BGB707L7ESD
SiGe:C Wideband MMIC LNA with Integrated ESD Protection
Data Sheet
Revision 3.2, 2010-06-30
RF & Protection Devices
Edition 2010-06-30 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGB707L7ESD
BGB707L7ESD SiGe:C Wideband MMIC LNA with Integrated ESD Protection Revision History: 2010-06-30, Revision 3.2 Previous Revision: Revision 3.1 Page 18 - 26 13, 14 27, 30 21, 24 Subjects (major changes since last revision) New template for data sheet layout. Linearity description related to the RF output. Typical DC characteristic curves included. Typical AC characteristic curves included. AC performance tables expanded by 2 frequencies.
Trademarks of Infineon Technologies AG BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SensoNor™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-03-22
Data Sheet
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BGB707L7ESD
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 2 3 4 5 6 6.1 6.2 6.3 6.3.1 6.3.1.1 6.3.1.2 6.3.2 6.3.3 6.3.4 7 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Product Brief . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical DC Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics in FM Radio Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High-Ohmic FM Radio Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Ω FM Radio Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics in the SDMB Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics in Test Fixture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical AC Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 13 15 15 15 15 16 17 27
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Data Sheet
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BGB707L7ESD
List of Figures
List of Figures
Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Figure 19 Figure 20 Pinning PG-TSLP-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Function Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Total Power Dissipation Ptot = f (Ts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ICC as a Function of Rext , VCC as Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 ICC as a Function of VCC , VCtrl = 3 V , Rext as Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 ICC as a Function of VCtrl , VCC = 3 V , Rext as Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ICC as a Function of Temperature , VCtrl = VCC = 3 V , Rext = open . . . . . . . . . . . . . . . . . . . . . . . . . 14 Testing Circuit for Frequencies from 150 MHz to 10 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 S11 as a Function of Frequency, IC as Parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 S22 as a Function of Frequency, IC as Parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Transition Frequency as a Function of IC , VC as Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Optimum Source Impedance for Minimum NF as a Function of Frequency, IC as Parameter . . . . 28 Maximum Power Gain as a Function of IC , Frequency as Parameter . . . . . . . . . . . . . . . . . . . . . . 29 Power Gain as a Function of IC , Frequency as Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Power Gain and Total Supply Current as a Function of RF Input Power at 3.5 GHz . . . . . . . . . . . 30 Output 3rd Order Intercept Point as a Function of IC at 3.5 GHz, VC as Parameter . . . . . . . . . . . . 30 Package Outline TSLP-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Tape Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Data Sheet
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BGB707L7ESD
List of Tables
List of Tables
Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Table 13 Table 14 Table 15 Table 16 Table 17 Pinning Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings at TA = 25°C (unless otherwise specified) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 DC Characteristics at VCC = 3 V, TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC Characteristics in the FM Radio Application as Described in AN177 . . . . . . . . . . . . . . . . . . . . 15 AC Characteristics in the FM Radio Application as Described in AN181 . . . . . . . . . . . . . . . . . . . 15 AC Characteristics in the SDMB Application as Described in TR122, TA = 25°C . . . . . . . . . . . . . 16 AC Characteristics VC = 3 V, f = 150 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 AC Characteristics VC = 3 V, f = 450 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 AC Characteristics VC = 3 V, f = 900 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 AC Characteristics VC = 3 V, f = 1.5 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 AC Characteristics VC = 3 V, f = 1.9 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 AC Characteristics VC = 3 V, f = 2.4 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 AC Characteristics VC = 3 V, f = 3.5 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 AC Characteristics VC = 3 V, f = 5.5 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 AC Characteristics VC = 3 V, f = 10 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Data Sheet
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SiGe:C Wideband MMIC LNA with Integrated ESD Protection
BGB707L7ESD
1
• • • • • • • • • •
Features
High performance general purpose wideband MMIC LNA ESD protection integrated for all pins (3 kV for RF input vs. GND, 2 kV for all other pin combinations, HBM) Integrated active biasing circuit enables stable operation point against temperature- and processing-variations Excellent noise figure from Infineon´s reliable high volume SiGe:C technology High gain and linearity at low current consumption Operation voltage: 1.8 V to 4.0 V Adjustable operation current 2.1 mA to 25 mA by external resistor Power-off function Very small and leadless package TSLP-7-1, 2.0 x 1.3 x 0.4 mm3 Pb-free (RoHS compliant) and halogen-free (WEEE compliant) package
Applications As Low Noise Amplifier (LNA) in • • • • • Mobile, portable and fixed connectivity applications: WLAN 802.11a/b/g/n, WiMax 2.5/3.5/5 GHz, UWB, WiFi, Bluetooth Satellite communication systems: Navigation systems (GPS, Glonass), satellite radio (SDARs, DAB) and C-band LNB Multimedia applications such as mobile/portable TV, CATV, FM Radio 3G/4G UMTS/LTE mobile phone applications ISM applications like RKE, AMR and Zigbee, as well as for emerging wireless applications
Attention: ESD (Electrostatic discharge) sensitive device, observe handling precautions
Product Name BGB707L7ESD Data Sheet
Package TSLP-7-1 7
Marking AZ Revision 3.2, 2010-06-30
BGB707L7ESD
Product Brief
2
Product Brief
The BGB707L7ESD is a Silicon Germanium Carbon (SiGe:C) low noise amplifier MMIC with integrated ESD protection and active biasing. The device is as flexible as a discrete transistor and features high gain, reduced power consumption and very low distortion for a very wide range of applications. The device is based upon Infineon Technologies cost effective SiGe:C technology and comes in a low profile TSLP-7-1 leadless green package
6
5 4 7
1
2
3
Figure 1 Table 1 Pin 1 2 3 4 5 6 7
Pinning PG-TSLP-7-1 Pinning Table Name Function Supply voltage Bias reference voltage RF input RF output On/Off control voltage Current adjustment pin DC/RF GND
VCC VBias RFin RFout VCtrl Adj GND
Data Sheet
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BGB707L7ESD
Product Brief The following function block in Figure 2 shows the principal schematic how the BGB707L7ESD is used in a circuit. The Power On/Off function is controlled by applying VCtrl. By using an external resistor Rext the pre-set current of 2.1 mA (which is adjusted by the integrated biasing when Rext is omitted) can be increased. Base- and collector voltages are applied to the respective pins RFin and RFout by external inductors LB and LC.
Figure 2
Function Block
Data Sheet
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BGB707L7ESD
Maximum Ratings
3
Maximum Ratings
Maximum Ratings at TA = 25°C (unless otherwise specified) Symbol Min. Values Typ. – – – – – – – – Max. 4.0 3.5 25 2 4.0 100 150 150 mA mA V mW °C °C V – – – – – – – -55 Unit Note / Test Condition – – – – – – – –
Table 2 Parameter
Supply Voltage
VCC ICC IB Vctrl Ptot TJOp TStg
TA = -55°C
Supply Current at VCC pin DC Current at RF In pin Voltage at Ctrl On/Off pin Total Power Dissipation
TS1 Max. – – 6.8 17 – 1.5 – – – – – – – – – –
Unit GHz V mA dB dB dB dB dB dB dBm dBm dBm dBm µs µs
Note / Test Condition – – – Power @ port1 = -30 dBm – Including 0.1 dB Board losses – – Power @ port2 = -10 dBm – – Input power = -30 dBm – Measured with C2 = 1 nF – Stability measured up to 10 GHz
Vcc Icc
|S21|²
Transducer Gain (off mode) |S21| off
NF RLIN RLOUT IREV IP1dB OP1dB IIP3 OIP3 Ton Toff
k
Data Sheet
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BGB707L7ESD
Electrical Characteristics
6.3.3
AC Characteristics in Test Fixture
For frequencies from 150 MHz to 10 GHz the measurement setup is a test fixture with Bias-T’s in a 50 Ω system according to Figure 8 at VC = 3V, TA = 25 °C. The collector current IC is controlled by an external base voltage VB applied at RFin pin and not by the integrated biasing´s reference voltage VBias. VC controls the collector voltage at RFout pin. This allows direct measurement of the amplifier performance as a function of bias conditions without passive components.
Figure 8
Testing Circuit for Frequencies from 150 MHz to 10 GHz
Data Sheet
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BGB707L7ESD
Electrical Characteristics
Table 9 Parameter
AC Characteristics VC = 3 V, f = 150 MHz Symbol Min. Values Typ. 0.4 0.4 0.5 0.55 17 19 24 27 31.5 33 35 37 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 3.5 4 4.5 3 – – – – dBm – – – – 2 6 14.5 19.5 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 11 mA2) ICq = 3 mA, ICcomp = 11 mA ICq = 6 mA, ICcomp = 11 mA ICq = 10 mA, ICcomp = 11 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
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Electrical Characteristics
Table 10 Parameter
AC Characteristics VC = 3 V, f = 450 MHz Symbol Min. Values Typ. 0.45 0.45 0.5 0.6 17 19 24 27 27 28 30.5 32 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 11.5 12 11.5 9.5 – – – – dBm – – – – 2 5.5 14 19.5 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 11 mA2) ICq = 3 mA, ICcomp = 14 mA ICq = 6 mA, ICcomp = 16 mA ICq = 10 mA, ICcomp = 15 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
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Electrical Characteristics
Table 11 Parameter
AC Characteristics VC = 3 V, f = 900 MHz Symbol Min. Values Typ. 0.55 0.55 0.6 0.7 17 19 23.5 26 24 25 27.5 29 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 11 11 10 8.5 – – – – dBm – – – – 3.5 8 17 19.5 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 13 mA2) ICq = 3 mA, ICcomp = 15 mA ICq = 6 mA, ICcomp = 14 mA ICq = 10 mA, ICcomp = 14 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
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Electrical Characteristics
Table 12 Parameter
AC Characteristics VC = 3 V, f = 1.5 GHz Symbol Min. Values Typ. 0.6 0.6 0.6 0.7 16 18.5 22.5 24.5 21.5 23 25.5 27 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 10.5 10 9 8 – – – – dBm – – – – 3.5 8 17 19.5 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 14 mA2) ICq = 3 mA, ICcomp = 16 mA ICq = 6 mA, ICcomp = 15 mA ICq = 10 mA, ICcomp = 15 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
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Electrical Characteristics
Table 13 Parameter
AC Characteristics VC = 3 V, f = 1.9 GHz Symbol Min. Values Typ. 0.6 0.6 0.6 0.7 16 18 21.5 23 21 22 24 26 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 10 10 8.5 8 – – – – dBm – – – – 3.5 7.5 17 19.5 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 15 mA2) ICq = 3 mA, ICcomp = 16 mA ICq = 6 mA, ICcomp = 14 mA ICq = 10 mA, ICcomp = 14 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
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BGB707L7ESD
Electrical Characteristics
Table 14 Parameter
AC Characteristics VC = 3 V, f = 2.4 GHz Symbol Min. Values Typ. 0.65 0.6 0.6 0.7 15.5 17 20 21.5 20 21 23 25 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 10 10 9 8 – – – – dBm – – – – 4.5 9 17.5 19.5 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 15 mA2) ICq = 3 mA, ICcomp = 16 mA ICq = 6 mA, ICcomp = 14 mA ICq = 10 mA, ICcomp = 14 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
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BGB707L7ESD
Electrical Characteristics
Table 15 Parameter
AC Characteristics VC = 3 V, f = 3.5 GHz Symbol Min. Values Typ. 0.8 0.75 0.7 0.75 13.5 15.5 18 19 18.5 20 22 23.5 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 10 10 9 8 – – – – dBm – – – – 5.5 12 17.5 19 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 16 mA2) ICq = 3 mA, ICcomp = 16 mA ICq = 6 mA, ICcomp = 15 mA ICq = 10 mA, ICcomp = 15 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
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BGB707L7ESD
Electrical Characteristics
Table 16 Parameter
AC Characteristics VC = 3 V, f = 5.5 GHz Symbol Min. Values Typ. 1.05 1 0.9 0.95 11.5 13 15 15.5 17.5 18.5 20 19 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 10.5 10 9 8 – – – – dBm – – – – 6.5 12 22 21 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 17 mA2) ICq = 3 mA, ICcomp = 17 mA ICq = 6 mA, ICcomp = 15 mA ICq = 10 mA, ICcomp = 15 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
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BGB707L7ESD
Electrical Characteristics
Table 17 Parameter
AC Characteristics VC = 3 V, f = 10 GHz Symbol Min. Values Typ. 2 1.8 1.5 1.5 5.5 7 9 10 14.5 15 15.5 15.5 Max. dB – – – – – – – – dB – – – – – – – – dB – – – – – – – – dBm – – – – 6 6 4 4 – – – – dBm – – – – 2.5 7 19.5 18 – – – – Unit Note / Test Condition
Minimum Noise Figure
NFmin
ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZS = ZL = 50 Ω IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA ZL = ZLopt, ZS = ZSopt IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
Transducer Gain
|S21|²
Maximum Power Gain
Gms
Output 1 dB Compression Point1)
OP1dB
ICq = 2.1 mA, ICcomp = 16 mA2) ICq = 3 mA, ICcomp = 16 mA ICq = 6 mA, ICcomp = 15 mA ICq = 10 mA, ICcomp = 15 mA
Output 3 Order Intercept Point
rd
OIP3
IC = 2.1 mA IC = 3 mA IC = 6 mA IC = 10 mA
1) OP1dB is the output compression point achieved in a 50 Ω application circuit according to Figure 2 using the integrated biasing. 2) ICq is the quiescent current at small input power levels. ICq increases up to ICcomp as RF input power approaches IP1dB, cf. Figure 15.
Data Sheet
26
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BGB707L7ESD
Electrical Characteristics
6.3.4
Typical AC Characteristic Curves
The measurement setup is the same as described in Figure 8 except for Figure 15 where compression is measured in a 50 Ohm application circuit according to Figure 2 using the integrated biasing; VC = 3V, TA = 25 °C.
1 1.5 0.5 0.4 0.3 0.2
0.03 to 10 GHz
2 3 4 5
step: 1 GHz
0.1 0 −0.1 −0.2 −0.3 −0.4 −0.5
0.1 0.2 0.3 0.4 0.5 1 1.5
10
45
2
3
−10 −5 −4 −3
2.1 mA
−2 −1.5 −1
3.0 mA 6.0 mA 10 mA
Figure 9
S11 as a Function of Frequency, IC as Parameter
1 1.5 0.5 0.4 0.3 0.2
0.03 to 10 GHz
2 3 4 5
step: 1 GHz
0.1 0 −0.1 −0.2 −0.3 −0.4 −0.5
0.1 0.2 0.3 0.4 0.5 1 1.5
10
45
2
3
−10 −5 −4 −3
2.1 mA
−2 −1.5 −1
3.0 mA 6.0 mA 10 mA
Figure 10 Data Sheet
S22 as a Function of Frequency, IC as Parameter
27 Revision 3.2, 2010-06-30
BGB707L7ESD
Electrical Characteristics
45 4.00V 3.00V 40
35 fT [GHz]
30
25 1.80V 20
15
0
5
10
15 IC [mA]
20
25
30
Figure 11
Transition Frequency as a Function of IC , VC as Parameter
1 1.5 0.5 0.4 0.3
5.5GHz
2 3
3.5GHz 2.4GHz 1.9GHz 1.5GHz 0.9GHz
4 5 10
0.2 0.1 0 −0.1
10GHz 0.1 0.2 0.3 0.4 0.5 1 1.5 I = 10mA c
2
3
45
0.45GHz 0.15GHz
I = 6.0mA c
c
Ic = 2.1mA I = 3.0mA
−10
−0.2 −0.3 −0.4 −0.5
−5 −4 −3
−2 −1.5 −1
Figure 12
Optimum Source Impedance for Minimum NF as a Function of Frequency, IC as Parameter
Data Sheet
28
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BGB707L7ESD
Electrical Characteristics
42 39 36 0.45GHz 33 30 Gmax [dB] 27 24 21 5.50GHz 18 15 12 9 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 IC [mA] 10.00GHz 0.90GHz 1.50GHz 1.90GHz 2.40GHz 3.50GHz 0.15GHz
Figure 13
Maximum Power Gain as a Function of IC , Frequency as Parameter
36 33 30 27 24 S21 [dB] 21 18 15 12 9 6 3 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 IC [mA] 10.00GHz 5.50GHz 0.15GHz 0.45GHz 0.90GHz 1.50GHz 1.90GHz 2.40GHz 3.50GHz
Figure 14
Power Gain as a Function of IC , Frequency as Parameter
Data Sheet
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BGB707L7ESD
Electrical Characteristics
19 18 17 16 15 14 13 12
30 28
P1dB, 10mA
26 24 22 20 18
Gain [dB]
11 10 9 8 7 6 5 4 3 2 1 0 -40 -37.5 -35 -32.5 -30 -27.5 -25 -22.5 -20 -17.5 -15 -12.5 -10
P1dB, 2.1mA
16 14 12 10 8
Gain , Icq = 2.1mA Gain , Icq = 10mA Icc , Icq = 2.1mA Icc , Icq = 10mA
-7.5 -5 -2.5 0
6 4 2 0
Input power [dBm]
Figure 15 Power Gain and Total Supply Current as a Function of RF Input Power at 3.5 GHz
22 20 18 16 OIP3 [dBm] 14 12 10 8 6 4 4V 3V 1.8V
0
1
2
3
4
5
6 7 IC [mA]
8
9
10
11
12
Figure 16
Output 3rd Order Intercept Point as a Function of IC at 3.5 GHz, VC as Parameter
Data Sheet
30
Revision 3.2, 2010-06-30
Current [mA]
BGB707L7ESD
Package Information
7
Package Information
Top view
0.4 0.05 MAX.
+0.1
Bottom view
1.3 ±0.05 1 ±0.05 4 5 6
1.7 ±0.05
6 x 0.2 ±0.035 1)
7
3
Pin 1 marking
2 1 6 x 0.2 ±0.035 1)
TSLP-7-1-PO V04
1) Dimension applies to plated terminal
Figure 17
Package Outline TSLP-7-1
NSM D
0.2 0.2 0.2
SMD
1.4 1.4 1.4
0.2 0.2 1.9 0.25
1.4
0.2
0.25
2 ±0.05
1.2 ±0.035 1)
1.1 ±0.035 1)
0.2
1.9
1.9
0.2
0.25
1.9
0.2
0.2
0.2
0.2
0.3 0.3
Copper
0.3
0.25
Stencil apertures
R0.1
0.3 0.3
Copper
0.3
0.2
0.25
0.25 0.25
Stencil apertures
R0.1
Solder mask
Solder mask
TSLP-7-1-FP V01
Figure 18
Footprint
AZ AX
BGB707L7ESD Type Code
Figure 19
Marking Layout (top view)
4 0.5
2.18
Pin 1 marking
1.45
TSLP-7-1-TP V03
Figure 20 Data Sheet
Tape Dimensions 31 Revision 3.2, 2010-06-30
8
0.2
0.25
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