BAT54-03W

BAT54... Silicon Schottky Diodes • For low-loss, fast-recovery, meter protection, bias isolation and clamping application • Guard ring protected • Low forward voltage • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAT54-02LRH BAT54-02V BAT54-03W BAT54 BAT54W ! BAT54-04 BAT54-04W ! BAT54-05 BAT54-05W ! BAT54-06 BAT54-06W !  , , , , , ,     Type BAT54 BAT54-02LRH BAT54-02V BAT54-03W* BAT54-04 BAT54-04W BAT54-05 BAT54-05W BAT54-06 BAT54-06W BAT54W * Preliminary data 1Pb-containing Package SOT23 TSLP-2-7 SC79 SOD323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT323 Configuration single single single single series series common cathode common cathode common anode common anode single LS(nH) 1.8 0.4 0.6 1.8 1.8 1.4 1.8 1.4 1.8 1.4 1.4 Marking T 54 b 5/blue TS TS TC TC TA TA T5 package may be available upon special request 1 2008-04-30 BAT54... Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage Forward current Non-repetitive peak surge forward current (t ≤ 10 ms) Repetitive peak forward current1) tp ≤ 1 s, δ = 0.5 Total power dissipation BAT54, TS ≤ 94 °C BAT54-02LRH, TS ≤ 135 °C BAT54-02V, TS ≤ 126 °C BAT54-03W, TS ≤ tbd °C BAT54-04, TS ≤ 71 °C BAT54-04W, TS ≤ 117 °C BAT54-05, TS ≤ 48 °C BAT54-05W, TS ≤ 110 °C BAT54-06, TS ≤ 71 °C BAT54-06W, TS ≤ 117 °C BAT54W, TS ≤ 125 °C Junction temperature Storage temperature 1Device Symbol VR IF I FSM I FRM Ptot Value 30 200 600 300 Unit V mA mA mW 230 230 230 230 230 230 230 230 230 230 230 Tj T stg 150 -65 ... 150 °C mounted on epoxy PCB 40 x 40 x 1.5 mm / 6 cm² Cu 2 2008-04-30 BAT54... Thermal Resistance Parameter Junction - soldering point 1) BAT54 BAT54-02LRH BAT54-02V BAT54-03W BAT54-04 BAT54-04W BAT54-05 BAT54-05W BAT54-06 BAT54-06W BAT54W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Breakdown voltage2) I(BR) = 10 µA Reverse current2) VR = 25 V Forward voltage2) IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA 1For Symbol RthJS Value ≤ 245 ≤ 65 ≤ 105 ≤ tbd ≤ 345 ≤ 145 ≤ 445 ≤ 175 ≤ 345 ≤ 145 ≤ 110 Unit K/W Symbol min. V(BR) IR VF 30 - Values typ. max. 2 Unit V µA mV - 240 320 400 500 800 calculation of RthJA please refer to Application Note Thermal Resistance test: tp = 300 µs; D = 0.01 2Pulsed 3 2008-04-30 BAT54... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter AC Characteristics Diode capacitance VR = 1 V, f = 1 MHz Reverse recovery time I F = 10 mA, IR = 10 mA, measured IR = 1 mA , RL = 100 Ω trr 5 ns CT 10 pF Symbol min. Values typ. max. Unit 4 2008-04-30 BAT54... Diode capacitance CT = ƒ (VR) f = 1MHz 10 pF Reverse current IR = ƒ (TA) VR = Parameter 10 3 µA 8 7 10 2 IR(25V) CT 6 5 4 3 2 1 0 0 V IR 10 1 IR(5V) 10 0 5 10 15 20 30 10 -1 25 50 75 °C 125 VR TA Reverse current IR = ƒ(VR) TA = Parameter 10 3 µA 125°C Forward Voltage VF = ƒ (TA) IF = Parameter 0.5 V 30mA 10 2 VF IR 85°C 0.3 10mA 10 1 0.2 1mA 0.1mA 10 0 0.1 25°C 10 -1 0 5 10 15 20 V 30 0 -50 -25 0 25 50 75 °C 125 VR TA 5 2008-04-30 BAT54... Forward current IF = ƒ (VF) TA = Parameter 10 0 A Forward current IF = ƒ (T S) BAT54 220 mA 10 -1 180 160 IF 10 -2 IF 125°C 85°C 25°C - 40°C V 140 120 100 80 60 40 20 10 -3 10 -4 10 -5 0 0.2 0.4 0.6 0.8 1.2 0 0 15 30 45 60 75 90 105 120 °C 150 VF TS Forward current IF = ƒ (T S) BAT54-02LRH Forward current IF = ƒ (T S) BAT54-02V 220 mA 220 mA 180 160 180 160 IF 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 IF 140 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS TS 6 2008-04-30 BAT54... Forward current IF = ƒ (T S) BAT54-04 Forward current IF = ƒ (T S) BAT54-04W 220 mA 220 mA 180 160 180 160 IF 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 IF 140 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS TS Forward current IF = ƒ (T S) BAT54-05 Forward current IF = ƒ (T S) BAT54-05W 220 mA 220 mA 180 160 180 160 IF 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 IF 140 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS TS 7 2008-04-30 BAT54... Forward current IF = ƒ (T S) BAT54-06 Forward current IF = ƒ (T S) BAT54-06W 220 mA 220 mA 180 160 180 160 IF 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 IF 140 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS TS Forward current IF = ƒ (T S) BAT54W 220 mA 180 160 IF 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS 8 2008-04-30 Package SC79 BAT54... Package Outline 0.2 0.8 ±0.1 10˚MAX. M A 0.13 -0.03 +0.05 2 1.6 ±0.1 0.55 ±0.04 Foot Print 1.35 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.33 1.96 Cathode marking 0.4 0.93 8 0.2 ±0.05 0.66 Cathode marking 1 0.3 ±0.05 Cathode marking 10˚MAX. 1.2 ±0.1 A 9 2008-04-30 BAT54... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code M onth 2 0 03 01 02 03 04 05 06 07 08 09 10 11 12 a b c d e f g h j k l n 2 0 04 p q r s t u v x y z 2 3 2005 A B C D E F G H J K L N 2006 P Q R S T U V X Y Z 4 5 2 0 07 a b c d e f g h j k l n 2008 p q r s t u v x y z 2 3 2009 A B C D E F G H J K L N 2010 P Q R S T U V X Y Z 4 5 2011 a b c d e f g h j k l n 2012 p q r s t u v x y z 2 3 2 0 13 A B C D E F G H J K L N 2014 P Q R S T U V X Y Z 4 5 1 ) New Marking Layout for SC75, implemented at October 2005. . 10 2008-04-30 Package SOT23 BAT54... Package Outline 0.15 MIN. 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.9 ±0.1 3 B 2.4 ±0.15 10˚ MAX. 0.4 +0.1 -0.05 1) 1 2 10˚ MAX. C 0.95 1.9 0.08...0.1 A 5 0...8˚ 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 11 2008-04-30 Package SOT323 BAT54... Package Outline 2 ±0.2 0.3 +0.1 -0.05 3 1.25 ±0.1 2.1 ±0.1 0.9 ±0.1 3x 0.1 M 0.1 MAX. 0.1 A 1 0.65 0.65 2 0.1 MIN. 0.15 +0.1 -0.05 0.2 M A Foot Print 0.6 0.8 0.65 0.65 Marking Layout (Example) Manufacturer 1.6 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 2.15 2.3 8 1.1 12 2008-04-30 Package TSLP-2-7 BAT54... Package Outline Top view 0.39 +0.01 -0.03 0.05 MAX. 0.65 ±0.05 Bottom view 0.6 ±0.05 2 2 1 1 Cathode marking 0.5 ±0.035 1) 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.35 0.45 0.3 0.925 1 0.275 0.275 0.375 0.6 Copper Solder mask 0.35 Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 4 1.16 0.5 Cathode marking 0.76 8 0.25 ±0.035 1) 1±0.05 13 2008-04-30 BAT54... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 14 2008-04-30