BAS3010A-03W

BAS3010A... Medium Power AF Schottky Diode • Forward current: 1 A • Reverse voltage: 30 V • Very low forward voltage (typ. 0.41V @ I F = 1A) • For high efficiency DC/DC conversion, fast switching, protection and clamping applications • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAS 3010A-03W  Type BAS3010A-03W Parameter Diode reverse voltage2) Forward current 2) Package SOD323 Configuration single Symbol VR IF Value 30 1 1 3.5 10 150 -65 ... 125 -65 ... 150 Marking 4/ blue Unit V A Maximum Ratings at TA = 25°C, unless otherwise specified Average rectified forward current (50/60Hz, sinus) I FAV Repetitive peak forward current I FRM (tp ≤ 1 ms, D ≤ 0.5) Non-repetitive peak surge forward current (t ≤ 10ms) Junction temperature Operating temperature range Storage temperature 1Pb-containing 2For I FSM Tj T op T stg °C package may be available upon special request TA > 25°C the derating of VR and IF has to be considered. Please refer to the attached curves. 1 2007-04-10 BAS3010A... Thermal Resistance Parameter Junction - soldering point 1) Symbol RthJS Value ≤ 82 Unit K/W Unit Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Reverse current2) IR VR = 5 V VR = 10 V VR = 30 V Forward voltage2) IF = 1 mA IF = 10 mA IF = 100 mA IF = 500 mA IF = 1 A VF 170 220 290 350 410 220 270 340 410 470 5 10 40 25 50 200 µA mV AC Characteristics Diode capacitance VR = 5 V, f = 1 MHz 1For CT - 28 35 pF calculation of RthJA please refer to Application Note Thermal Resistance test: tp = 300 µs; D = 0.01 2Pulsed 2 2007-04-10 BAS3010A... Diode capacitance CT = ƒ (VR) f = 1MHz 120 Reverse current IR = ƒ (TA) VR = Parameter 10 -2 A pF 10 -3 CT 80 10 -4 30 V 20 V 10 V 5V 60 10 -5 40 10 -6 20 IR 0 0 V 5 10 15 20 30 10 -7 0 25 50 75 100 °C 150 VR TA Reverse current IR = ƒ(VR) TA = Parameter 10 -2 A TA= 125°C Forward Voltage VF = ƒ (TA) IF = Parameter 0.5 V 10 -3 TA= 85°C 0.4 0.35 IF= 1 A 500 mA 100 mA 10 mA IR VF TA= 25°C V 10 -4 0.3 0.25 10 -5 0.2 0.15 10 -6 0.1 0.05 10 -7 0 5 10 15 20 30 0 -50 -25 0 25 50 75 100 °C 150 VR TA 3 2007-04-10 BAS3010A... Forward current IF = ƒ (VF) TA = Parameter 10 A 0 Permissible Reverse voltage VR = ƒ (TA) tp = Parameter, Duty cycle < 0.01 Device mounted on PCB with Rth = 160 k/W 35 V tp=300µs 10 -1 V Rmax 10 -2 25 IF 125 °C 85 °C 25 °C -40 °C 20 tp=100ms 15 DC 10 -3 10 5 10 -4 0 0.1 0.2 0.3 0.4 V 0.6 0 0 25 50 75 100 °C 150 VF TA Forward current IF = ƒ (T S) 1200 mA 800 IF 600 400 200 0 0 15 30 45 60 75 90 105 120 °C 150 TS 4 2007-04-10 Package SOD323 BAS3010A... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 ±0.05 A 1.7 +0.2 -0.1 +0.05 0.3 -0.2 2 Cathode marking 1 0.3 +0.1 -0.05 0.25 M A 0.45 ±0.15 2.5 ±0.2 0.15 +0.1 -0.06 Foot Print 0.6 Marking Layout (Example) 0.8 1.7 0.8 BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 2 2.9 8 Cathode marking 0.65 1.35 1 5 2007-04-10 BAS3010A... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-10