BSC123N08NS3G

BSC123N08NS3 G OptiMOS™3 Power-Transistor Features • Ideal for high frequency switching and sync. rec. • Optimized technology for DC/DC converters • Excellent gate charge x R DS(on) product (FOM) • Superior thermal resistance • N-channel, normal level • 100% avalanche tested • Pb-free plating; RoHS compliant • Qualified according to JEDEC1) for target applications • Halogen-free according to IEC61249-2-21 Type BSC123N08NS3 G Product Summary V DS R DS(on),max ID 80 12.3 55 V mΩ A Package Marking PG-TDSON-8 123N08NS Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID V GS=10 V, T C=25 °C V GS=10 V, T C=100 °C V GS=10 V, T A=25 °C, R thJA=50 K/W 2) Pulsed drain current3) Avalanche energy, single pulse Gate source voltage 1) 2) Value 55 35 Unit A 11 220 70 ±20 mJ V I D,pulse E AS V GS T C=25 °C I D=33 A, R GS=25 Ω J-STD20 and JESD22 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 for more detailed information 4) See figure 13 for more detailed information Rev. 2.5 page 1 2009-11-04 BSC123N08NS3 G Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Power dissipation Symbol Conditions P tot T C=25 °C T A=25 °C, R thJA=50 K/W 2) Operating and storage temperature IEC climatic category; DIN IEC 68-1 T j, T stg Value 66 2.5 -55 ... 150 55/150/56 °C Unit W Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction - case R thJC bottom top Device on PCB R thJA minimal footprint 6 cm2 cooling area2) Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=33 µA V DS=80 V, V GS=0 V, T j=25 °C V DS=80 V, V GS=0 V, T j=125 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=33 A V GS=6 V, I D=16 A Gate resistance Transconductance RG g fs |V DS|>2|I D|R DS(on)max, I D=33 A 80 2 2.8 0.1 3.5 1 µA V 1.9 18 62 50 K/W 22 10 10 10.3 14.1 2 44 100 100 12.3 24 Ω S nA mΩ Rev. 2.5 page 2 2009-11-04 BSC123N08NS3 G Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 5) Gate to source charge Gate charge at threshold Gate to drain charge Switching charge Gate charge total Gate plateau voltage Output charge Reverse Diode Diode continuous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge 5) Values typ. max. Unit C iss C oss Crss t d(on) tr t d(off) tf V DD=40 V, V GS=10 V, I D=20 A, R G=1.6 Ω V GS=0 V, V DS=40 V, f =1 MHz - 1430 385 15 12 18 19 4 1870 517 - pF ns Q gs Q g(th) Q gd Q sw Qg V plateau Q oss V DD=40 V, V GS=0 V V DD=40 V, I D=20 A, V GS=0 to 10 V - 6.3 3.6 3.8 6.5 19 4.9 25 25 34 nC V IS I S,pulse V SD t rr Q rr T C=25 °C V GS=0 V, I F=33 A, T j=25 °C - 0.9 45 54 55 220 1.2 - A V ns nC V R=40 V, I F=20A, di F/dt =100 A/µs - See figure 16 for gate charge parameter definition Rev. 2.5 page 3 2009-11-04 BSC123N08NS3 G 1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C); V GS≥10 V 80 60 50 60 40 P tot [W] 40 I D [A] 0 25 50 75 100 125 150 175 30 20 20 10 0 0 0 25 50 75 100 125 150 175 T C [°C] T C [°C] 3 Safe operating area I D=f(V DS); T C=25 °C; D =0 parameter: t p 103 4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T 10 limited by on-state resistance 1 µs 10 2 10 µs 1 0.5 I D [A] 100 µs Z thJC [K/W] 101 0.2 0.1 0.05 0.02 1 ms 0.1 100 10 ms 0.01 single pulse DC 10-1 10-1 100 101 102 0.01 0 0 0 0 0 0 1 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 2.5 page 4 2009-11-04 BSC123N08NS3 G 5 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 120 8V 10 V 7V 6.5 V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 °C parameter: V GS 50 4.5 V 5V 5.5 V 40 80 6V R DS(on) [mΩ ] 30 I D [A] 20 6V 7V 6.5 V 40 5.5 V 5V 10 8V 10 V 4.5 V 0 0 1 2 3 0 0 10 20 30 40 50 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 60 8 Typ. forward transconductance g fs=f(I D); T j=25 °C 100 50 80 40 60 30 g fs [S] 40 150 °C 25 °C I D [A] 20 10 20 0 0 1 2 3 4 5 6 0 0 40 80 120 160 V GS [V] I D [A] Rev. 2.5 page 5 2009-11-04 BSC123N08NS3 G 9 Drain-source on-state resistance R DS(on)=f(T j); I D=33 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS 25 4 20 3 33 µA 330 µA R DS(on) [mΩ ] 15 V GS(th) [V] 100 140 180 max 2 typ 10 5 1 0 -60 -20 20 60 0 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 104 1000 Ciss 10 3 150°C, max 100 Coss 25 °C C [pF] 102 I F [A] 150 °C 10 101 Crss 25°C, max 100 0 20 40 60 80 1 0.0 0.5 1.0 1.5 2.0 V DS [V] V SD [V] Rev. 2.5 page 6 2009-11-04 BSC123N08NS3 G 13 Avalanche characteristics I AS=f(t AV); R GS=25 Ω parameter: T j(start) 100 14 Typ. gate charge V GS=f(Q gate); I D=20 A pulsed parameter: V DD 12 40 V 10 16 V 8 64 V 10 125 °C 100 °C V GS [V] 25 °C I AV [A] 6 4 2 1 0.1 1 10 100 1000 0 0 5 10 15 20 t AV [µs] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 100 V GS 95 Qg 90 85 V BR(DSS) [V] 80 75 V g s(th) 70 65 Q g(th) Q gs -60 -20 20 60 100 140 180 Q sw Q gd Q g ate 60 T j [°C] Rev. 2.5 page 7 2009-11-04 BSC123N08NS3 G PG-TDSON-8 Rev. 2.5 page 8 2009-11-04 BSC123N08NS3 G Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.5 page 9 2009-11-04