BGF121

D a t a S h e e t , V 2 . 2 , J u n e 2 00 9 B G F 12 1 T r a n s i e n t V o l t ag e S u p p r es s o r S m a l l S i g n a l D i s c r et e s Edition 2009-06-16 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF121 BGF121 Revision History: 2009-06-16, V2.2 Previous Version: 2009-02-25, V2.1 Page 7 Subjects (major changes since last revision) Figure 5 updated for 2mm component pitch Data Sheet 3 V2.2, 2009-06-16 BGF121 Transient Voltage Suppressor Transient Voltage Suppressor Features • 1 channel TVS diode designed for portable application • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on all IOs • Wafer Level Package with SnAgCu solder balls • RoHS and WEEE compliant package • Very small form factor TVS • High peak pulse power • Stand-off voltage up to 10 V • Low clamping voltage factor Vcl/Vbr • Fast response time WLP-4-1-3D Description The BGF121 is a single line TVS diode designed for transient voltage and power overstress suppression. All pins are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green package with a size of only 0.75 mm x 0.75 mm and a total height of 0.60 mm. A1 A2 B1 ( GND ) Figure 1 Type BGF121 Schematic Package WLP-4-1 Marking 21 B 2 ( GND) Chip N0743 Data Sheet 4 V2.2, 2009-06-16 BGF121 Transient Voltage Suppressor Table 1 Parameter Maximum Ratings Symbol Min. Values Typ. – – – – Max. 10 +85 +150 15 V °C °C kV 0 -30 -55 -15 Unit Note / Test Condition – – – – Voltage at all pins to GND Operating temperature range Storage temperature range Electrostatic Discharge According to IEC61000-4-2 Table 2 Parameter Line capacitance to GND Forward voltage Break down voltage Electrical Characteristics1) VP TOP TSTG VESD Symbol Min. Values Typ. 160 1.1 16 16.9 17.7 18.7 20 1.3 Max. Unit pF V V Note / Test Condition CT VF2) VBR Clamping voltage during transient Leakage current of line to GND VCL3) IR V nA 1 10 100 800 VR = 0 V IF = 850 mA IR = 15 mA TA= -30 °C TA= 25 °C IR = 1 A, TA= 85 °C VR = 10 V TA= -30 °C TA= 25 °C TA= 85 °C 1) Otherwise specified at TA = 25 °C 2) To avoid high temperature and possible disassembling of component from the board, DC current operation to be limited to few seconds 3) 8/20 µs pulse waveform according to IEC61000-4-5 Data Sheet 5 V2.2, 2009-06-16 BGF121 Transient Voltage Suppressor Line Capacitance BGF121 200 Line Capacitance [pF] 150 100 50 0 0 2 4 Voltage [V] 6 8 10 Figure 2 Line Capacitance vs reverse voltage (typical values) at 25°C BGF121 Peak pulse current vs clamping voltage 100.0 Reverse Current IR [A] 10.0 1.0 17 19 21 23 25 27 29 Clamping Voltage VCL [V] Figure 3 Peak pulse reverse current (IEC61000-4-5) versus clamping voltage (typical values) at 25°C Data Sheet 6 V2.2, 2009-06-16 BGF121 Transient Voltage Suppressor Package Outline Solder balls face down Solder balls face up 0.75 ±0.05 0.6 ±0.05 0.4 0.1 C (0.175 ±0.05 ) (0.175 ±0.05 ) (0.175 ±0.05 ) B Pin A1 Corner Index Area 2) 0.2 ±0.05 STANDOFF SEATING PLANE 3) A 0.4 A2 B2 A1 B1 4x C ø0.05 M A B 0.25 ±0.04 1) 0.08 C 4x COPLANARITY 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) A1 corner identified by marking 3) Primary datum C and seating plane are defined by the domed crowns of the balls WLP-4-1-PO-N V02 Figure 4 Package WLP-4-1 (dimension in mm) Tape and reel specification 4 0.25 0.85 8 Pin 1 Corner Index Area 0.85 0.65 WLP-4-1-TP-N V05 Figure 5 Tape for WLP-4-1 (dimension in mm) You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products Data Sheet 7 (0.175 ±0.05 ) V2.2, 2009-06-16 0.75 ±0.05