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BC856_08

BC856_08

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    BC856_08 - PNP Silicon AF Transistor - Infineon Technologies AG

  • 数据手册
  • 价格&库存
BC856_08 数据手册
BC856...-BC860... PNP Silicon AF Transistor • For AF input stages and driver applications • High current gain • Low collector-emitter saturation voltage • Low noise between 30 hz and 15 kHz • Complementary types: BC846...-BC850... (NPN) • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 1Pb-containing package may be available upon special request 1 2008-04-29 BC856...-BC860... Type BC856A BC856B BC856BW BC857A BC857B BC857BF* BC857BL3 BC857BW BC857C BC857CW BC858A BC858B BC858BL3 BC858BW BC858C BC858CW BC859C BC860B BC860BW BC860CW * Not for new design Marking 3As 3Bs 3Bs 3Es 3Fs 3Fs 3F 3Fs 3Gs 3Gs 3Js 3Ks 3K 3Ks 3Ls 3Ls 4Cs 4Fs 4Fs 4Gs 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B Pin Configuration 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C Package SOT23 SOT23 SOT323 SOT23 SOT23 TSFP-3 TSLP-3-1 SOT323 SOT23 SOT323 SOT23 SOT23 TSLP-3-1 SOT323 SOT23 SOT323 SOT23 SOT23 SOT323 SOT323 2 2008-04-29 BC856...-BC860... Maximum Ratings Parameter Collector-emitter voltage BC856... BC857..., BC860... BC858..., BC859... Collector-base voltage BC856... BC857..., BC860... BC858..., BC859... Emitter-base voltage Collector current Peak collector current, tp ≤ 10 ms Total power dissipation TS ≤ 71 °C, BC856-BC860 TS ≤ 128 °C, BC857BF-BC858BF TS ≤ 135 °C, BC857BL3, BC860BL3 TS ≤ 124 °C, BC856W-BC860W Junction temperature Storage temperature Thermal Resistance Parameter Junction - soldering point 1) BC856-BC860 BC857BF-BC858BF BC857BL3, BC858BL3 BC856W-BC860W 1For Symbol VCEO Value 65 45 30 Unit V VCBO 80 50 30 VEBO IC ICM Ptot 330 250 250 250 Tj Tstg Symbol RthJS 150 -65 ... 150 Value ≤ 240 ≤ 90 ≤ 60 ≤ 105 Unit K/W °C 5 100 200 mW mA calculation of RthJA please refer to Application Note Thermal Resistance 3 2008-04-29 BC856...-BC860... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage V(BR)CEO V IC = 10 mA, IB = 0 , BC856... IC = 10 mA, IB = 0 , BC857..., BC860... IC = 10 mA, IB = 0 , BC858..., BC859... 65 45 30 V(BR)CBO - µA Collector-base breakdown voltage IC = 10 µA, IE = 0 , BC856... IC = 10 µA, IE = 0 , BC857..., BC860... IC = 10 µA, IE = 0 , BC858..., BC859... 80 50 30 V(BR)EBO I CBO Emitter-base breakdown voltage IE = 1 µA, IC = 0 5 Collector-base cutoff current VCB = 45 V, IE = 0 VCB = 30 V, IE = 0 , TA = 150 °C h FE 140 250 480 180 290 520 0.015 5 250 475 800 mV DC current gain1) IC = 10 µA, VCE = 5 V, hFE-grp.A IC = 10 µA, VCE = 5 V, hFE-grp.B IC = 10 µA, VCE = 5 V, hFE-grp.C IC = 2 mA, VCE = 5 V, hFE-grp.A IC = 2 mA, VCE = 5 V, hFE-grp.B IC = 2 mA, VCE = 5 V, hFE-grp.C 125 220 420 VCEsat Collector-emitter saturation voltage1) IC = 10 mA, IB = 0.5 mA IC = 100 mA, IB = 5 mA VBEsat 75 250 700 850 650 - 300 650 750 820 Base emitter saturation voltage1) IC = 10 mA, IB = 0.5 mA IC = 100 mA, IB = 5 mA VBE(ON) Base-emitter voltage1) IC = 2 mA, VCE = 5 V IC = 10 mA, VCE = 5 V 1Pulse 600 - test: t < 300µs; D < 2% 4 2008-04-29 BC856...-BC860... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter AC Characteristics Transition frequency IC = 20 mA, VCE = 5 V, f = 100 MHz Collector-base capacitance VCB = 10 V, f = 1 MHz Emitter-base capacitance VEB = 0.5 V, f = 1 MHz Short-circuit input impedance IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.A IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.B IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.C Open-circuit reverse voltage transf. ratio IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.A IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.B IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.C Short-circuit forward current transf. ratio IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.A IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.B IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.C Open-circuit output admittance IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.A IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.B IC = 2 mA, VCE = 5 V, f = 1 kHz, h FE-grp.C Noise figure F h22e 18 30 60 1 4 dB h21e 200 330 600 µS h12e 1.5 2 3 h11e 2.7 4.5 8.7 10-4 kΩ Ceb 8 fT Ccb 250 1.5 MHz pF Symbol min. Values typ. max. Unit - IC = 0.2 mA, VCE = 5 V, f = 1 kHz, D f = 200 Hz, RS = 2 kΩ, BC859, BC850 Equivalent noise voltage IC = 200 mA, V CE = 5 V, R S = 2 kΩ, f = 10...50 Hz, BC860 Vn 0.11 µV 5 2008-04-29 BC856...-BC860... DC current gain hFE = ƒ(IC) VCE = 1 V 10 3 EHP00382 Collector-emitter saturation voltage IC = ƒ(VCEsat), hFE = 20 10 2 EHP00380 h FE 5 100 C 25 C ΙC mA 100 C 25 C -50 C 10 2 5 -50 C 10 1 5 10 1 5 10 5 0 10 0 10 -2 5 10 -1 5 10 0 5 10 1 mA 10 ΙC 2 10 -1 0 0.1 0.2 0.3 0.4 V 0.5 VCEsat Base-emitter saturation voltage IC = ƒ(V BEsat), hFE = 20 10 2 mA EHP00379 Collector cutoff current ICBO = ƒ(TA) VCBO = 30 V 10 4 nA EHP00381 ΙC 100 C 25 C -50 C Ι CB0 10 3 5 10 2 5 10 1 5 10 5 0 10 5 1 max typ 10 0 5 10 -1 10 -1 0 0.2 0.4 0.6 0.8 V 1.2 V BEsat 0 50 100 C TA 150 6 2008-04-29 BC856...-BC860... Transition frequency fT = ƒ(IC) VCE = 5 V 10 3 MHz EHP00378 Collector-base capacitance Ccb = ƒ(V CB) Emitter-base capacitance Ceb = ƒ(VEB) 12 pF fT 5 CCB(C EB) 10 9 8 7 6 5 10 2 5 4 3 2 1 CEB CCB 10 1 10 -1 5 10 0 5 10 1 mA 10 2 0 0 4 8 12 16 V 22 ΙC VCB(VEB) Total power dissipation Ptot = ƒ(TS) BC856-BC860 360 Total power dissipation Ptot = ƒ(TS) BC857BF, BC858BF 300 mW mW 300 270 250 225 Ptot 210 180 150 120 90 60 30 0 0 15 30 45 60 75 90 105 120 Ptot 240 200 175 150 125 100 75 50 25 °C 150 TS 0 0 15 30 45 60 75 90 105 120 °C 150 TS 7 2008-04-29 BC856...-BC860... Total power dissipation Ptot = ƒ(TS) BC857BL3, BC858BL3 300 mW Total power dissipation Ptot = ƒ(TS) BC856W-BC860W 300 mW 250 225 250 225 P tot 175 150 125 100 75 50 25 0 0 15 30 45 60 75 90 105 120 °C 150 P tot 200 200 175 150 125 100 75 50 25 0 0 15 30 45 60 75 90 105 120 °C 150 TS TS Permissible Pulse Load Ptotmax/P totDC = ƒ(tp) BC856/W-BC860/W 10 3 Ptot max 5 Ptot DC tp D= T tp T EHP00377 Permissible Puls Load R thJS = ƒ (tp) BC857BF, BC858BF 10 2 K/W 10 2 5 10 1 5 D= 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 0 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 0 10 -6 RthJS 10 -5 10 -4 10 -3 10 -2 s tp 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 8 2008-04-29 BC856...-BC860... Permissible Pulse Load Ptotmax/P totDC = ƒ(tp) BC857BF, BC858BF 10 3 Permissible Puls Load R thJS = ƒ (tp) BC857BL3, BC858BL3 10 2 P totmax/P totDC 10 2 RthJS 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 0 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 -1 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 tp tp Permissible Pulse Load Ptotmax/P totDC = ƒ(tp) BC857BL3, BC858BL3 10 3 Ptotmax/ PtotDC 10 2 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 0 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 9 2008-04-29 Package SOT23 BC856...-BC860... Package Outline 0.15 MIN. 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.9 ±0.1 3 B 2.4 ±0.15 10˚ MAX. 0.4 +0.1 -0.05 1) 1 2 10˚ MAX. C 0.95 1.9 0.08...0.1 A 5 0...8˚ 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 10 2008-04-29 Package SOT323 BC856...-BC860... Package Outline 2 ±0.2 0.3 +0.1 -0.05 3 1.25 ±0.1 2.1 ±0.1 0.9 ±0.1 3x 0.1 M 0.1 MAX. 0.1 A 1 0.65 0.65 2 0.1 MIN. 0.15 +0.1 -0.05 0.2 M A Foot Print 0.6 0.8 0.65 0.65 Marking Layout (Example) Manufacturer 1.6 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 2.15 2.3 8 1.1 11 2008-04-29 Package TSFP-3 BC856...-BC860... Package Outline 1.2 ±0.05 10˚ MAX. 0.8 ±0.05 0.2 ±0.05 1.2 ±0.05 0.2 ±0.05 0.4 0.45 3 0.55 ±0.04 1 2 0.2 ±0.05 0.4 ±0.05 0.4 ±0.05 0.15 ±0.05 Foot Print 0.4 0.4 Marking Layout (Example) Manufacturer 1.05 Pin 1 BCR847BF Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.3 1.2 1.5 8 0.2 Pin 1 1.35 0.7 12 2008-04-29 Package TSLP-3-1 BC856...-BC860... Package Outline Top view Bottom view 0.6 ±0.05 0.5 ±0.035 0.65 ±0.05 1) 0.05 MAX. 3 2 1 ±0.05 3 1 2 1 2 x 0.25 ±0.035 0.45 1) Pin 1 marking 0.35 ±0.05 2 x 0.15 ±0.035 1) 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.275 0.6 0.35 0.35 0.945 0.3 1 0.355 0.2 0.225 0.225 0.15 Copper Solder mask R0.1 0.2 0.17 Stencil apertures Marking Layout (Example) BFR193L3 Type code Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel 4 0.5 1.16 Pin 1 marking 0.76 8 0.315 0.25 ±0.035 0.4 +0.1 1) 13 2008-04-29 BC856...-BC860... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 14 2008-04-29
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