BGM781N11_10

Data Sheet, Rev.3.2, Oct. 2010 BGM781N11 GPS Front-End Module RF & Protection Devices Edition 2010-10-28 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2010. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGM781N11 Oct. 2010 Revision History: GPS Front-End Module, Rev.3.2 Previous Version: 2009-10-30, Rev.3.1 Page 10 Subjects (major changes since last revision) Package pin tolerances changed from 35µm to 50µm Data Sheet 3 Rev.3.2, 2010-10-28 GPS Front-End Module BGM781N11 1 GPS Front-End Module Features • Operating frequency: 1575.42 MHz • High Gain: 18.6 dB • Low Noise Figure: 1.7 dB • Low current consumption: 3.3 mA • Out-of-band rejection in cellular bands: 80 dBc • Input compression point in cellular bands: 20 dBm • Supply voltage: 1.5 V to 3.6 V • Tiny TSNP-11-2 leadless package • RF input internally pre-matched to 50 Ω • RF output internally matched to 50 Ω • HBM ESD capability of all pins: 2 kV • IEC ESD contact discharge of RF input pin: 8 kV • Only 2 external SMD parts • RoHS compliant package (Pb-free) Application • 1575.42 MHz GPS, Galileo, GPS phones, personal navigaton devices TSNP11-2.vsd TSNP-11-2 Package top view (2.5 x 2.5 x 0.73 mm³) BO1 AI BIAS PON VCC BIAS Pre-Filter RFIN LNA Post-Filter BGM781N11 BG1 GND BG2 BGM781_Blockdiagram_with_external.vsd Figure 1 Data Sheet Blockdiagram with main external components 4 Rev.3.2, 2010-10-28 BGM781N11 Description 2 Description The BGM781N11 is a combination of a low-insertion-loss pre-filter with Infineon’s high performance low noise amplifier (LNA) and a high-attenuation post-filter for Global Positioning System (GPS) applications. Through the low insertion loss of the filters, the BGM781N11 provides 18.6 dB gain, 1.7 dB noise figure and high linearity performance. In addition BGM781N11 provides very high out-of-band attenuation in conjunction with a high input compression point. Its current consumption is as low as 3.3 mA. It operates over the 1.5 V to 3.6 V supply voltage range. Type BGM781N11 Pin Definition and Function Table 1 Pin No. 1 2 3 4 5 6 7 8 9 10 11 Maximum Ratings Table 2 Parameter 1) Package TSNP-11-2 Marking M781 Pin Definition and Function Symbol BG2 PON VCC n.c. RFIN BG1 BO1 AI BIAS RFOUT GND Function Optional Output-Filter GND Power On/Off Power Supply not used RF Input Input-Filter GND Input-Filter Output LNA Input BIAS RF Output Package Middle Island Maximum Ratings Symbol Value -1...1 -0.3...3.6 -0.3...3.6 -3...3 -3...3 -3...3 -0.3...0.9 -0.3...0.9 -3...3 25 3 Unit V V V V V V V V V mA dBm Continuous wave signal f = 1575.42 MHz 50 ohm source and load impedances Rev.3.2, 2010-10-28 Note / Test Condition Voltage at pin BG2 to GND Voltage at pin PON to GND Voltage at pin VCC to GND Voltage at pin RFIN to GND Voltage at pin BG1 to GND Voltage at pin B01 to GND Voltage at pin AI to GND Voltage at pin BIAS to GND Voltage at pin RFOUT to GND Current into pin VCC RF input power inband VBG2 VPON VCC VRFIN VBG1 VBO1 VAI VBIAS VRFOUT IVCC PIN Data Sheet 5 BGM781N11 Description Table 2 Parameter 1) Maximum Ratings (cont’d) Symbol Value 21 Unit Note / Test Condition Continuous wave signal f = 50 - 1460 MHz and 1710 - 4000 MHz 50 ohm source and load impedances mW °C °C °C kV according to JESD22A-114 RF input power out of band PIN,OOB Total power dissipation Junction temperature Ambient temperature range Storage temperature range ESD capability HBM of all pins, with pin 6 and GND middle island pin 11 tied together ESD contact discharge capability of RF input pin 5 Ptot TJ TA TSTG VESD1 90 150 -40... 85 -65... 85 2 VESD2 8 kV according to IEC61000-4-2 1) All voltages refer pin-to-pin, unless otherwise specified. Data Sheet 6 Rev.3.2, 2010-10-28 BGM781N11 Electrical Characteristics 3 Electrical Characteristics Electrical Characteristics: TA = 25 °C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V1) Symbol Min. Values Typ. 1.8 3.3 0.2 5 5 5 Max. 3.6 3 Vcc 0.4 1 V mA μA V V μA μA μs μs ON-Mode OFF-Mode ON-Mode OFF-Mode ON-Mode OFF-Mode OFF- to ON-Mode ON- to OFF-mode 1.5 1.0 0 Unit Note / Test Condition Table 3 Parameter Supply Voltage Supply Current Power On Control Voltage Power On Control Current Power Gain Settling Time 2) VCC ICC Vpon Ipon tS Passband Parameters @ f = 1575.42 MHz Insertion Power Gain Noise Figure 3) |S21|2 17.1 - 18.6 1.7 12 15 40 -7 -15 20 20 2.3 - dB dB dB dB dB dBm dBm Input Return Loss Output Return Loss Reverse Isolation Inband Input 3rd Order Intercept Point Inband Input 1 dB Compression Point Out-of-band Input 1 dB Compression Point Out-of-band Input 1 dB Compression Point Stopband Parameters Rejection4) Rejection Rejection Stability 4) 4) NF RLin RLout 1/|S12|2 IIP3 IP1dB IP1dB_900M IP1dB_1710M ZS = 50 Ω f1 = 1575.42 MHz f2 = f1 + 1 MHz f1 = 1575.42 MHz f1 = 900 MHz f1 = 1710 MHz Rej900M Rej1800M Rej2400M k - 90 80 72 >1 - dBc dBc dBc f = 806 MHz - 928 MHz f = 1710 MHz - 1980 MHz f = 2400 MHz - 2500 MHz f = 20 MHz - 20 GHz 1) Specification based on performance as measured on BGM781N11application board shown in Figure 3 and including PCB losses (unless noted otherwise) 2) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode 3) PCB and connector losses subtracted, verified on AQL base 4) Rejection=|(1/|S21|2 at stopband frequency)|+|(1/|S21|2 at 1575.42 MHz)| Data Sheet 7 Rev.3.2, 2010-10-28 BGM781N11 Application Information 4 4.1 Application Information Application Circuit BG2 BGM781N11 (Topview) 1 RFOUT BIAS AI L2 PON VCC C1 n.c. RFIN GND BO1 BG1 L1 BGM781_Application_circuit_with_external.vsd Figure 2 Table 4 Name C1 L1 L2 N1 Application circuit with external components Bill of Materials Value 1 μF 3.6 nH 33 nH BGM781N11 Package 0402 0402 0402 TSNP-11-2 Manufacturer Various muRata LQG15HS muRata LQG15HS Infineon Function Supply voltage filtering (optional) Input matching Bias GPS FE Module Data Sheet 8 Rev.3.2, 2010-10-28 BGM781N11 Application Information 4.2 Application Board BGM781_AppBoard_Layout_top.vsd Figure 3 Top view of application board Copper, 35μm, gold plated Rogers RO4003C, 0.2mm Copper, 35μm FR4, 0.8mm Copper, 35μm BGM781_AppBoard_Cross_Section.vsd Figure 4 Cross section view of application board Data Sheet 9 Rev.3.2, 2010-10-28 BGM781N11 Package Information 5 Package Information Figure 5 Side and bottom views of TSNP-11-2 package Pin 1 marking Laser marking M781 1025 BGM781N11 Type code 2010, CW 25 Date code (YYWW) TSNP11_Marking_Layout_BGM781.vsd Figure 6 Marking layout Data Sheet 10 Rev.3.2, 2010-10-28 BGM781N11 Package Information Figure 7 Recommended TSNP-11-2 footprint for optimum RF performance Figure 8 Alternative TSNP-11-2 footprint for low cost PCB designs Data Sheet 11 Rev.3.2, 2010-10-28 BGM781N11 Packing Information 6 Packing Information Figure 9 TSNP-11-2 carrier tape Figure 10 TSNP-11-2 pin 1 orientation in tape Data Sheet 12 Rev.3.2, 2010-10-28