BAS4002S-02LRH

BAS4002S-02LRH Low VF Schottky Diode • Reverse voltage: 40 V • Forward current: 0.2 A • Low forward voltage and smallest package form factor (1.0 x 0.6 x < 0.4 mm) for mobile phone battery charger application • Pb-free (RoHS compliant) package • Qualified according AEC Q101 BAS4002S-02LRH 1 2 Type BAS4002S-02LRH Parameter Package TSLP-2-17 Configuration single Symbol VR IF I FSM Tj T op T stg RthJS Value Marking 2A Unit Maximum Ratings at TA = 25 °C, unless otherwise specified Diode reverse voltage1) Forward current1), TS ≤ 138 °C Non-repetitive peak surge forward current (t ≤ 10 ms) Junction temperature Operating temperature range Storage temperature Thermal Resistance Junction - soldering point2) 1For 2For 40 0.2 2 150 -55 ...150 -65 ...150 ≤ 60 V A °C K/W TA > 25 °C the derating of VR and IF has to be considered. calculation of RthJA please refer to Application Note Thermal Resistance 1 2009-02-02 BAS4002S-02LRH Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Reverse current1) IR VR = 5 V VR = 10 V VR = 40 V Unit µA VF 210 270 330 420 470 0.5 1 10 mV 250 310 370 470 550 Forward voltage1) IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 100 mA IF = 200 mA - AC Characteristics Diode capacitance VR = 5 V, f = 1 MHz 1Pulsed CT - 7 12 pF test: tp = 300 µs, D = 0.01 2 2009-02-02 BAS4002S-02LRH Diode capacitance CT = ƒ (VR) f = 1MHz Reverse current IR = ƒ (TA) VR = Parameter 10 -3 A 30 pF 24 22 10 -4 VR = 40V 10V 5V CT IR V 20 18 16 14 12 10 8 6 4 2 0 0 5 10 15 20 25 30 40 10 -5 10 -6 10 -7 10 -8 0 25 50 75 100 °C 150 VR TA Reverse current IR = ƒ(VR) TA = Parameter 10 -3 A Forward Voltage VF = ƒ (TA) IF = Parameter 580 V 10 -4 500 460 IF=200mA VF IR 10 -5 420 380 340 300 IF=100mA 10 -6 TA = 125°C 85°C 25°C IF=10mA 10 -7 260 220 10 -8 0 5 10 15 20 25 30 °C 40 180 -50 -30 -10 10 30 50 70 90 °C 130 TA TA 3 2009-02-02 BAS4002S-02LRH Forward current IF = ƒ (VF) Permissible Reverse voltage V R = ƒ (TA) tp = Paramter, Duty cycle < 0.01 Device mounted on PCB with Rth = 160 K/W 10 A 0 50 V 10 -1 40 10 -2 35 tp=300µs tp=100ms DC VR TA= -40 °C 25 °C 85 °C 125 °C V IF 30 25 20 15 10 5 10 -3 10 -4 10 -5 10 -6 0 0.1 0.2 0.3 0.4 0.55 0 0 20 40 60 80 100 120 °C 160 VF TA Forward current IF = ƒ (T S) BAS4002S-02LRH 220 mA 180 160 IF 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS 4 2009-02-02 Package TSLP-2-17 BAS4002S-02LRH Package Outline Top view 0.39 +0.01 -0.03 0.05 MAX. 0.65 ±0.05 Bottom view 0.6 ±0.05 2 2 1 1 Cathode marking 0.5 ±0.035 1) 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.35 0.45 0.3 0.925 1 0.275 0.275 0.375 0.6 Copper Solder mask 0.35 Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 4 1.16 0.5 Cathode marking 0.76 8 0.25 ±0.035 1) 1±0.05 5 2009-02-02 BAS4002S-02LRH Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2009-02-02