BGA758L7

BGA758L7 5-6 GHz LNA for WLAN Data Sheet Revision 1.0, 2010-02-22 Preliminary RF & Protection Devices Edition 2010-02-22 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGA758L7 BGA758L7 5-6 GHz LNA for WLAN Revision History: 2010-02-22, Revision 1.0 Previous Revision: 2009-04-03, Revision 0.1 Page all all 7, 8, 10 Subjects (major changes since last revision) Preliminary data sheet New document layout Electrical Characteristics adjusted Trademarks of Infineon Technologies AG A-GOLD™, BlueMoon™, COMNEON™, CONVERGATE™, COSIC™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CONVERPATH™, CORECONTROL™, DAVE™, DUALFALC™, DUSLIC™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, E-GOLD™, EiceDRIVER™, EUPEC™, ELIC™, EPIC™, FALC™, FCOS™, FLEXISLIC™, GEMINAX™, GOLDMOS™, HITFET™, HybridPACK™, INCA™, ISAC™, ISOFACE™, IsoPACK™, IWORX™, M-GOLD™, MIPAQ™, ModSTACK™, MUSLIC™, my-d™, NovalithIC™, OCTALFALC™, OCTAT™, OmniTune™, OmniVia™, OptiMOS™, OPTIVERSE™, ORIGA™, PROFET™, PRO-SIL™, PrimePACK™, QUADFALC™, RASIC™, ReverSave™, SatRIC™, SCEPTRE™, SCOUT™, S-GOLD™, SensoNor™, SEROCCO™, SICOFI™, SIEGET™, SINDRION™, SLIC™, SMARTi™, SmartLEWIS™, SMINT™, SOCRATES™, TEMPFET™, thinQ!™, TrueNTRY™, TriCore™, TRENCHSTOP™, VINAX™, VINETIC™, VIONTIC™, WildPass™, X-GOLD™, XMM™, X-PMU™, XPOSYS™, XWAY™. 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SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2009-10-19 Preliminary Data Sheet 3 Revision 1.0, 2010-02-22 BGA758L7 Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 2 2.1 2.2 3 4 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Digital Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Preliminary Data Sheet 4 Revision 1.0, 2010-02-22 BGA758L7 List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Drawing of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Cross-section of Application Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package Outline TSLP-7-8 (side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Footprint TSLP-7-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Preliminary Data Sheet 5 Revision 1.0, 2010-02-22 BGA758L7 List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical Characteristics: TA = 25 °C, VCC = 3.3 V, VPON,ON = 3.3 V, VPON,OFF = 0 V, f = 5.5 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Digital Control Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Preliminary Data Sheet 6 Revision 1.0, 2010-02-22 5-6 GHz LNA for WLAN BGA758L7 Features • • • • • • • • • • • • • Gain, |S21|2= 12.5 dB at 5.5 GHz High Linearity, Input P-1dB = -3.5 dBm at 5.5 GHz Low noise figure, NF = 1.3 dB at 5.5 GHz Internal output matching on chip AC coupled RF output port Temperature compensated internal biasing circuit Digital On/Off switch on chip Low external part count 1 kV HBM ESD protection for IN-pin 2 kV HBM ESD protection for all other pins B7HFM silicon germanium technology Tiny TSLP-7-8 leadless package Pb-free (RoHS compliant) package 6 7 5 4 1 2 3 TSLP-7-8 Application • Low noise amplifier for WLAN application PON BIAS Biasing & Logic Circuitry VCC OUT IN GND Figure 1 Block Diagram BGA 758 L7_Blockdiagram .vsd Product Name BGA758L7 Preliminary Data Sheet Marking BA 7 Package TSLP-7-8 Revision 1.0, 2010-02-22 BGA758L7 Features Description The BGA758L7 is a 5 - 6 GHz Silicon Germanium low noise amplifier MMIC in tiny TSLP-7-8 package. The LNA delivers a gain of 12.5 dB while giving an excellent noise figure of 1.3 dB in the application configuration described in Chapter 3. The supply current of 7.0 mA is chosen to maintain a high input compression point of -3.5 dBm. The temperature compensated internal biasing circuit provides stable current conditions over temperature range. Output matching is done by on chip matching circuits in combination with the bonding wire inductances. The application circuit requires only three external elements. With only one additional external element an ultra low noise figure of 1.1 dB can be achieved. For detailed information please refer to Infineon BGA758L7 Application Note. Pin Definition and Function Table 1 Pin No. 1 2 3 4 5 6 7 Pin Definition and Function Name PON IN BIAS n.c. VCC OUT GND Function Power on control RF input DC bias not connected DC Supply RF output RF ground and DC ground for bias and logic circuity Preliminary Data Sheet 8 Revision 1.0, 2010-02-22 BGA758L7 Maximum Ratings 1 Maximum Ratings Table 2 Parameter Maximum Ratings Symbol Min. Values Typ. – – – – – – – – – – – – – – Max. 4 0.9 0.9 V V V V V V mA dBm mW °C °C °C V V -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 – – – – -30 -65 Unit Note / Test Condition 1) Voltage at pin VCC Voltage at pin IN Voltage at pin BIAS Voltage at pin OUT Voltage at pin PON Voltage at pin GND Current into pin VCC RF input power Total power dissipation, VCC VIN VBIAS VOUT VPON VGND ICC PIN TJ Ptot TA TSTG – – – – – – – – – – – according to JESD22A-114 according to JESD22A-114, w/o pin IN according to JESD22A-115 VCC + 0.3 VCC + 0.3 0.3 12 0 48 150 85 150 1000 2000 TS < 120°C2) Junction temperature Ambient temperature range Storage temperature range ESD capability all pins ESD capability all pins, excluding pin IN ESD capability all pins VESD-HBM – VESD-HBM – VESD-MM – – 100 V 1) All voltages refer to GND-Node unless otherwise noted 2) TS is measured on the ground lead at the soldering point Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Thermal Resistance Table 3 Parameter 1) Thermal Resistance Symbol Value Unit K/W Junction - soldering point RthJS 615 1) For calculation of RthJA please refer to Application Note Thermal Resistance Preliminary Data Sheet 9 Revision 1.0, 2010-02-22 BGA758L7 Electrical Characteristics 2 2.1 Electrical Characteristics Electrical Parameter Table 4 Parameter Electrical Characteristics1): TA = 25 °C, VCC = 3.3 V, VPON,ON = 3.3 V, VPON,OFF = 0 V, f = 5.5 GHz Symbol Min. Values Typ. – 12.5 0.3 Max. 6.0 – – GHz dB dB In any 50 MHz instantaneous bandwidth 5.0 2 Unit Note / Test Condition Pass band frequency range Gain Gain flatness FBW |S21| ΔG – – Reverse isolation Noise figure 2) |S12| NF RLin RLout |S21| – – – – – – – – – – – 21 1.3 18 20 -3.5 -3 1 6 12 4 3 -4 -12 -9 -8 0 0.2 – – – – – – – – – – – – – – – – – dB dB dB dB dBm dB dB dB dB dB dB dBm dBm dBm dBm dBm μs DC - 1.7 GHz 1.7 - 2.0 GHz 2.3 - 2.7 GHz 3.3 - 3.9 GHz 9.0 - 10 GHz 10 - 18 GHz 0.8 - 1.0 GHz 1.7 - 2.0 GHz 2.3 - 4.0 GHz 4.4 - 4.5 GHz 9.0 - 10 GHz Measured from ON signal turns on (90%) to the point were LNA output power stabilizes to within 0.5 dB of final value 50 Ω 50 Ω Input return loss Output return loss Maximum gain out of band Input power at 1dB compression point P-1dB Minimum input 1dB compression out of band P-1dB – – – – – Turn-on time ton – Supply current at VCC Shutdown current Stability factor ICC Ioff k 5.0 – – 7.0 >1 9.0 6 – mA μA VPON = 0 V Unconditional stable for all frequencies 1) Measured on application board according to application schematic on page 12, including PCB losses (unless noted otherwise) 2) PCB losses subtracted Preliminary Data Sheet 10 Revision 1.0, 2010-02-22 BGA758L7 Electrical Characteristics 2.2 Digital Signals Table 5 Parameter Digital Control Parameter Symbol Min. Values Typ. – – – 1 10 Max. -0.3 2 -0.3 – – Unit Note / Test Condition – – – – Power on control voltage range Control voltage for power on Control voltage for power off Capacitance at power on pin Input current at power on pin VPON VPON,on VPON,off Cin IPON VCC VCC 1.1 – – V V V pF μA VPON = 3.3 V Preliminary Data Sheet 11 Revision 1.0, 2010-02-22 BGA758L7 Application Information 3 Application Information Application Board Configuration N1 PON RFin C1 L1 BIAS,3 GND,7 GND,4 PON,1 BGA758L7 OUT,6 RFout VCC C2 IN,2 VCC,5 BGA758 L7_Application _Schematic.vsd Figure 2 Table 6 Name C1 C2 L1 N1 Application Schematic Bill of Materials Value 2.7 pF 1 nF 3.9 nH Package 0402 0402 0402 TSLP-7-8 Manufacturer Various Various Murata LQW type Infineon Function DC blocking Supply voltage filtering Bias feed and input matching 5-6 GHz LNA A list of all application notes is available at http://goto.infineon.com/smallsignaldiscretes-appnotes. Preliminary Data Sheet 12 Revision 1.0, 2010-02-22 BGA758L7 Application Information Figure 3 Drawing of Application Board Micro- Via 150 µm Via 500 µm TOP- Layer CU 35 µm Rogers 4003 200 µm Core GND 1 CU 35 µm FR4 800 µm GND 2 CU 35 µm BGA 758L7 _Cross_section.vsd Figure 4 Cross-section of Application Board Preliminary Data Sheet 13 Revision 1.0, 2010-02-22 BGA758L7 Package Information 4 Package Information Top view Bottom view 1.26 ±0.05 0.31 +0.01 -0.02 0.05 MAX. 0.03 A 1.16 ±0.035 1) 0.96 4 5 6 0.05 B B 0.2 MIN. 0.5 ±0.0351) (0.05) 2) 7 3 2 1 Pin 1 marking 0.48 (0.05) 2) 6 x 0.2 ±0.035 1) 0.03 B 1) Dimension applies to plated terminals 2) Dimension of 0.02 MIN. is guaranteed Figure 5 Package Outline TSLP-7-8 (side and bottom view) 4 0.4 1.7 Pin 1 marking 1.6 TSLP-7-8-TP V01 Figure 6 Marking Layout (top view) Preliminary Data Sheet 14 8 6 x 0.2 ±0.035 1) TSLP-7-8-PO V01 A 0.03 B 0.05 A 1.4 ±0.05 1.1 Revision 1.0, 2010-02-22 BGA758L7 Package Information SMD 1.21 0.51 0.25 1.21 0.51 0.25 0.45 1.35 0.25 0.23 0.23 Solder mask Vias 0.25 0.23 0.25 Stencil apertures TSLP-7-8-FP V01 1.35 0.25 0.23 0.25 Copper 0.25 Figure 7 Footprint TSLP-7-8 Preliminary Data Sheet 0.25 15 0.25 Revision 1.0, 2010-02-22 0.45 0.2 0.2 0.2 0.2 www.infineon.com Published by Infineon Technologies AG