BSO072N03S

BSO072N03S OptiMOS™2 Power-Transistor Features • Fast switching MOSFET for SMPS • Optimized technology for notebook DC/DC converters • Qualified according to JEDEC for target applications • N-Channel • Logic level • Excellent gate charge x R DS(on) product (FOM) • Very low on-resistance R DS(on) • Superior thermal resistance • Avalanche rated • Pb-free plating; RoHS compliant •Halogen-free according to IEC61249-2-21 Type BSO072N03S Package PG-DSO-8 Marking 072N3S 1) Product Summary V DS R DS(on),max ID PG-DSO-8 30 6.8 15 V mΩ A Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions 10 secs Continuous drain current ID T A=25 °C2) T A=70 °C2) Pulsed drain current Avalanche energy, single pulse Reverse diode d v /dt Gate source voltage Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS dv /dt V GS P tot T j, T stg T A=25 °C2) 2.5 T A=25 °C3) I D=15 A, R GS=25 Ω I D=15 A, V DS=20 V, di /dt =200 A/µs, T j,max=150 °C 15 12 60 145 6 ±20 1.56 -55 ... 150 55/150/56 mJ kV/µs V W °C Value steady state 12 9.6 A Unit Rev. 2.0 page 1 2009-11-04 BSO072N03S Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - soldering point Thermal resistance, junction - ambient R thJS minimal footprint, t p≤10 s minimal footprint, steady state 6 cm2 cooling area2), t p≤10 s 6 cm2 cooling area2), steady state Values typ. max. Unit - - 35 K/W R thJA - - 110 - - 150 - - 50 - - 80 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=45 µA V DS=30 V, V GS=0 V, T j=25 °C V DS=30 V, V GS=0 V, T j=125 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=4.5 V, I D=13 A V GS=10 V, I D=15 A Gate resistance Transconductance 1) 2) 30 1.2 - 1.6 0.1 2 1 V µA - 10 10 7.4 5.7 1 47 100 100 9.3 6.8 Ω S nA mΩ RG g fs |V DS|>2|I D|R DS(on)max, I D=15 A 24 J-STD20 and JESD22 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 Rev. 2.0 page 2 2009-11-04 BSO072N03S Parameter Symbol Conditions min. Dynamic characteristics Thermal resistance, Thermal resistance, Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 4) Gate to source charge Gate charge at threshold Gate to drain charge Switching charge Gate charge total Gate plateau voltage Gate charge total, sync. FET Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage IS I S,pulse V SD T A=25 °C V GS=0 V, I F=2.5 A, T j=25 °C V R=15 V, I F=I S, di F/dt =400 A/µs 0.73 2.5 60 1 V A Q gs Q g(th) Q gd Q sw Qg V plateau Q g(sync) Q oss V DS=0.1 V, V GS=0 to 5 V V DD=15 V, V GS=0 V V DD=15 V, I D=7.5 A, V GS=0 to 5 V 6.6 3.9 4.5 7.2 19 2.7 16 21 8.8 5.2 6.7 10 25 22 27 V nC nC ju C iss ju C oss C rss t d(on) tr t d(off) tf V DD=15 V, V GS=10 V, I D=7.5 A, R G=2.7 Ω V GS=0 V, V DS=15 V, f =1 MHz 2430 865 110 6.5 5.4 27 4.0 3230 1150 160 10 8.1 40 6.0 ns pF Values typ. max. Unit Reverse recovery charge Q rr - - 10 nC 4) See figure 16 for gate charge parameter definition Rev. 2.0 page 3 2009-11-04 BSO072N03S 1 Power dissipation P tot=f(T A); t p≤10 s 2 Drain current I D=f(T A); V GS≥10 V; t p≤10 s 3 16 2.5 12 2 P tot [W] 1.5 I D [A] 0 40 80 120 160 8 1 4 0.5 0 0 0 40 80 120 160 T A [°C] T A [°C] 3 Safe operating area Thermal resistance, Thermal resistance, 102 100 4 Max. transient thermal impedance junction - solderin Z thJS=f(t p) junction - ambientparameter: D =t p/T 102 10 µs 100 µs 100 0.5 101 10 101 limited by on-state resistance 1 ms 10 0.2 0.1 Z thJS [K/W] 0.05 I D [A] 100 1 10 ms 100 1 0.02 10 s 0.01 10-1 0.1 10-1 DC 0.1 single pulse 10-2 0.01 0.1 1 10 100 10-2 2 0.01 0.00001 0.0001 0.001 0.01 0.1 1 10 10 -1 10 0 V DS [V] 10 1 10 10-5 10-4 10-3 t p [s] 10-2 10-1 100 101 Rev. 2.0 page 4 2009-11-04 BSO072N03S 5 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 50 10 V 4.5 V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 °C parameter: V GS 16 40 12 3.4 V 3.6 V 3.8 V 4V 4.2 V 4.5 V 5V 10 V 3V 3.2 V R DS(on) [mΩ ] 2 3 30 3.3 V I D [A] 8 20 3.1 V 4 10 2.8 V 2.6 V 0 0 1 0 0 10 20 30 V DS [V] I D [A] 7 Typ. transfer characteristics Thermal resistance, Thermal resistance, 60 8 Typ. forward transconductance junction - solderin g fs=f(I D); T j=25 °C junction - ambient 80 50 60 40 30 g fs [S] 125 °C 25 °C I D [A] 40 20 20 10 0 0 1 2 3 4 0 0 10 20 30 V GS [V] I D [A] Rev. 2.0 page 5 2009-11-04 BSO072N03S 9 Drain-source on-state resistance R DS(on)=f(T j); I D=15 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS parameter: I D 12 2.5 10 2 450 µA 98 % 8 R DS(on) [mΩ ] V GS(th) [V] 1.5 45 µA 6 typ 1 4 2 0.5 0 -60 -20 20 60 100 140 180 0 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances Thermal resistance, Thermal resistance, 104 10000 12 Forward characteristics of reverse diode junction - solderin I F=f(V SD) junction - ambientparameter: T j 102 100 150 °C 25 °C Ciss 150 °C, 98 % 103 Coss 1000 101 10 C [pF] Crss 102 I F [A] 100 100 1 25 °C, 98% 101 10 10-1 5 10 15 20 25 30 0.1 0 0 0.2 0.4 0.6 0.8 1 1.2 V DS [V] V SD [V] Rev. 2.0 page 6 2009-11-04 BSO072N03S 13 Avalanche characteristics I AS=f(t AV); R GS=25 Ω parameter: T j(start) 100 14 Typ. gate charge V GS=f(Q gate); I D=7.5 A pulsed parameter: V DD 12 10 6V 15 V 8 25 °C 24 V 10 V GS [V] 1000 I AV [A] 100 °C 6 125 °C 4 2 1 1 10 100 0 0 10 20 30 40 t AV [µs] Q gate [nC] 15 Drain-source breakdown voltage Thermal resistance, Thermal resistance, 36 16 Gate charge waveforms junction - soldering point junction - ambient V GS 34 Qg 32 30 V BR(DSS) [V] 28 26 V g s(th) 24 22 Q g(th) Q gs -60 -20 20 60 100 140 180 Q sw Q gd Q g ate 20 T j [°C] Rev. 2.0 page 7 2009-11-04 BSO072N03S Package Outline PG-DSO-8 Thermal resistance, Thermal resistance, junction - soldering point junction - ambient Rev. 2.0 page 8 2009-11-04 BSO072N03S Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. 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Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.0 page 9 2009-11-04