BBY58-02V

BBY58... Silicon Tuning Diodes • Excellent linearity • High Q hyperabrupt tuning diode • Low series resistance • Designed for low tuning voltage operation for VCO's in mobile communications equipment • For low frequency control elements such as TCXOs and VCXOs • Very low capacitance spread • Pb-free (RoHS compliant) package1) • Qualified according AEC Q101 BBY58-02L/V BBY58-02W BBY58-03W BBY58-05W BBY58-06W ! !  , , , ,   Type BBY58-02L BBY58-02V BBY58-02W BBY58-03W BBY58-05W BBY58-06W Package TSLP-2-1 SC79 SCD80 SOD323 SOT323 SOT323 Configuration single, leadless single single single common cathode common anode LS(nH) 0.4 0.6 0.6 0.6 1.4 1.4 Marking 88 8 88 8 yel. B5s B6s Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage Forward current Operating temperature range Storage temperature 1Pb-containing Symbol VR IF Top Tstg Value 10 20 -55 ... 150 -55 ... 150 Unit V mA °C package may be available upon special request 1 2007-09-19 BBY58... Electrical Characteristics at T A = 25°C, unless otherwise specified Parameter DC Characteristics Reverse current VR = 8 V VR = 8 V, TA = 85 °C AC Characteristics Diode capacitance VR = 1 V, f = 1 MHz VR = 2 V, f = 1 MHz VR = 3 V, f = 1 MHz VR = 4 V, f = 1 MHz VR = 6 V, f = 1 MHz Capacitance ratio VR = 1 V, VR = 3 V, f = 1 MHz Capacitance ratio VR = 1 V, VR = 4 V, f = 1 MHz Capacitance ratio VR = 4 V, VR = 6 V, f = 1 MHz Series resistance VR = 1 V, f = 470 MHz, BBY58-02L, -07L4 VR = 1 V, f = 470 MHz, all other rS 0.3 0.25 Ω CT4/C T6 1.15 1.3 1.45 CT1/C T4 2.7 3.05 3.5 CT1/C T3 CT 17.5 11.4 7.8 5.5 3.8 1.9 18.3 12.35 8.6 6 4.7 2.15 19.3 13.3 9.3 6.6 5.5 2.4 pF Symbol min. IR - Values typ. max. Unit nA 10 100 2 2007-09-19 BBY58... Diode capacitance CT = ƒ (VR) f = 1MHz Normalized diode capacitance C(TA)/C(25°C)= ƒ(TA) f = 1MHz, VR = Parameter 1.05 - 32 pF 1.03 1V 4V CTA/C25 V 24 1.02 1.01 1 0.99 0.98 CT 20 16 12 8 0.97 4 0.96 0.95 -30 0 0 0.5 1 1.5 2 2.5 3 3.5 4 5 -10 10 30 50 70 °C 100 VR TA Temperature coefficient of the diode capacitance TCc = ƒ (VR) 10 -3 TCC 1/°C 10 -4 0 0.5 1 1.5 2 2.5 3 3.5 4 V 5 VR 3 2007-09-19 Package SC79 BBY58... Package Outline 0.2 0.8 ±0.1 10˚MAX. M A 0.13 -0.03 +0.05 2 1.6 ±0.1 0.55 ±0.04 Foot Print 1.35 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.33 1.96 Cathode marking 0.4 0.93 8 0.2 ±0.05 0.66 Cathode marking 1 0.3 ±0.05 Cathode marking 10˚MAX. 1.2 ±0.1 A 4 2007-09-19 Package SCD80 BBY58... Package Outline 0.2 0.8 ±0.1 10˚MAX. M A +0.05 0.13 -0.03 A 7˚ ±1.5˚ 1.3 ±0.1 2 1.7 ±0.1 0.7 ±0.1 Foot Print 1.45 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.45 2.5 8 0.2 ±0.05 Cathode marking 1 0.3 ±0.05 Cathode marking 0.4 0.9 Cathode marking 0.7 5 2007-09-19 BBY58... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code M onth 2 0 03 01 02 03 04 05 06 07 08 09 10 11 12 a b c d e f g h j k l n 2 0 04 p q r s t u v x y z 2 3 2005 A B C D E F G H J K L N 2006 P Q R S T U V X Y Z 4 5 2 0 07 a b c d e f g h j k l n 2008 p q r s t u v x y z 2 3 2009 A B C D E F G H J K L N 2010 P Q R S T U V X Y Z 4 5 2011 a b c d e f g h j k l n 2012 p q r s t u v x y z 2 3 2 0 13 A B C D E F G H J K L N 2014 P Q R S T U V X Y Z 4 5 1 ) New Marking Layout for SC75, implemented at October 2005. . 6 2007-09-19 Package SOD323 BBY58... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 ±0.05 A 1.7 +0.2 -0.1 +0.05 0.3 -0.2 2 Cathode marking 1 0.3 +0.1 -0.05 0.25 M A 0.45 ±0.15 2.5 ±0.2 0.15 +0.1 -0.06 Foot Print 0.6 Marking Layout (Example) 0.8 1.7 0.8 BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 2 2.9 8 Cathode marking 0.65 1.35 1 7 2007-09-19 Package SOT323 BBY58... Package Outline 2 ±0.2 0.3 +0.1 -0.05 3 1.25 ±0.1 2.1 ±0.1 0.9 ±0.1 3x 0.1 M 0.1 MAX. 0.1 A 1 0.65 0.65 2 0.1 MIN. 0.15 +0.1 -0.05 0.2 M A Foot Print 0.6 0.8 0.65 0.65 Marking Layout (Example) Manufacturer 1.6 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 2.15 2.3 8 1.1 8 2007-09-19 Package TSLP-2-1 BBY58... Package Outline Top view 0.05 MAX. 2 0.4 +0.1 Bottom view 0.6 ±0.05 0.65±0.05 2 1 1 1) 1) Cathode marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.45 0.35 0.275 0.6 0.35 0.925 0.3 1 Copper Solder mask Stencil apertures Marking Layout (Example) BAS16-02L Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 4 0.5 1.16 Cathode marking 0.76 8 0.275 0.375 0.25 ±0.035 0.5 ±0.035 1 ±0.05 9 2007-09-19 BBY58... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 10 2007-09-19