BAS28_07

BAS28... Silicon Switching Diode • For high-speed switching applications • Electrical insulated diodes • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAS28/W " ! , ,  Type BAS28 BAS28W Parameter Diode reverse voltage Peak reverse voltage Forward current Peak forward current Package SOT143 SOT343 Configuration parallel pair parallel pair Symbol VR VRM IF I FM I FS I FSM Ptot 330 250 Tj T stg 150 -55 ... 150 Value 80 85 200 4.5 - Marking JTs JTs Unit V mA A mW Maximum Ratings at TA = 25°C, unless otherwise specified Surge forward current, t = 1 µs Non-repetitive peak surge forward current Total power dissipation BAS28, T S ≤ 31°C BAS28W, TS ≤ 103°C Junction temperature Storage temperature 1Pb-containing °C package may be available upon special request 1 2007-04-19 BAS28... Thermal Resistance Parameter Junction - soldering point 1) BAS28 BAS28W Symbol RthJS Value ≤ 360 ≤ 190 Unit K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics 85 V Breakdown voltage V(BR) I(BR) = 100 µA Reverse current VR = 75 V VR = 25 V, TA = 150 °C VR = 75 V, TA = 150 °C Forward voltage IF = 1 mA IF = 10 mA IF = 50 mA IF = 100 mA IF = 150 mA VF 715 855 1000 1200 1250 IR 0.1 30 50 mV µA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA , RL = 100 Ω Test circuit for reverse recovery time D.U.T. CT trr - - 2 4 pF ns Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns, Ri = 50Ω Oscillograph ΙF EHN00019 Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF 1For calculation of RthJA please refer to Application Note Thermal Resistance 2 2007-04-19 BAS28... Reverse current IR = ƒ (TA) VR = Parameter 10 5 nA Forward Voltage VF = ƒ (TA) IF = Parameter 1.0 V BAS 28 EHB00037 VF 10 4 Ι F = 100 mA IR 10 mA 10 3 0.5 70 V 25 V 1 mA 0.1 mA 10 2 10 1 0 0 25 50 75 100 °C 150 0 50 100 TA C 150 TA Forward current IF = ƒ (VF) TA = 25 °C BAS 28 EHB00035 Peak forward current IFM = ƒ (tp) TA = 25 °C BAS28 10 2 BAS 28 EHB00036 150 ΙF mA Ι FM A 10 1 D = 0.005 0.01 0.02 0.05 0.1 0.2 100 typ max 10 0 50 10 -1 tp D= T tp T 0 0 0.5 1.0 V VF 1.5 10-2 10-6 10-5 10-4 10-3 10-2 10-1 s 100 t 3 2007-04-19 BAS28... Forward current IF = ƒ (T S) BAS28 Forward current IF = ƒ (T S) BAS28W 220 mA 220 mA 180 160 180 160 IF 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 IF 140 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS TS Permissible Puls Load RthJS = ƒ (tp) BAS28W 10 3 Permissible Pulse Load IFmax / I FDC = ƒ (t p) 10 2 BAS28W K/W IFmax/ IFDC - 10 2 10 1 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 RthJS 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp 4 2007-04-19 Package SOT143 BAS28... Package Outline 0.15 MIN. 2.9 ±0.1 1.9 4 3 B 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.4 ±0.15 10˚ MAX. 1 2 10˚ MAX. 0.2 0.8 +0.1 -0.05 0.4 +0.1 -0.05 1.7 0.25 M B 0.08...0.1 A 5 0...8˚ 0.2 M A Foot Print 0.8 1.2 0.8 0.9 1.2 0.8 0.8 Marking Layout (Example) Manufacturer RF s Pin 1 56 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.9 1.1 2005, June Date code (YM) BFP181 Type code 4 0.2 Pin 1 3.15 2.6 8 1.15 5 2007-04-19 Package SOT343 BAS28... Package Outline 2 ±0.2 1.3 4 3 0.15 1 0.3 +0.1 -0.05 4x 0.1 M +0.1 0.6 -0.05 0.9 ±0.1 0.1 MAX. 0.1 A 1.25 ±0.1 2.1 ±0.1 2 0.1 MIN. 0.15 -0.05 0.2 M +0.1 A Foot Print 0.6 0.8 1.15 0.9 Marking Layout (Example) Manufacturer 1.6 2005, June Date code (YM) Pin 1 BGA420 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 2.15 2.3 8 1.1 6 2007-04-19 BAS28... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2007-04-19