BGS12AL7-6

BGS12AL7-6 SPDT RF Switch Data Sheet Revision 2.0, 2009-11-24 Industrial & Multimarket Edition 2009-11-24 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGS12AL7-6 SPDT RF Switch BGS12AL7-6 SPDT RF Switch Revision History: 2009-11-24, Revision 2.0 Previous Revision: 2009-09-14, V1.3 Page 7 8 11 Subjects (major changes since last revision) Final Datasheet Features Functional Diagram max. Values for Insertion Loss, current consumtion at Vdd Pin Trademarks of Infineon Technologies AG A-GOLD™, BlueMoon™, COMNEON™, CONVERGATE™, COSIC™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CONVERPATH™, CORECONTROL™, DAVE™, DUALFALC™, DUSLIC™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, E-GOLD™, EiceDRIVER™, EUPEC™, ELIC™, EPIC™, FALC™, FCOS™, FLEXISLIC™, GEMINAX™, GOLDMOS™, HITFET™, HybridPACK™, INCA™, ISAC™, ISOFACE™, IsoPACK™, IWORX™, M-GOLD™, MIPAQ™, ModSTACK™, MUSLIC™, my-d™, NovalithIC™, OCTALFALC™, OCTAT™, OmniTune™, OmniVia™, OptiMOS™, OPTIVERSE™, ORIGA™, PROFET™, PRO-SIL™, PrimePACK™, QUADFALC™, RASIC™, ReverSave™, SatRIC™, SCEPTRE™, SCOUT™, S-GOLD™, SensoNor™, SEROCCO™, SICOFI™, SIEGET™, SINDRION™, SLIC™, SMARTi™, SmartLEWIS™, SMINT™, SOCRATES™, TEMPFET™, thinQ!™, TrueNTRY™, TriCore™, TRENCHSTOP™, VINAX™, VINETIC™, VIONTIC™, WildPass™, X-GOLD™, XMM™, X-PMU™, XPOSYS™, XWAY™. Other Trademarks AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO. OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2009-10-19 Data Sheet 3 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 2 3 4 5 6 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Measurement Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Data Sheet 4 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Functional Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Measurement Results (@ T = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application Board: No External Components Necessary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Deembedding Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package TSLP7-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Marking Info . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Board pad (SMD) & Apertures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Data Sheet 5 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Operation Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Data Sheet 6 Revision 2.0, 2009-11-24 SPDT RF Switch BGS12AL7-6 1 • • • • • • • • • Features Low insertion loss High port-to-port-isolation Low harmonic generation On-chip control logic, only one control line required High ESD robustness No external components required General purpose switch for applications up to 3 GHz Small leadless package TSLP-7-6 Lead and halogen free package (RoHS and WEEE compliant) 6 7 5 4 Main features: 1 2 3 Description The BGS12AL7-6 General Purpose RF MOS switch is designed to cover a broad range of applications from 30 MHz to 3 GHz. The symmetric design of its single pole double throw configuration, as shown in Figure 1 offers high design flexibility. This single supply chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. The 0.1 dB compression point exceeds the switch’s maximum input power level of 21 dBm, resulting in linear performance at all signal levels. The RF switch has a very low insertion loss of 0.4 dB in the 1 GHz and 0.5 dB in the 2 GHz range. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. Product Name BGS12AL7-6 Data Sheet Package TSLP7-6 7 Chip M4781 Marking 12 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Features The BGS12AL7-6 RF switch is manufactured in Infineon’s patented MOS technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness. RFin RF1 RF2 GND Decoder +ESD Vdd Ctrl BGS 12AL 7-6_Functional_ Diagramm.vsd Figure 1 Functional Diagram Data Sheet 8 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Maximum Ratings 2 Maximum Ratings Table 1 Parameter Maximum Ratings Symbol Min. Values Typ. – – – – – – Max. 150 5 24 1000 100 1500 – °C V dBm V -65 – – – – – Unit Note / Test Condition – – – – Storage temperature range DC Voltage at all pins to GND RF power max. at all RF ports ESD Capability Human Body Model IEC61340-3-1 Machine Model IEC61340-3-2 Charge Device Model JEDEC JESD22-C101D Table 2 Parameter Ambient temperature RF Frequency Control voltage low Control voltage high Supply voltage 1) Tstg VDC PIN VESD Operation Ranges Symbol Min. Values Typ. – – – – – – – – – – – Max. 85 3 0.3 Vdd 3.6 350 30 – 15 18 21 °C GHz V V V μA μA dBm -30 0.03 -0.3 1.4 2.4 80 – – – – – Unit Note / Test Condition – – – – – – – – – – – TA f VCtrL VCtrlH Vdd IVdd ICtrl Pin Current consumption Vdd Pin (over temperature) Current Consumption Vctrl Pin Power Range (VSWR ∞: 1) (VSWR 3: 1) (VSWR 1: 1) 1) Supply voltage must be connected before Control Voltage Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Data Sheet 9 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Pin Description 3 Pin Description Table 3 Pin No. 1 2 3 4 5 6 7 Pin Description Name RF2 GND RF1 Vdd RFIN CTRL NC Pin Type I/O GND I/O PWR I/O I NC Buffer Type Function RF Port 2 Out Ground RF Port 1 Out Supply Voltage RF Port In Control Pin It is recommended to connect Pin 7 to Ground Ctrl 6 RFin 5 Vdd 4 7 Gnd 1 RF2 2 GND 3 RF1 T SLP7- 6.vsd Figure 2 Table 4 Ctrl 1 0 1 Pin Configuration (top view) Truth Table RF 1 1 0 RF 2 0 1 Data Sheet 10 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Electrical Specifications 4 • • • • • Electrical Specifications Termination port impedance: Z0 = 50 Ω Temperature range: TA = -30 °C...+85 °C Supply Voltage: Vdd = 2.8 V Pin = 15 dBm Across operating range of control voltages: VCtrH = 1.4...2.8 V Electrical Characteristics Symbol Min. Values Typ. 0.3 0.5 20 15 50 32 25 50 32 25 50 32 25 30 20 2) 2) 2) 2) 2) 2) 2) 1)2) 1) Test Conditions: Table 5 Parameter Unit Max. 0.51)2) 0.6 0.7 – – – – – – – – – – – – – – -50 -50 5 5 – – 1) 1) Note / Test Condition Insertion Loss IL – – – dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm μs μs μA dBm f = 0.1 GHz TX, f = 1 GHz TX, f = 2 GHz TX, f = 0.1 GHz f = 1 GHz f = 2 GHz f = 0.1 GHz f = 1 GHz f = 2 GHz f = 0.1 GHz f = 1 GHz f = 2 GHz f = 0.1 GHz f = 1 GHz f = 2 GHz f = 1 GHz f = 2 GHz f = 1 GHz f = 2 GHz f = 1 GHz f = 1 GHz – 0.35 302) 1) Return Loss RL – 15 12 Isolation RFin - RF1 ISORFin-RF1 – 20 15 Isolation RFin - RF2 ISORFin-RF2 – 20 15 Isolation RF1 - RF2 ISORF1-RF2 – 24 15 Isolation RF ports - Vdd, Vctrl ISORF-DC 25 15 – – – – – 21 2) Harmonic Generation up to 12.75 GHz PHarm On Switching Time (10-90%) RF Off Switching Time (10-90%) RF Current Consumption at Vdd Pin Input 0.1 dB compression -75 -80 32) 0.5 – ton toff Idd P0.1dB 2) 140 f = 1 GHz 1) @TA= 25 °C 2) Not measured in production, verified by design Data Sheet 11 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Measurement Results 5 Measurement Results Insertion Loss RFin to RF1 / RFin to RF2 0.0 -0.2 -0.4 Return Loss RFin Port 0 -5 -10 Return Loss (dB) -15 -20 -25 -30 -35 -40 -45 -50 0.0 0.5 1.0 1.5 2.0 freq, GHz Isolation RFin to RF2 / RFin to RF1 0 -5 -10 -15 Isolation (dB) -20 -25 -30 -35 -40 -45 -50 2.5 3.0 3.5 4.0 Insertion Loss (dB) -0.6 -0.8 -1.0 -1.2 -1.4 -1.6 -1.8 -2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 RF1 mode RF2 mode RF1 mode RF2 mode freq, GHz Return Loss RF1 Port / RF2 Port 0 -5 -10 Return Loss (dB) -15 -20 -25 -30 -35 -40 -45 -50 0.0 0.5 1.0 1.5 2.0 freq, GHz Isolation RF1 to RF2 / RF2 to RF1 0 -5 -10 -15 Isolation (dB) Pout (dBm) -20 -25 -30 -35 -40 -45 -50 0.0 0.5 1.0 20 15 10 5 1.5 2.0 freq, GHz 2.5 3.0 3.5 4.0 8 10 12 14 16 25 30 2.5 3.0 3.5 4.0 RF1 mode RF2 mode RF1 mode RF2 mode 0.0 0.5 1.0 1.5 2.0 freq, GHz Pin versus Pout (0.1dB Compression Point) 2.5 3.0 3.5 4.0 no compression observed up to 24dBm RF1 mode RF2 mode RF1/RF2 mode 18 20 22 24 26 28 30 BGS 12AL 7-6_measurement_ results_V 3.vsd Pin (dBm) Figure 3 Measurement Results (@ T = 25°C) Data Sheet 12 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Measurement Results Application Board BGS 12AL 7-6_applic ation _board .vsd Figure 4 Application Board: No External Components Necessary BGS 12AL 7-6_application _deem bedding _board .vsd Figure 5 Deembedding Board Data Sheet 13 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Package Outlines 6 Package Outlines Package TSLP7-6 _V3.vsd Figure 6 Package TSLP7-6 Marking TSLP7-6_V 3.vsd Figure 7 Marking Info BGS12 AL7-6 _board _pad_ and_apertures _V2.vsd Figure 8 Board pad (SMD) & Apertures Data Sheet 14 Revision 2.0, 2009-11-24 BGS12AL7-6 SPDT RF Switch Package Outlines 0.5 BGS 12AL7 -6_Tape_ and_Reel_ V1.vsd Figure 9 Tape and Reel Dimensions in mm You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 15 Revision 2.0, 2009-11-24 www.infineon.com Published by Infineon Technologies AG