BSD314SPE

BSD314SPE OptiMOS™-P 3 Small-Signal-Transistor Features • P-channel • Enhancement mode • Logic level (4.5V rated) • ESD protected • Qualified according AEC Q101 • 100% Lead-free; RoHS compliant Product Summary V DS R DS(on),max V GS=-10 V V GS=-4.5 V ID 30 140 230 -1.5 PG-SOT-363 6 5 4 V mΩ A 1 2 3 Type BSD314SPE Package PG-SOT-363 Tape and Reel Information L6327: 3000 pcs/ reel Marking XDs Lead Free Yes Packing Non dry Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T A=25 °C T A=70 °C Pulsed drain current Avalanche energy, single pulse I D,pulse E AS T A=25 °C I D=-1.5A, R GS=25 Ω I D=-1.5 A, V DS=-16V, di /dt =-200A/µs, T j,max=150 °C Value -1.5 -1.2 -6.1 6 mJ Unit A Reverse diode d v /dt dv /dt 6 kV/µs Gate source voltage Power dissipation1) Operating and storage temperature ESD Class Soldering Temperature IEC climatic category; DIN IEC 68-1 V GS P tot T j, T stg JESD22-A114 -HBM T A=25 °C ±20 0.5 -55 ... 150 2 (2kV to 4kV) 260 °C 55/150/56 V W °C °C °C Rev 2.1 page 1 2010-03-29 BSD314SPE Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - ambient R thJA 1) Values typ. max. Unit minimal footprint - - 250 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics V (BR)DSS V GS= 0V, I D=-250µA V GS(th) I DSS V DS=VGS, I D=-6.3µA V DS=-30V, V GS=0 V, T j=25 °C V DS=-30V, V GS=0V, T j=150 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=-20V, V DS=0V V GS=-4.5V, I D=-1.2A V GS=-10V, I D=-1.5A Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=-1.2 A Drain-source breakdown voltage Gate threshold voltage Drain-source leakage current -30 -1 - -1.5 - -2 -1 V µA - 153 107 3 -100 -5 230 140 S µA mΩ Performed on 40mm2 FR4 PCB. The traces are 1mm wide, 70µm thick and 20mm long; they are present on both sides of the PCB. 1) Rev 2.1 page 2 2010-03-29 BSD314SPE Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge IS I S,pulse V SD t rr Q rr T A=25 °C V GS=0 V, I F=-1.5A, T j=25 °C V R=-15 V, I F=-1.5A, di F/dt =100 A/µs 0.8 12.5 4.3 -0.5 -6.1 1.1 V ns nC A Q gs Q gd Qg V plateau V DD=-15 V, I D=-1.5 A, V GS=0 to -10 V -0.7 -0.3 -2.9 -3.2 V nC C iss C oss Crss t d(on) tr t d(off) tf V DD=-15V, V GS=-10 V, I D=-1.5 A, R G=6 Ω V GS=0 V, V DS=-15 V, f =1 MHz 221 126 7 5.1 3.9 12.4 2.8 294 168 11 ns pF Values typ. max. Unit Rev 2.1 page 3 2010-03-29 BSD314SPE 1 Power dissipation P tot=f(T A) 2 Drain current I D=f(T A); V GS≤-10 V 1.6 0.5 1.2 0.375 P tot [W] I D [A] 0 40 80 120 0.8 0.25 0.125 0.4 0 0 0 20 40 60 80 100 120 140 160 T A [°C] T A [°C] 3 Safe operating area I D=f(V DS); T A=25 °C; D =0 parameter: t p 101 100 µs 10 µs 1 µs 4 Max. transient thermal impedance Z thJA=f(t p) parameter: D =t p/T 103 100 1 ms 10 ms 0.5 10 2 0.2 0.1 Z thJA [K/W] 10-1 DC 0.05 I D [A] 10 1 0.02 0.01 10-2 single pulse 10 10-3 0 10-4 10 -2 10-1 10 -1 10 0 10 1 10 2 10-5 10-4 10-3 10-2 10-1 100 101 102 V DS [V] t p [s] Rev 2.1 page 4 2010-03-29 BSD314SPE 5 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 8 5V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 °C parameter: V GS 400 3V 7 10 V 4.5 V 350 300 4V 3.3 V 3.5 V 6 4V R DS(on) [mΩ] 5 250 200 150 100 50 0 I D [A] 4 4.5 V 5V 3 3.5 V 2 10 V 3.3 V 1 3V 2.8 V 0 0 1 2 3 4 5 0 1 2 3 4 5 6 7 8 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max 8 Typ. forward transconductance g fs=f(I D); T j=25 °C 6 8 5 6 4 3 g fs [S] 150 °C 25 °C I D [A] 4 2 2 1 0 0 1 2 3 4 5 0 0 1 2 3 4 5 6 7 8 V GS [V] I D [A] Rev 2.1 page 5 2010-03-29 BSD314SPE 9 Drain-source on-state resistance R DS(on)=f(T j); I D=-1.5 A; V GS=-10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V DS=VGS; I D=-6.3 µA parameter: I D 250 2.5 200 2 98 % R DS(on) [mΩ ] 150 98 % typ 100 V GS(th) [V] 1.5 typ 1 2% 50 0.5 0 -60 -20 20 60 100 140 180 0 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz; Tj=25°C 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 103 101 25 °C Ciss Coss 150 °C, 98% 150 °C 10 0 102 C [pF] I F [A] 10-1 25 °C, 98% Crss 101 10-2 100 0 5 10 15 20 10-3 0 0.4 0.8 1.2 1.6 V DS [V] V SD [V] Rev 2.1 page 6 2010-03-29 BSD314SPE 13 Avalanche characteristics I AS=f(t AV); R GS=25 Ω parameter: T j(start) 101 14 Typ. gate charge V GS=f(Q gate); I D=-1.5 A pulsed parameter: V DD 12 10 8 25 °C V GS [V] I AV [A] 100 6 10 V 100 °C 4 125 °C 4V 16 V 2 10-1 100 101 102 103 0 0 1 2 3 t AV [µs] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=-250 µA 16 Gate charge waveforms 33 V GS 32 Qg 31 V BR(DSS) [V] 30 V g s(th) 29 28 Q g(th) Q gs -60 -20 20 60 100 140 Q sw Q gd Q g ate 27 T j [°C] Rev 2.1 page 7 2010-03-29 BSD314SPE SOT-363 Package Outline: Footprint: Packing: Reflow soldering: Rev 2.1 page 8 2010-03-29 BSD314SPE Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev 2.1 page 9 2010-03-29