BSB056N10NN3G

n-Channel Power MOSFET OptiMOS™ BSB056N10NN3 G Data Sheet 2.3, 2011-02-28 Final Industrial & Multimarket OptiMOS™ Power-MOSFET BSB056N10NN3 G 1 Description OptiMOS™100V products are class leading power MOSFETs for highest power density and energy efficient solutions. Ultra low gate- and output charges together with lowest on state resistance in small footprint packages make OptiMOS™ 100V the best choice forthe demanding requirements of voltage regulator solutions in Solar, Drives, Datacom and Telecom applications. Super fast switching Control FETs together with low EMI Sync FETs provide solutions that are easy to design in. OptiMOS™ products are available in high performance packages to tackle your most challenging applications giving full flexibility in optimizing space- efficiency and cost. Features • • • • • • • • • Optimized for high switching frequency DC/DC converter Excellent Qg x RDS(on) product (FOM) Very low on-resistance RDS(on) Pb-free plating; RoHS compliant Halogen-free according to IEC61249-2-21 Double sided cooling Compatible with DirectFET® package MN footprint and outline1) Low parasitic inductance Low profile (2|ID|RDS(on)max, ID=30 A nA mΩ µA V Unit Note / Test Condition VGS=0 V, ID=1 mA VDS=VGS, ID=100 µA VDS=100V, VGS=0 V, Tj=25 °C VDS=100 V, VGS=0 V, Tj=125 °C VGS=20 V, VDS=0 V VGS=10 V, ID=30A VGS=6 V, ID=15A VGS(th) IDSS IGSS 34 Drain-source on-state resistance RDS(on) RG gfs Table 5 Parameter Dynamic characteristics Symbol Min. Values Typ. 4100 750 27 15 9 25 8 Max. 5500 1000 ns pF Unit Note / Test Condition Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Ciss Coss Crss VGS=0 V, VDS=50 V, f=1 MHz VDD=50V, VGS=10 V, ID=30 A, RG= 1.6 Ω td(on) tr td(off) tf Final Data Sheet 3 2.3, 2011-02-28 OptiMOS™ Power-MOSFET BSB056N10NN3 G Electrical characteristics Table 6 Parameter Gate charge characteristics1) Symbol Min. Values Typ. 17 9.7 20 56 4.2 73 74 97 V nC Max. nC Unit Note / Test Condition Gate to source charge Gate to drain charge Switching charge Gate charge total Output charge Qgs Qgd Qsw VDD=50 V, ID=30 A, VGS=0 to 10 V Qg Vplateau Qoss VDD=50 V, VGS=0 V 1) See figure 16 for gate charge parameter definition Table 7 Parameter Reverse diode characteristics Symbol Min. Is IS,pulse Values Typ. Max. 65 316 0.9 174 64 1.2 V nC ns A Unit Note / Test Condition Diode continuous forward current Diode pulse current Diode forward voltage Reverse recovery charge Reverse recovery time TC=25 °C VGS=0 V, IF=IS, Tj=25 °C VR=50V, IF=30A, diF/dt=100 A/µs VSD Qrr trr Final Data Sheet 4 2.3, 2011-02-28 OptiMOS™ Power-MOSFET BSB056N10NN3 G Electrical characteristics diagrams 5 Electrical characteristics diagrams Table 8 1 Power dissipation 2 Drain current Ptot = f(TC) Table 9 3 Safe operating area TC=25 °C ID=f(TC); parameter:VGS 4 Max. transient thermal impedance ID=f(VDS); Tj=25 °C; D=0; parameter: Tp Z(thJC)=f(tp); parameter: D=tp/T Final Data Sheet 5 2.3, 2011-02-28 OptiMOS™ Power-MOSFET BSB056N10NN3 G Electrical characteristics diagrams Table 10 5 Typ. output characteristics TC=25 °C 6 Typ. drain-source on-state resistance ID=f(VDS); Tj=25 °C; parameter: VGS Table 11 7 Typ. transfer characteristics RDS(on)=f(ID); Tj=25 °C; parameter: VGS 8 Typ. forward transconductance ID=f(VGS); |VDS|>2|ID|RDS(on)max gfs=f(ID); Tj=25 °C Final Data Sheet 6 2.3, 2011-02-28 OptiMOS™ Power-MOSFET BSB056N10NN3 G Electrical characteristics diagrams Table 12 9 Drain-source on-state resistance 10 Typ. gate threshold voltage RDS(on)=f(Tj); ID=30 A; VGS=10 V Table 13 11 Typ. capacitances VGS(th)=f(Tj); VGS=VDS; 12 Forward characteristics of reverse diode C=f(VDS); VGS=0 V; f=1 MHz IF=f(VSD); parameter: Tj Final Data Sheet 7 2.3, 2011-02-28 OptiMOS™ Power-MOSFET BSB056N10NN3 G Electrical characteristics diagrams Table 14 13 Avalanche characteristics 14 Typ. gate charge IAS=f(tAV); RGS=25 Ω; parameter: Tj(start) Table 15 15 Drain-source breakdown voltage VGS=f(Qgate); ID=30 A pulsed; parameter: VDD 16 Gate charge waveforms VBR(DSS)=f(Tj); ID=1 mA Final Data Sheet 8 2.3, 2011-02-28 OptiMOS™ Power-MOSFET BSB056N10NN3 G Package outlines 6 Package outlines Figure 1 Outlines MG-WDSON-2, dimensions in mm/inches Final Data Sheet 9 2.3, 2011-02-28 OptiMOS™ Power-MOSFET BSB056N10NN3 G Package outlines 7 Package outlines Figure 2 Outlines MG-WDSON-2, dimensions in mm/inches 10 2.3, 2011-02-28 Final Data Sheet OptiMOS™ Power-MOSFET BSB056N10NN3 G Package outlines 8 Package outlines Final Data Sheet 11 2.3, 2011-02-28 OptiMOS™ Power-MOSFET BSB056N10NN3 G Revision History 9 Revision History Revision History: 2011-02-28, 2.3 Previous Revision: Revision 0.1 2.0 2.3 Subjects (major changes since last revision) Release of target data sheet Release of Final data sheet Package outlines errata corrections We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: erratum@infineon.com Edition 2011-02-28 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.. Final Data Sheet 12 2.3, 2011-02-28