BFR182W

BFR182W NPN Silicon RF Transistor • For low noise, high-gain broadband amplifiers at collector currents from 1 mA to 20 mA • fT = 8 GHz, F = 0.9 dB at 900 MHz • Pb-free (RoHS compliant) package • Qualified according AEC Q101 3 1 2 ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type BFR182W Parameter Marking RGs 1=B Pin Configuration 2=E 3=C Symbol VCEO VCES VCBO VEBO IC IB Ptot TJ TA T Stg Symbol RthJS Value Package SOT323 Unit Maximum Ratings at TA = 25 °C, unless otherwise specified Collector-emitter voltage Collector-emitter voltage Collector-base voltage Emitter-base voltage Collector current Base current Total power dissipation1) TS ≤ 90 °C 12 20 20 2 35 4 250 150 -55 ... 150 -55 ... 150 Value ≤ 240 V mA mW °C Junction temperature Ambient temperature Storage temperature Thermal Resistance Parameter Unit Junction - soldering point2) 1T 2For K/W S is measured on the collector lead at the soldering point to the pcb calculation of RthJA please refer to Application Note Thermal Resistance 1 2010-04-06 BFR182W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Collector-emitter breakdown voltage IC = 1 mA, IB = 0 Collector-emitter cutoff current VCE = 4 V, VBE = 0 VCE = 15 V, VBE = 0 V, TA = 85 °C (verified by random sampling) Collector-base cutoff current VCB = 4 V, I E = 0 Emitter-base cutoff current VEB = 1 V, IC = 0 DC current gain IC = 10 mA, VCE = 8 V, pulse measured hFE 70 100 140 IEBO 50 ICBO 1 30 ICES 1 5 30 70 nA V(BR)CEO 12 V Symbol min. Values typ. max. Unit 2 2010-04-06 BFR182W Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. AC Characteristics (verified by random sampling) Transition frequency fT IC = 15 mA, VCE = 8 V, f = 500 MHz Collector-base capacitance VCB = 10 V, f = 1 MHz, VBE = 0 , emitter grounded Collector emitter capacitance VCE = 10 V, f = 1 MHz, VBE = 0 , base grounded Emitter-base capacitance VEB = 0.5 V, f = 1 MHz, VCB = 0 , collector grounded Noise figure IC = 3 mA, VCE = 8 V, ZS = ZSopt, f = 900 MHz IC = 3 mA, VCE = 8 V, ZS = ZSopt, f = 1.8 GHz Power gain, maximum stable1) IC = 10 mA, VCE = 8 V, Z S = ZSopt, Z L = ZLopt , f = 900 MHz Power gain, maximum available 2) IC = 10 mA, VCE = 8 V, Z S = ZSopt, Z L = ZLopt , f = 1.8 GHz Transducer gain IC = 10 mA, VCE = 8 V, Z S = ZL = 50 Ω, f = 900 MHz IC = 10 mA, VCE = 8 V, Z S = ZL = 50 Ω, f = 1.8 GHz 1G 2G 6 - 8 0.34 0.5 GHz pF Ccb Cce - 0.26 - Ceb - 0.8 - F G ms 0.9 1.3 19 - dB dB G ma - 12.5 - dB |S 21e|2 15.5 10 - dB ms = |S 21 / S 12| 1/2 ma = |S 21e / S12e| (k-(k²-1) ) 3 2010-04-06 BFR182W Total power dissipation Ptot = ƒ(TS) Permissible Pulse Load RthJS = ƒ(t p) 300 10 3 mW K/W Ptot 200 RthJS 10 2 150 100 50 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 0 0 20 40 60 80 100 120 °C 150 10 1 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 TS tp Permissible Pulse Load Ptotmax/P totDC = ƒ(tp) 10 2 Ptotmax /PtotDC - 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 0 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 4 2010-04-06 BFR182W SPICE Parameter For the SPICE model as well as for the S-parameters (including noise parameters) please refer to our internet website www.infineon.com/rf.models. 5 2010-04-06 Package SOT323 BFR182W Package Outline 2 ±0.2 0.3 +0.1 -0.05 3 1.25 ±0.1 2.1 ±0.1 0.9 ±0.1 3x 0.1 M 0.1 MAX. 0.1 A 1 0.65 0.65 2 0.1 MIN. 0.15 +0.1 -0.05 0.2 M A Foot Print 0.6 0.8 0.65 0.65 Marking Layout (Example) Manufacturer 1.6 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 2.15 2.3 8 1.1 6 2010-04-06 BFR182W Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. 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Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2010-04-06