Value 80 100 250 150 -55 ... 125 -55 ... 150
Unit V mA mW °C
Symbol RthJS
Value ≤ 65
Unit K/W
package may be available upon special request calculation of RthJA please refer to Application Note Thermal Resistance
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BAR89...
Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Breakdown voltage I(BR) = 5 µA Reverse current VR = 60 V Forward voltage IF = 10 mA IF = 100 mA VF 0.83 0.95 0.9 1.1 V IR 50 nA V(BR) 80 V Symbol min. Values typ. max. Unit
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BAR89...
Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter AC Characteristics Diode capacitance VR = 1 V, f = 1 MHz VR = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz Reverse parallel resistance VR = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz Forward resistance I F = 1 mA, f = 100 MHz I F = 5 mA, f = 100 MHz I F = 10 mA, f = 100 MHz Charge carrier life time I F = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω I-region width Insertion loss1) I F = 1 mA, f = 1.8 GHz I F = 5 mA, f = 1.8 GHz I F = 10 mA, f = 1.8 GHz Isolation1) VR = 0 V, f = 0.9 GHz VR = 0 V, f = 1.8 GHz VR = 0 V, f = 2.45 GHz
1BAR89-02LRH
Symbol min. CT RP rf -
Values typ. max.
Unit
pF 0.25 0.25 0.19 0.18 0.35 kΩ 35 5 3.5 -
Ω
3 1.2 0.8 800 1.5 ns
τ rr
-
WI IL
-
19 0.23 0.1 0.08
-
µm dB
ISO 19 14 11 -
in series configuration, Z = 50Ω
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BAR89...
Diode capacitance CT = ƒ (VR) f = Parameter Reverse parallel resistance RP = ƒ(V R) f = Parameter
10 3
KOhm
0.5
pF
0.4
10 2
0.35
1 MHz 100 MHz 1 GHz 1.8 GHz
CT
Rp
10 1
0.3
0.25 10 0
0.2
100 MHz 1 GHz 1.8 GHz
0.15 10 -1 0
0.1 0
2
4
6
8
10
12
14
16
V
20
2
4
6
8
10
12
14
16
V
20
VR
VR
Forward resistance rf = ƒ (IF ) f = 100MHz
10 3
Ohm
Forward current IF = ƒ (VF) TA = Parameter
1A 0 0 10 -1 10 -2 10 -3
10 2
10 -4 10 -5 10 -6
10
1
-40°C +25°C +85°C +125°C
rf
10 0
IF
10 -7 10 -8
10 -1 -2 10
10
-1
10
0
10
1
10
2
mA 10
3
10 -9 0
0.2
0.4
0.6
0.8
V VF
1.2
IF
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BAR89...
Forward current IF = ƒ (T S) BAR89-02LRH Permissible Puls Load R thJS = ƒ (tp) BAR89-02LRH
10 2
120
mA
mA
100 90
RthJS
80
10 1
IF
70 60 50 40 30 20 10 0 0 15 30 45 60 75 90 105 120 °C 150 10 -1 -6 10 10
-5
10 0
0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0
10
-4
10
-3
10
-2
°C
10
0
TS
tp
Permissible Pulse Load IFmax / I FDC = ƒ (tp ) BAR89-02LRH
10 2
Insertion loss IL = -|S21| 2 = ƒ(f) IF = Parameter
BAR89-02LRH in series configuration, Z = 50Ω
0
dB
mA
-0.1
|S21|
-0.15
10
1
D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
10mA 5mA 1mA
IF
-0.2
-0.25
-0.3
-0.35 10 0 -6 10
10
-5
10
-4
10
-3
10
-2
10
-1
°C
10
1
-0.4 0
1
2
3
4
GHz
6
tp
f
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BAR89...
Isolation ISO = -|S21|2 = ƒ(f) VR = Parameter
BAR89-02LRH in series configuration, Z = 50Ω
0
dB
|S 21|
-10
-15
-20
0V 1V 10 V
-25
-30 0
1
2
3
4
GHz
6
f
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Package TSLP-2-7
BAR89...
Package Outline
Top view
0.39 +0.01 -0.03 0.05 MAX.
0.65 ±0.05
Bottom view
0.6 ±0.05
2
2 1
1
Cathode marking
0.5 ±0.035 1)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.35
0.45
0.3 0.925
1
0.275 0.275 0.375
0.6
Copper
Solder mask
0.35
Stencil apertures
Marking Layout (Example)
BAR90-02LRH Type code
Cathode marking Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional)
4
1.16
0.5
Cathode marking
0.76
8
0.25 ±0.035 1)
1±0.05
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BAR89...
Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved.
Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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