BAS3010S-03LRH

BAS3010S... Low VF Schottky Diode • Forward current: 1 A • Reverse voltage: 30 V • Low forward voltage and smallest package form factor (1.0 x 0.6 x < 0.4 mm) for mobile phone battery charger application • Pb-free (RoHS compliant) package1) • Qualified according AEC Q101 BAS3010S-03LRH 2 3 1 Type BAS3010S-03LRH* * Preliminary data Package TSLP-3-7 Configuration single Marking 1S Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage2) Forward current2)3) Repetitive peak forward current3) (tp ≤ 1 ms, D ≤ 0.25) Non-repetitive peak surge forward current3) (t ≤ 10 ms) Junction temperature Operating temperature range Storage temperature 1Pb-containing 2For 3Only Symbol VR IF IFRM IFSM Tj Top Tstg Value 30 1 3.5 5 150 -55 ... 125 -65 ... 150 Unit V A °C package may be available upon special request TA > 25°C the derating of VR and IF has to be considered. valid if pin 1 and 2 are connected in parallel 1 2007-08-16 BAS3010S... Thermal Resistance Parameter Junction - soldering point1) Symbol RthJS Value ≤ 38 Unit K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Reverse current2) IR VR = 5 V VR = 10 V VR = 30 V Forward voltage2) IF = 100 mA IF = 350 mA IF = 1000 mA VF 340 400 570 15 30 300 390 450 650 Unit µA mV AC Characteristics Diode capacitance VR = 5 V, f = 1 MHz 1For CT - 10 15 pF calculation of RthJA please refer to Application Note Thermal Resistance test: tp = 300 µs; D = 0.01 2Pulsed 2 2007-08-16 BAS3010S... Diode capacitance CT = ƒ (VR) f = 1MHz Reverse current IR = ƒ (TA) VR = Parameter 10 -2 A pF 35 10 -3 25 CT 20 10 -4 15 IR 10 10 -5 30 V 20 V 10 V 5V 5 0 0 5 10 15 20 V 30 10 -6 0 25 50 75 100 °C 150 VR TA Reverse current IR = ƒ(VR ) TA = Parameter 10 -2 A 10 -3 10 -4 10 -5 TA = + 25°C -6 Forward Voltage VF = ƒ (TA) IF = Parameter 0.65 TA = + 125°C V IF = 1A TA = + 85°C 0.55 0.5 VF 0.45 0.4 IR 10 IF = 350 mA 10 -7 0.35 10 -8 10 -9 10 -10 0 TA = - 40°C 0.3 0.25 0.2 -50 IF = 100 mA 5 10 15 20 V 30 -25 0 25 50 75 100 °C 150 VR TA 3 2007-08-16 BAS3010S... Forward current IF = ƒ (VF) TA = Parameter 10 1 A 10 0 10 -1 IF 10 -2 10 -3 TA= +125°C +85°C +25°C - 40°C 10 -4 10 -5 10 -6 0 0.1 0.2 0.3 0.4 V 0.6 VF 4 2007-08-16 Package TSLP-3-7 BAS3010S... Package Outline Top view Bottom view Cathode 2) marking 0.6 ±0.05 0.5 ±0.035 0.65 ±0.05 1) 0.05 MAX. 3 2 1 ±0.05 3 1 2 1 2 x 0.25 ±0.035 0.315 1) Pin 1 marking 0.35 ±0.05 2 x 0.15 ±0.035 1) 1) Dimension applies to plated terminal 2) Only for diodes, cathode marking on pin 3 Foot Print For board assembly information please refer to Infineon website "Packages" 0.45 0.6 0.275 0.35 0.35 0.945 0.3 1 0.2 0.225 0.225 0.15 Copper Solder mask R0.1 0.2 0.17 Stencil apertures Marking Layout Type code 0.355 0.25 ±0.035 Type code Cathode marking 0.5 0.39 +0.01 -0.03 Pin 1 marking Standard Only for diodes, cathode marking on pin 3 Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Standard 4 1.16 Only for diodes, cathode marking on pin 3 4 1.16 8 Pin 1 marking 0.76 Cathode marking 0.76 8 1) 5 2007-08-16 BAS3010S... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-08-16