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BGX50A_07

BGX50A_07

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    BGX50A_07 - Silicon Switching Diode Array - Infineon Technologies AG

  • 数据手册
  • 价格&库存
BGX50A_07 数据手册
BGX50A... Silicon Switching Diode Array • Bridge configuration • High-speed switching diode chip • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BGX50A " ,! ," , , !  Type BGX50A Parameter Diode reverse voltage Peak reverse voltage Forward current Package SOT143 Configuration bridge Symbol VR VRM IF IFSM Ptot Tj Tstg Symbol RthJS Marking U1s Value 50 70 140 210 150 -65 ... 150 mW °C mA Unit V Maximum Ratings at TA = 25°C, unless otherwise specified Non-repetitive peak surge forward current Total power dissipation TS ≤ 74°C Junction temperature Storage temperature Thermal Resistance Parameter Junction - soldering point 2) BGX50A 1Pb-containing 2For Value 360 Unit K/W package may be available upon special request calculation of RthJA please refer to Application Note Thermal Resistance 1 2007-03-27 BGX50A... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Breakdown voltage V(BR) Reverse current VR = 50 V VR = 50 V, TA = 150 °C Forward voltage IF = 100 mA VF IR 0.2 100 1.3 V Unit µA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA , RL = 100 Ω Test circuit for reverse recovery time D.U.T. CT trr - - 1.5 6 pF ns Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns, Ri = 50Ω Oscillograph ΙF Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF EHN00019 2 2007-03-27 BGX50A... Reverse current IR = ƒ (TA) VR = Parameter 10 5 nA BGX 50A EHB00146 Forward Voltage VF = ƒ (TA) IF = Parameter 1.0 V BGX 50A EHB00149 ΙR 10 4 5 max. V R = 70 V VF Ι F = 100 mA 10 mA 10 3 5 typ. 70V 25V 0.5 1 mA 0.1 mA 10 2 5 10 1 0 50 100 ˚C TA 150 0 0 50 100 TA ˚C 150 Forward current IF = ƒ (VF) TA = 25°C 150 BGX 50A EHB00147 Peak forward current IFM = ƒ (tp) TA = 25°C 10 2 BGX 50A EHB00148 ΙF mA Ι FM A D= tp T tp T 100 10 1 5 typ max D= 0.005 0.01 0.02 0.05 0.1 0.2 50 10 0 5 0 0 0.5 1.0 V VF 1.5 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 t s 10 0 3 2007-03-27 BGX50A... Forward current IF = ƒ (T S) BGX50A 160 mA 120 IF 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS 4 2007-03-27 Package SOT143 BGX50A... Package Outline 0.15 MIN. 2.9 ±0.1 1.9 4 3 B 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.4 ±0.15 10˚ MAX. 1 2 10˚ MAX. 0.2 0.8 +0.1 -0.05 0.4 +0.1 -0.05 1.7 0.25 M B 0.08...0.1 A 5 0...8˚ 0.2 M A Foot Print 0.8 1.2 0.8 0.9 1.2 0.8 0.8 Marking Layout (Example) Manufacturer RF s Pin 1 56 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.9 1.1 2005, June Date code (YM) BFP181 Type code 4 0.2 Pin 1 3.15 2.6 8 1.15 5 2007-03-27 BGX50A... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-03-27
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