BFP405
NPN Silicon RF Transistor • For low current applications • For oscillators up to 12 GHz • Noise figure F = 1.25 dB at 1.8 GHz outstanding Gms = 23 dB at 1.8 GHz • SIEGET 25 GHz fT - Line • Pb-free (RoHS compliant) package • Qualified according AEC Q101
3 4 1
2
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type BFP405
Maximum Ratings Parameter
Marking ALs 1=B
Pin Configuration 2=E 3=C 4=E
Symbol VCEO 4.5 4.1 VCES VCBO VEBO IC IB Ptot Tj TA T stg 15 15 1.5 25 1 75 150
Package SOT343
Value Unit V
-
Collector-emitter voltage TA > 0 °C TA ≤ 0 °C Collector-emitter voltage Collector-base voltage Emitter-base voltage Collector current Base current Total power dissipation1) TS ≤ 108 °C Junction temperature Ambient temperature Storage temperature
1T
mA mW °C
-65 ... 150 -65 ... 150
S is measured on the collector lead at the soldering point to the pcb
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BFP405
Thermal Resistance Parameter Junction - soldering point 1) Symbol RthJS Value ≤ 555 Unit K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Collector-emitter breakdown voltage IC = 1 mA, I B = 0 Collector-emitter cutoff current VCE = 15 V, VBE = 0 Collector-base cutoff current VCB = 5 V, IE = 0 Emitter-base cutoff current VEB = 0.5 V, IC = 0 DC current gain IC = 5 mA, VCE = 4 V, pulse measured
1For
Symbol min. V(BR)CEO ICES ICBO IEBO hFE 4.5 60
Values typ. 5 95 max. 10 100 1 130
Unit
V µA nA µA -
calculation of RthJA please refer to Application Note Thermal Resistance
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BFP405
Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. AC Characteristics (verified by random sampling) Transition frequency fT IC = 10 mA, VCE = 3 V, f = 2 GHz Collector-base capacitance VCB = 2 V, f = 1 MHz, V BE = 0 , emitter grounded Collector emitter capacitance VCE = 2 V, f = 1 MHz, V BE = 0 , base grounded Emitter-base capacitance VEB = 0.5 V, f = 1 MHz, VCB = 0 , collector grounded Noise figure IC = 2 mA, VCE = 2 V, f = 1.8 GHz, ZS = ZSopt Power gain, maximum stable1) IC = 5 mA, VCE = 2 V, ZS = ZSopt, ZL = ZLopt , f = 1.8 GHz Insertion power gain VCE = 2 V, I C = 5 mA, f = 1.8 GHz, ZS = ZL = 50 Ω Third order intercept point at output2) VCE = 2 V, I C = 5 mA, f = 1.8 GHz, ZS = ZL = 50 Ω 1dB Compression point at output IC = 5 mA, VCE = 2 V, ZS = ZL = 50 Ω, f = 1.8 GHz
1G 2IP3
18 -
25 0.05
0.1
GHz pF
Ccb
Cce
-
0.24
-
Ceb
-
0.29
-
F G ms
-
1.25 23
-
dB dB
|S21| 2
14
18.5
-
IP 3
-
15
-
dBm
P-1dB
-
5
-
ms = |S21 / S12| value depends on termination of all intermodulation frequency components. Termination used for this measurement is 50Ω from 0.1 MHz to 6 GHz
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BFP405
Simulation Data For SPICE-model as well as for S-parameters including noise parameters refer to our internet website: www.infineon.com/rf.models . Please consult our website and download the latest version before actually starting your design. The simulation data have been generated and verified up to 12GHz using typical devices. The BFP405 nonlinear SPICE-model reflects the typical DC- and RF-device performance with high accuracy.
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BFP405
Total power dissipation Ptot = ƒ(TS) Permissible Pulse Load RthJS = ƒ(t p)
100
mW
10 3
80
Ptot
60 50 40 30 20 10 0 0 120 °C
RthJS
K/W
70
0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0
20 40 60 80 100 150 10 2 -7 10 10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
Ts
tp
Permissible Pulse Load Ptotmax/P totDC = ƒ(tp)
10 1
Collector-base capacitance Ccb= ƒ(VCB) f = 1MHz
0.3
Ptotmax /PtotDC
pF
-
D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
CCB
-2
0.2
0.15
0.1
0.05
10 0 -7 10
10
-6
10
-5
10
-4
10
-3
10
s
10
0
0 0
0.5
1
1.5
2
2.5
3
V
4
tp
VCB
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BFP405
Transition frequency fT= ƒ(IC) f = 2 GHz VCE = parameter in V
26
GHz 4V 3V 2V
Power gain Gma, Gms , |S 21|2 = ƒ (f) VCE = 3 V, I C = 5 mA
44
dB
22 20
1.5V
36 32 28
Gms
fT
18 16 14 12 10 8 6 4 0 4 8 12 16
0.5V 1V
G
24 20 16 12 8 4 22 0 0 1
|S21|²
Gma
mA
2
3
4
5
6
7
8 GHz
10
IC
f
Power gain Gma, Gms = ƒ (I C) VCE = 3V f = parameter in GHz
40
dB 0.15GHz
Power gain Gma, Gms = ƒ (VCE) IC = 5 mA f = parameter in GHz
40
dB 0.15GHz
32 28
0.45GHz 0.9GHz 1.5GHz 1.9GHz 2.4GHz 3.5GHz 5.5GHz
32 28
0.45GHz 0.9GHz 1.5GHz 2.4GHz
G
20 16 12 8
G
24
24 20 16 12 8
3.5GHz
5.5GHz
10GHz
10GHz
4 0 0
mA
4 0 0
V
4
8
12
16
20
26
1
2
3
4
6
IC
VCE
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BFP405
Noise figure F = ƒ(IC ) VCE = 2 V, ZS = ZSopt
4
dB
Noise figure F = ƒ(I C) VCE = 2 V, f = 1.8 GHz
4
dB
3
3
F
2
F
f = 6 GHz f = 5 GHz f = 4 GHz f = 3 GHz f = 2.4 GHz f = 1.8 GHz f = 0.9 GHz
2 4 6 8
mA
2.5
2.5
2
1.5
1.5
1
1
ZS = 50 Ohm ZS = ZSopt
0.5
0.5
0 0
12
0 0
2
4
6
8
mA
12
IC
IC
Noise figure F = ƒ(f) VCE = 1 V, ZS = ZSopt
3
Source impedance for min. noise figure vs. frequency VCE = 3 V, I C = 2 mA / 5 mA
+j50
dB
+j25
+j100
+j10 2
4GHz 5GHz 3GHz 1.8GHz 0.9GHz
F
1.5
0
10
25
6GHz
50
100
1
IC = 5 mA IC = 2 mA
-j10
2mA 5mA
0.5
-j25 -j50
-j100
0 0
1
2
3
4
GHz
6
f
2009-11-06 7
Package SOT343
BFP405
Package Outline
2 ±0.2 1.3 4 3 0.15 1 0.3 +0.1 -0.05 4x 0.1
M +0.1 0.6 -0.05
0.9 ±0.1 0.1 MAX. 0.1 A
1.25 ±0.1 2.1 ±0.1
2
0.1 MIN.
0.15 -0.05 0.2
M
+0.1
A
Foot Print
0.6
0.8
1.15 0.9
Marking Layout (Example)
Manufacturer
1.6
2005, June Date code (YM)
Pin 1
BGA420 Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel
4 0.2
Pin 1
2.15
2.3
8
1.1
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BFP405
Edition 2009-11-05 Published by Infineon Technologies AG, 85579 Neubiberg, Germany © Infineon Technologies AG 2009. All Rights Reserved.
Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding cicuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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