BAW101...
Silicon Switching Diode • Electrically insulated high-voltage medium-speed diodes • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101
BAW101
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Type BAW101
Package SOT143
Configuration parallel
Marking JPs
Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage Peak reverse voltage Forward current Peak forward current Peak forward current Surge forward current, t = 1 µs Non-repetitive peak surge forward current Total power dissipation TS ≤ 35°C Junction temperature Storage temperature
1Pb-containing
Symbol VR VRM IF IFM IFM IFS IFSM Ptot Tj Tstg
Value 300 300 250 500 500 4.5 350 150 -65 ... 150
Unit V mA mA A mW °C
package may be available upon special request
1
2007-04-20
BAW101...
Thermal Resistance Parameter Junction - soldering point1) BAW101
Symbol
RthJS
Value ≤ 330
Unit K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. DC Characteristics 300 V Breakdown voltage V(BR) I(BR) = 100 µA Reverse current VR = 250 V VR = 250 V, TA = 150 °C Forward voltage IF = 100 mA
AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA, RL = 100 Ω Test circuit for reverse recovery time
D.U.T.
IR VF 0.15 50 1.3
µA
V
CT trr
-
6 1
-
pF µs
Pulse generator: tp = 10µs, D = 0.05, tr = 0.6ns, Ri = 50Ω
Oscillograph
ΙF
Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF
EHN00019
1For
calculation of RthJA please refer to Application Note Thermal Resistance
2
2007-04-20
BAW101...
Reverse current IR = ƒ (TA) VR = 250V
10 5 nA
BAW 101 EHB00104
Forward Voltage VF = ƒ (TA) IF = Parameter
1
V
ΙR
10 4 5
max.
0.9
100mA
VF
0.85
10 3 5
typ.
0.8
0.75
10mA
10 2 5
0.7
0.65
10 1
0
50
100
˚C TA
150
0.6 -40 -20
0
20
40
60
80
100 120 °C 150
TA
Forward current IF = ƒ (VF) TA = 25°C
10 0
BAW 101 EHB00103
Forward current IF = ƒ (T S) BAW101
300
ΙF
A
mA
10 -1 5
IF
200
150
10-2 5
100
50
10-3
0
1.0 VF
V
2.0
0 0
15
30
45
60
75
90 105 120 °C
150
TS
3
2007-04-20
Package SOT143
BAW101...
Package Outline
0.15 MIN.
2.9 ±0.1 1.9
4 3
B
1 ±0.1 0.1 MAX.
1.3 ±0.1
2.4 ±0.15
10˚ MAX.
1
2
10˚ MAX.
0.2 0.8 +0.1 -0.05 0.4 +0.1 -0.05 1.7 0.25 M B
0.08...0.1
A
5
0...8˚ 0.2 M A
Foot Print
0.8 1.2 0.8
0.9
1.2 0.8
0.8
Marking Layout (Example)
Manufacturer
RF s
Pin 1
56
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel
0.9
1.1
2005, June Date code (YM)
BFP181 Type code
4
0.2
Pin 1
3.15
2.6 8
1.15
4
2007-04-20
BAW101...
Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved.
Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
5
2007-04-20
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