BGF111

D a t a S h e e t , V 2. 0 , M ay 2 00 8 B G F 11 1 T V - O u t F i l t e r a n d E S D P r o t e c t i on S m a l l S i g n a l D i s c r et e s Edition 2008-05-28 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF111 TV-Out Filter BGF111 Revision History: 2008-05-28, V2.0 Previous Version: 2007-04-26 Page All Subjects (major changes since last revision) Preliminary status removed Data Sheet 3 V2.0, 2008-05-28 BGF111 TV-Out Filter BGF111 BGF111 Features • TV-Out Filter • Wafer level package with SnAgCu solder balls • Integrated ESD protection up to 15 kV contact discharge according to IEC61000-4-2 • Low bias voltage dependency of low pass frequency • RoHS and WEEE compliant package WLP-4-1-3D Description BGF111 is a 75 Ω TV-Out filter with low pass characteristic offering a high stop band attenuation up to 6 GHz in mobile phone, consumer and IT applications. Wafer technology is optimized to provide low variation of the low pass frequency versus bias voltage. ESD protection at both pins exceeds 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 0.75 mm x 0.75 mm and a total height of 0.6 mm. Type BGF111 Table 1 Parameter Voltage at all pins to GND Package WLP-4-1 Maximum Ratings Marking 11 Chip N0724 Symbol Min. 0 Values Typ. – – – – – Max. 5 85 150 35 +15 Unit V °C °C mA kV Note / Test Condition – – – – – Operating temperature range Storage temperature range DC current A1 to B1 Contact discharge between all pins Table 2 Parameter Resistor R1 Leakage currents, A1 or B1 to GND Line capacitance to GND Insertion loss at 0 V bias voltage Pin A1 to B1 TOP TSTG Imax VESD -40 -65 – -15 Electrostatic Discharge According to IEC61000-4-2 Electrical characteristics at TA = 25°C Symbol Min. Values Typ. 75 0.1 0.1 44 30 Max. 78.75 120 120 – – nA µA pF dB 71.25 – – – – Unit Note / Test Condition – R1 IR CL IL VR = ±3 V VR = ±14 V V=0V f = 0.8... 2 GHz, ZS = ZL = 75 Ω Data Sheet 4 V2.0, 2008-05-28 BGF111 TV-Out Filter BGF111 Int. IO A1 R1 75 Ohm Ext. IO B1 D1 A2 (GND) D2 B2 (GND) bgf111 _schematic Figure 1 Schematic Insertion Loss BGF111 S21=f(freq, Ubias) 0 -5 -10 S21 [dB] -15 -20 -25 -30 -35 -40 1 10 100 f [MHz] bgf111_Insertion_Loss dB(S21@0V) dB(S21@3V) 1000 10000 Figure 2 Insertion loss as function of bias voltage, ZS = ZL = 75 Ω Data Sheet 5 V2.0, 2008-05-28 BGF111 TV-Out Filter BGF111 Package Outline 0.75 ±0.05 0.6 ±0.05 0.4 0.1 C (0.175 ±0.05 ) (0.175 ±0.05 ) (0.175 ±0.05 ) B Pin A1 Corner Index Area 2) 0.2 ±0.05 STANDOFF SEATING PLANE 3) A 0.4 A2 B2 A1 B1 4x C ø0.05 M A B 0.25 ±0.04 1) 0.08 C 4x COPLANARITY 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) A1 corner identified by marking 3) Primary datum C and seating plane are defined by the domed crowns of the balls WLP-4-1-PO-N V02 Figure 3 Package outline Tape for BGF111 4 ±0.1 0.25 0.85 ±0.05 8 ±0.1 Pin 1 Corner Index Area 0.85 ±0.05 0.65 WLP-4-1-TP V05 Figure 4 Tape for BGF111 / WLP-4-1 You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 6 (0.175 ±0.05 ) V2.0, 2008-05-28 0.75 ±0.05