0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
BG3130R

BG3130R

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    BG3130R - DUAL N-Channel MOSFET Tetrode - Infineon Technologies AG

  • 数据手册
  • 价格&库存
BG3130R 数据手册
BG3130... DUAL N-Channel MOSFET Tetrode • Two gain controlled input stage for UHF and VHF -tuners e.g. (NTSC, PAL) • Two AGC amplifiers in one single package • Integrated gate protection diodes • High AGC-range, low noise figure, high gain • Improved cross modulation at gain reduction • Pb-free (RoHS compliant) package • Qualified according AEC Q101 4 5 6 1 2 3 BG3130 BG3130R Drain $ # " * )  ! AGC RF Input RG1 VGG G2 G1 RF Output + DC GND ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type BG3130 BG3130R Package SOT363 SOT363 1=G1* 2=G2 1=G1* 2=S Pin Configuration 3=D* 3=D* 4=D** 4=D** 5=S 5=G2 Marking 6=G1** KAs 6=G1** KHs * For amp. A; ** for amp. B 180° rotated tape loading orientation available 1 2007-06-01 BG3130... Maximum Ratings Parameter Drain-source voltage Continuous drain current Gate 1/ gate 2-source current Gate 1/ gate 2-source voltage Total power dissipation Storage temperature Channel temperature Thermal Resistance Parameter Channel - soldering point1) 1For Symbol VDS ID ±IG1/2SM ±V G1/G2S Ptot Tstg Tch Symbol Rthchs Value 8 25 1 6 200 -55 ... 150 150 Unit V mA V mW °C Value ≤ 280 Unit K/W calculation of RthJA please refer to Application Note Thermal Resistance 2 2007-06-01 BG3130... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Drain-source breakdown voltage ID = 10 µA, VG1S = 0 V, VG2S = 0 V Gate1-source breakdown voltage +IG1S = 10 mA, V G2S = 0 V, VDS = 0 V Gate2-source breakdown voltage +IG2S = 10 mA, V G1S = 0 V, VDS = 0 V Gate1-source leakage current VG1S = 6 V, VG2S = 0 V Gate2-source leakage current VG2S = 8 V, VG1S = 0 V, VDS = 0 V Drain current VDS = 5 V, VG1S = 0 V, VG2S = 4.5 V Drain-source current VDS = 5 V, VG2S = 4 V, RG1 = 120 kΩ Gate1-source pinch-off voltage VDS = 5 V, VG2S = 4 V, ID = 20 µA Gate2-source pinch-off voltage VDS = 5 V, I D = 20 µA VG2S(p) 0.6 VG1S(p) 0.7 V IDSX 10 mA IDSS 10 µA +IG2SS 50 nA +IG1SS 50 µA +V(BR)G2SS 6 15 +V(BR)G1SS 6 15 V(BR)DS 12 V Symbol min. Values typ. max. Unit 3 2007-06-01 BG3130... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol min. Forward transconductance Gate1 input capacitance f = 10 MHz Output capacitance f = 10 MHz Power gain f = 800 MHz f = 45 MHz Noise figure f = 800 MHz f = 45 MHz Gain control range VG2S = 4 ... 0 V, f = 800 MHz Cross-modulation k=1%, fw=50MHz, funw=60MHz Xmod AGC = 0 dB AGC = 10 dB AGC = 40 dB 90 96 87 100 ∆G p F 45 1.3 1.7 Gp 24 31 dB dB Cdss 1.1 gfs Cg1ss Values typ. 33 1.9 max. mS pF Unit AC Characteristics V DS = 5V, V G2S = 4V, (ID = 14 mA) (verified by random sampling) 4 2007-06-01 BG3130... Total power dissipation Ptot = ƒ(TS) amp. A = amp. B Drain current ID = ƒ(IG1) VG2S = 4V amp. A = amp. B 300 30 mW mA P tot 200 20 150 ID 15 100 10 50 5 0 0 120 °C 0 0 20 40 60 80 100 150 10 20 30 40 50 60 70 80 µA 100 TS IG1 Output characteristics ID = ƒ(V DS) amp. A = amp. B Gate 1 current IG1 = ƒ(V G1S) VDS = 5V, VG2S = Parameter amp. A = amp. B 225 1.3V µA 4V 22 mA 18 1.2V 175 16 VG1S 3.5V 150 125 3V ID 14 12 10 8 6 4 2 0 0 2 4 6 8 10 V 1.1V 1V 100 75 50 2V 2.5V 0.8V 25 0 0 14 0.4 0.8 1.2 1.6 2 2.4 V 3.2 VDS IG1 5 2007-06-01 BG3130... Gate 1 forward transconductance g fs = ƒ(ID), VDS = 5V, VG2S = Parameter amp. A = amp. B 40 mS 4V Drain current ID = ƒ(V G1S) VDS = 5V, VG2S = Parameter amp. A = amp. B 32 µA 4V 3V 30 3.5V 24 2.5V g fs 25 3V ID 20 20 16 2V 15 2.5V 2V 12 10 8 1.5V 5 4 0 0 4 8 12 16 20 24 28 mA 36 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 V 2 ID VG1S Drain current ID = ƒ(VGG ) amp.A=amp.B VDS = 5V, VG2S = 4V, RG1 = 120kΩ (connected to VGG, VGG =gate1 supply voltage) 13 mA 11 Drain current ID = ƒ(VGG) VG2S = 4V, RG1 = Parameter in kΩ amp. A = amp. B 22 mA 70 80 18 10 9 16 100 120 ID 8 7 6 5 4 ID V 14 12 10 8 6 3 2 1 0 0 0.5 1 1.5 2 2.5 3 3.5 4 5 4 2 0 0 1 2 3 4 5 V 7 VGG VGG=VDS 6 2007-06-01 BG3130... Crossmodulation Vunw = (AGC) VDS = 5 V, Rg1 = 68 kΩ 120 dBµV V unw 100 90 80 0 10 20 30 dB 50 AGC 7 2007-06-01 BG3130... Crossmodulation test circuit VAGC VDS 4n7 R1 10kΩ 4n7 2.2 uH 4n7 RL 50Ω RGEN 50Ω 4n7 50 Ω RG1 VGG Semibiased 8 2007-06-01 Package SOT363 BG3130... Package Outline 2 ±0.2 0.2 -0.05 +0.1 0.9 ±0.1 6x 0.1 4 1.25 ±0.1 2.1 ±0.1 M 0.1 MAX. 0.1 A 6 5 Pin 1 marking 1 2 3 0.1 MIN. 0.65 0.65 0.2 M 0.15 +0.1 -0.05 A Foot Print 0.3 0.9 0.7 0.65 0.65 Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. 1.6 Manufacturer 2005, June Date code (Year/Month) Pin 1 marking Laser marking BCR108S Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. 4 0.2 2.3 8 Pin 1 marking 2.15 1.1 9 2007-06-01 BG3130... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 10 2007-06-01
BG3130R 价格&库存

很抱歉,暂时无法提供与“BG3130R”相匹配的价格&库存,您可以联系我们找货

免费人工找货