0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
BFR380L3

BFR380L3

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    BFR380L3 - NPN Silicon RF Transistor - Infineon Technologies AG

  • 数据手册
  • 价格&库存
BFR380L3 数据手册
BFR380L3 NPN Silicon RF Transistor • High current capability and low noise figure for wide dynamic range • Low voltage operation • Ideal for low phase noise oscillators up to 3.5 GHz • Low noise figure: 1.1 dB at 1.8 GHz • Pb-free (RoHS compliant) package • Qualified according AEC Q101 1 2 3 ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type BFR380L3 Parameter Marking FC Pin Configuration 1=B 2=E 3=C Symbol VCEO VCES VCBO VEBO IC IB Ptot TJ T Stg Symbol RthJS Value Package TSLP-3-1 Unit Maximum Ratings at TA = 25 °C, unless otherwise specified Collector-emitter voltage Collector-emitter voltage Collector-base voltage Emitter-base voltage Collector current Base current Total power dissipation1) TS ≤ 96°C 6 15 15 2 80 14 380 150 -55 ... 150 Value ≤ 140 V mA mW °C Junction temperature Storage temperature Thermal Resistance Parameter Unit Junction - soldering point2) 1T 2For K/W S is measured on the collector lead at the soldering point to the pcb calculation of RthJA please refer to Application Note AN077 Thermal Resistance 1 2010-05-28 BFR380L3 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Collector-emitter breakdown voltage IC = 1 mA, IB = 0 Collector-emitter cutoff current VCE = 5 V, VBE = 0 VCE = 15 V, VBE = 0 Collector-base cutoff current VCB = 5 V, I E = 0 Emitter-base cutoff current VEB = 1 V, IC = 0 DC current gain IC = 40 mA, VCE = 3 V, pulse measured hFE 90 120 160 IEBO 10 500 ICBO ICES 1 30 1000 30 nA V(BR)CEO 6 9 V Symbol min. Values typ. max. Unit 2 2010-05-28 BFR380L3 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics (verified by random sampling) Transition frequency fT IC = 40 mA, VCE = 3 V, f = 1 GHz Collector-base capacitance VCB = 5 V, f = 1 MHz, V BE = 0 , emitter grounded Collector emitter capacitance VCE = 5 V, f = 1 MHz, V BE = 0 , base grounded Emitter-base capacitance VEB = 0.5 V, f = 1 MHz, VCB = 0 , collector grounded Minimum Noise figure IC = 8 mA, VCE = 3 V, ZS = ZSopt , f = 1.8 GHz Power gain, maximum available 1) IC = 40 mA, VCE = 3 V, Z S = ZSopt, ZL = ZLopt, f = 1.8 GHz f = 3 GHz Transducer gain IC = 40 mA, VCE = 3 V, Z S = ZL = 50Ω , f = 1.8 GHz f = 3 GHz Third order intercept point at output2) VCE = 3 V, I C = 40 mA, f = 1.8 GHz, ZS = ZL = 50Ω 1dB compression point at output IC = 40 mA, VCE = 3V, f = 1.8 GHz ZS = ZL = 50Ω ZS = ZSopt, ZL = ZLopt 1G 11 - 14 0.45 0.8 GHz pF Ccb Cce - 0.18 - Ceb - 1 - NFmin 0.5 1.1 2.1 dB G ma 11.5 7.5 |S 21e|2 9.5 5.5 IP 3 11.5 7.5 29.5 13.5 9.5 dBm 14 10 16.5 12.5 dB P-1dB 16 19.5 - 1/2 ma = |S 21e / S12e| (k-(k²-1) ) 2IP3 value depends on termination of all intermodulation frequency components. Termination used for this measurement is 50Ω from 0.1 MHz to 6 GHz 3 2010-05-28 BFR380L3 SPICE Parameter For the SPICE model as well as for the S-parameters (including noise parameters) please refer to our internet website www.infineon.com/rf.models. Please consult our website and download the latest versions before actually starting your design. You find the BFR380L3 SPICE model in the internet in MWO- and ADS- format which you can import into these circuit simulation tools very quickly and conveniently. The simulation data have been generated and verified using typical devices. The BFR380L3 SPICE model reflects the typical DC- and RF-performance with high accuracy. 4 2010-05-28 Package TSLP-3-1 BFR380L3 Package Outline Top view Bottom view 0.6 ±0.05 0.5 ±0.035 0.65 ±0.05 1) 0.05 MAX. 3 2 1 ±0.05 3 1 2 1 2 x 0.25 ±0.035 0.45 1) Pin 1 marking 0.35 ±0.05 2 x 0.15 ±0.035 1) 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.275 0.6 0.35 0.35 0.945 0.3 1 0.355 0.2 0.225 0.225 0.15 Copper Solder mask R0.1 0.2 0.17 Stencil apertures Marking Layout (Example) BFR193L3 Type code Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel 4 0.5 1.16 Pin 1 marking 0.76 8 0.315 0.25 ±0.035 0.4 +0.1 1) 5 2010-05-28 BFR380L3 Datasheet Revision History: 27 May 2010 This datasheet replaces the revisions from 10 July 2008 and 30 March 2007. The product itself has not been changed and the device characteristics remain unchanged. Only the product description and information available in the datasheet has been expanded and updated. Previous Revisions: 10 July 2008 and 30 March 2007 Page Subject (changes since last revision) 1 Datasheet has final status 2 Typical values for leakage currents included, values for maximum leakage currents reduced 6 2010-05-28 BFR380L3 Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( ). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2010-05-28
BFR380L3 价格&库存

很抱歉,暂时无法提供与“BFR380L3”相匹配的价格&库存,您可以联系我们找货

免费人工找货