BGB717L7ESD

BGB717L7ESD SiGe:C Low Noise Amplifier MMIC for FM Radio Applications Data Sheet Revision 3.3, 2010-06-24 RF & Protection Devices Edition 2010-06-24 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGB717L7ESD Revision History Page / Item Subjects (major changes since last revisions) Converted to the new IFX Template. Revision 3.2 Supply Voltage limited to 4.0 V Trademarks of Infineon Technologies AG BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SensoNor™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-03-22 Revision 3.3, 2010-06-24 Data Sheet 3 Revision 3.3, 2010-06-24 BGB717L7ESD Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 2 3 4 5 6 6.1 6.2 7 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Product Brief . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Data Sheet 4 Revision 3.3, 2010-06-24 BGB717L7ESD List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Pinning of BGB717L7ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Total Power Dissipation Ptot = f (Ts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 FM Radio Testing Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package Outline TSLP-7-1 (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Footprint TSLP-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Marking of TSLP-7-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Tape of TSLP-7-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Data Sheet 5 Revision 3.3, 2010-06-24 BGB717L7ESD List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Pinning Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings at TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DC Characteristics at TA = 25 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC Characteristics in the FM Radio LNA Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Data Sheet 6 Revision 3.3, 2010-06-24 SiGe:C Low Noise Amplifier MMIC for FM Radio Applications BGB717L7ESD 1 • • • • • • • • • • • • • Features High performance FM radio LNA with integrated biasing Worldwide FM band support (76 MHz to 108 MHz) Integrated ESD protection for all pins (3 kV for RF input vs. GND, 2 kV for all other pin combinations, HBM) Very high gain at low current consumption High input compression point High input impedance Excellent noise figure from latest SiGe:C technology Integrated active biasing circuit enables stable operation point against temperature- and processing-variations Minimum external components Operation voltage: 1.8 V to 4.0 V Power-off function Very small and leadless package TSLP-7-1, 2.0 x 1.3 x 0.4 mm Pb-free (RoHS compliant) and halogen-free (WEEE compliant) package Main features: Applications • • • • Active FM antenna systems Portable FM radio Personal headphone radio ISM applications Product Name BGB717L7ESD Data Sheet Package TSLP-7-1 7 Marking AX Revision 3.3, 2010-06-24 BGB717L7ESD Product Brief 2 Product Brief The BGB717L7ESD is an advanced low noise amplifier MMIC with integrated ESD protection and active biasing specifically designed for FM antenna systems requiring high gain, reduced power consumption and very low distortion. The external components determine the gain of the FM amplifier and can also be modified to extend the operating frequency. The device is based upon Infineon Technologies cost effective SiGe:C technology and comes in a low profile TSLP-7-1 leadless green package. 6 5 4 7 1 2 3 Figure 1 Table 1 Pin 1 2 3 4 5 6 7 Pinning of BGB717L7ESD Pinning Table Function GND RF-In Bias-Out Ctrl On/Off RF-Out VCC GND Data Sheet 8 Revision 3.3, 2010-06-24 BGB717L7ESD Maximum Ratings 3 Maximum Ratings Maximum Ratings at TA = 25°C Symbol Min. Value Typ. – – – – – – – – – – Max. 4.0 3.5 25 3 4.0 100 150 150 2000 100 1500 mA mA V mW °C °C V V V – – – – – – – – – V – – – – – – -55 -55 – – Unit Note / Test Condition Table 2 Parameter Supply voltage VCC ICC IB Vctrl Ptot TJOp TStg TA = -55°C Supply current at VCC pin IDC current at RF-In Pin Control On / Off voltage Total power dissipation TS ≤ 112 °C2) Storage temperature ESD Capability Human Body Model JESD22-A114-B – Machine Model JESD22-A115-A – 1) Operation junction temperature Charge Device Model JESD22– – – C101-C 1) TS measured at the GND pin (7) at soldering point to the PCB 2) TS soldering point temperature Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Data Sheet 9 Revision 3.3, 2010-06-24 BGB717L7ESD Thermal Characteristics 4 Thermal Characteristics Table 3 Parameter Thermal Resistance Symbol Min. 1) Values Typ. Max. Unit K/W Note / Test Condition – Junction - soldering point RthJS – 375 – 1) For calculation of RthJA please refer to Application Note Thermal Resistance 120 100 80 Ptot [mW] 60 40 20 0 0 50 Ts [°C] 100 150 Figure 2 Total Power Dissipation Ptot = f (Ts) 5 Operation Conditions Table 4 Parameter Operation Conditions Symbol Min. Values Typ. 3.0 3.0 0 Max. 4.0 4.0 0.3 V V V – – – 1.8 1.2 -0.3 Unit Note / Test Condition Supply voltage VCC Voltage Ctrl On/Off pin in On mode Vctrl-on Voltage Ctrl On/Off pin in Off mode Vctrl-off Data Sheet 10 Revision 3.3, 2010-06-24 BGB717L7ESD Electrical Characteristics 6 6.1 Electrical Characteristics DC Characteristics Table 5 Parameter DC Characteristics at TA = 25 °C Symbol Min. Values Typ. 3.0 Max. 3.6 mA 2.4 Unit Note / Test Condition Supply current ICC VCC = 3 V Vctrl = 3 V Small signal operation Supply current in Off mode ICC-off – – – 1 14 – 6 20 0.1 μA μA μA VCC = 4.0 V Vctrl = 0 V VCC = 3 V Vctrl = 3 V VCC = 4.0 V Vctrl = 0 V Current into Ctrl On/Off pin in On mode Ictrl-on Current into Ctrl On/Off pin in Off mode Ictrl-off 6.2 AC Characteristics This section presents the AC characteristics of the BGB717L7ESD as measured in a high-ohmic FM radio application circuit using a PCB and a population as described in the application note AN176. Please consult our website to download the application note: www.infineon.com/rf.appnotes. The application schematic is shown in Figure 3 and the function of each component is explained in Table 6. C3 VC C GND RFin C1 L1 C2 RF-In Bias-Out BGB717ESD 1 2 3 GND 6 7 5 4 VCC RF-Out On /Off R1 R2 C4 RFout VCtrl BGB717L7ESD_Application _circuit Figure 3 FM Radio Testing Circuit Data Sheet 11 Revision 3.3, 2010-06-24 BGB717L7ESD Electrical Characteristics Table 6 Component C1 C2 C3 C4 R1 R2 L1 Bill of Material Value 330 pF 47 nF 47 nF 330 pF 56 Ω 10 Ω 470 nH Manufacturer / Type Various / 0402 Various / 0402 Various / 0402 Various / 0402 Various / 0402 Various / 0402 Function DC blocking DC stabilization DC stabilization DC blocking For biasing, output matching and stabilization For output matching and stabilization Taiyo Yuden LK1608R47K-T / RF choke 0603 The following table gives an overview on the performance of the FM radio LNA application circuit. All data were measured in a 50 Ω system. Table 7 Parameter Insertion power gain Input return loss Noise figure5) Input 1dB gain compression point rd 2) 2) 2) 2) AC Characteristics in the FM Radio LNA Application1) Symbol Min. |S21| 2 Values Typ. 12 0.5 16 1.0 -5.5 3) 4) Unit Max. 14 3 19 1.5 – dB dB dB dB dBm dBm Note / Test Condition – – – 10 0 13 – -8.0 RLIN RLOUT F50Ω IP-1dB Output return loss Zs = 50 Ω – Input 3 Order Intercept Point IIP3 -15.5 -12.5 – 1) As described in AN176, TA = 25°C, VCC = 3 V, Vctrl = 3 V, ICC = 3 mA, f = 100 MHz 2) 3) 4) 5) PRFIN = -40 dBm Verified by random sampling High LNA input impedance leads to power matching with high ohmic antennas Output matching is accomplished by the external resistors R1 and R2 An aggressive low pass filter prevents radio broadcast signals from distorting the NF measurement Data Sheet 12 Revision 3.3, 2010-06-24 BGB717L7ESD Package Information 7 Package Information Top view 0.4 0.05 MAX. +0.1 Bottom view 1.3 ±0.05 1 ±0.05 4 5 6 1.7 ±0.05 6 x 0.2 ±0.035 1) 7 3 Pin 1 marking 2 1 6 x 0.2 ±0.035 1) TSLP-7-1-PO V04 1) Dimension applies to plated terminal Figure 4 Package Outline TSLP-7-1 (bottom view) NSM D 0.2 0.2 0.2 SMD 1.4 1.4 1.4 0.2 0.2 1.9 0.25 1.4 0.2 0.25 2 ±0.05 1.2 ±0.035 1) 1.1 ±0.035 1) 0.2 1.9 1.9 0.2 0.25 1.9 0.2 0.2 0.2 0.2 0.3 0.3 Copper 0.3 0.25 Stencil apertures R0.1 0.3 0.3 Copper 0.3 0.2 0.25 0.25 0.25 Stencil apertures R0.1 Solder mask Solder mask TSLP-7-1-FP V01 Figure 5 Footprint TSLP-7-1 AX AX Figure 6 Marking of TSLP-7-1 4 0.5 2.18 Pin 1 marking 1.45 TSLP-7-1-TP V03 Figure 7 Data Sheet Tape of TSLP-7-1 13 Revision 3.3, 2010-06-24 8 0.2 0.25 www.infineon.com Published by Infineon Technologies AG