BSO350N03

BSO350N03 OptiMOS®2 Power-Transistor Features • Fast switching MOSFET for SMPS • Optimized technology for notebook DC/DC • Qualified according to JEDEC for target applications • Dual n-channel • Logic level • Excellent gate charge x R DS(on) product (FOM) • Very low on-resistance R DS(on) • Avalanche rated • dv /dt rated 1 Product Summary V DS R DS(on),max ID 30 35 6 V mΩ A P-DSO-8 Type BSO350N03 Package P-DSO-8 Ordering Code Q67042-S4217 Marking 350N3 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Value 10 secs Continuous drain current ID T A=25 °C2) T A=70 °C2) Pulsed drain current Avalanche energy, single pulse Reverse diode dv /dt Gate source voltage Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS dv /dt V GS P tot T j, T stg T A=25 °C2) 2.0 -55 ... 150 55/150/56 T A=25 °C3) I D=6 A, R GS=25 Ω I D=6 A, V DS=20 V, di /dt =200 A/µs, T j,max=150 °C 6 4.8 24 8 6 ±20 1.4 mJ kV/µs V W °C steady state 5 4 A Unit Rev. 1.11 page 1 2004-02-09 BSO350N03 Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - soldering point Thermal resistance, junction - ambient R thJS minimal footprint, t p≤10 s minimal footprint, steady state 6 cm2 cooling area2), t p≤10 s 6 cm2 cooling area2), steady state Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=6 µA V DS=30 V, V GS=0 V, T j=25 °C V DS=30 V, V GS=0 V, T j=125 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=4.5 V, I D=5 A V GS=10 V, I D=6 A Gate resistance Transconductance 1) 2) Values typ. max. Unit - - 50 K/W R thJA - - 110 - - 150 - - 63 - - 90 30 1.2 - 1.6 0.1 2 1 V µA - 10 10 42 29 0.8 12 100 100 52 35 Ω S nA mΩ RG g fs |V DS|>2|I D|R DS(on)max, I D=6 A 6 J-STD20 and JESD22 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 Rev. 1.11 page 2 2004-02-09 BSO350N03 Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics4) Gate to source charge Gate charge at threshold Gate to drain charge Switching charge Gate charge total Gate plateau voltage Gate charge total, sync. FET Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage IS I S,pulse V SD T A=25 °C V GS=0 V, I F=2 A, T j=25 °C V R=12 V, I F=I S, di F/dt =400 A/µs 0.79 2 24 1 V A Q gs Q g(th) Q gd Q sw Qg V plateau Q g(sync) Q oss V DS=0.1 V, V GS=0 to 5 V V DD=15 V, V GS=0 V V DD=15 V, I D=3 A, V GS=0 to 5 V 1.1 0.57 0.73 1.2 2.8 3.0 2.4 3.1 1.4 0.76 1.1 1.8 3.7 3.2 4.1 V nC nC C iss C oss C rss t d(on) tr t d(off) tf V DD=15 V, V GS=10 V, I D=3 A, R G=2.7 Ω V GS=0 V, V DS=15 V, f =1 MHz 360 130 19 2.2 2.2 8.7 1.4 480 170 28 3.3 3.3 13 2.1 ns pF Values typ. max. Unit Reverse recovery charge Q rr - - 3 nC 4) See figure 16 for gate charge parameter definition Rev. 1.11 page 3 2004-02-09 BSO350N03 1 Power dissipation P tot=f(T A); t p≤10 s 2 Drain current I D=f(T A); V GS≥10 V; t p≤10 s 2.5 8 2 6 1.5 P tot [W] I D [A] 1 0.5 0 0 40 80 120 160 4 2 0 0 40 80 120 160 T A [°C] T A [°C] 3 Safe operation area I D=f(V DS); T A=25 °C ; D =0 parameter: t p 102 100 4 Max. transient thermal impedance Z thJS=f(t p) parameter: D =t p/T 102 10 µs 0.5 100 1) 101 10 100 µs 0.2 101 1 ms 10 0.1 100 Z thJS [K/W] I D [A] 1 0.05 limited by on-state resistance 10 ms 10 s 0.02 100 1 0.01 single pulse 10 -1 0.1 DC 10-2 0.01 0.1 1 10 100 10-1 2 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 10 -1 10 0 V DS [V] 10 1 10 10-5 10-4 10-3 t p [s] 10-2 10-1 100 101 Rev. 1.11 page 4 2004-02-09 BSO350N03 5 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 12 10 V 4.5 V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 °C parameter: V GS 120 10 3.6 V 100 3.4 V 3.6 V 3.8 V 4V 8 80 6 3.4 V R DS(on) [mΩ ] I D [A] 60 4.2 V 4.5 V 4 3.2 V 40 5V 10 V 3V 2 2.8 V 2.6 V 20 0 0 1 2 3 0 0 4 8 12 16 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 20 8 Typ. forward transconductance g fs=f(I D); T j=25 °C 25 20 15 15 10 g fs [S] 10 5 125 °C 25 °C I D [A] 5 0 0 1 2 3 4 0 0 5 10 15 20 V GS [V] I D [A] Rev. 1.11 page 5 2004-02-09 BSO350N03 9 Drain-source on-state resistance R DS(on)=f(T j); I D=6 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS parameter: I D 60 2.5 50 2 40 60 µA 98 % R DS(on) [mΩ ] V GS(th) [V] 1.5 6 µA 30 typ 1 20 10 0.5 0 -60 -20 20 60 100 140 180 0 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 103 1000 100 150 °C Ciss 25 °C 10 Coss 25 °C, 98% C [pF] 102 100 I F [A] 1 150 °C, 98 % Crss 10 0.1 10 20 30 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 V DS [V] V SD [V] Rev. 1.11 page 6 2004-02-09 BSO350N03 13 Avalanche characteristics I AS=f(t AV); R GS=25 Ω parameter: T j(start) 10 14 Typ. gate charge V GS=f(Q gate); I D=3 A pulsed parameter: V DD 12 25 °C 15 V 10 6V 100 °C 24 V 8 125 °C 1 V GS [V] 1 10 100 1000 I AV [A] 6 4 2 0.1 0 0 1 2 3 4 5 6 t AV [µs] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 36 V GS 34 32 30 Qg V BR(DSS) [V] 28 26 24 22 20 -60 -20 20 60 100 140 180 V g s(th) Q g (th) Q gs Q sw Q gd Q gate T j [°C] Rev. 1.11 page 7 2004-02-09 BSO350N03 Package Outline P-DSO-8: Outline Footprint Packaging Tape Tube Dimensions in mm Rev. 1.11 page 8 2004-02-09 BSO350N03 Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Straße 53 D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts started herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide (see address list). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.11 page 9 2004-02-09