BSP129_05

BSP129 SIPMOS® Small-Signal-Transistor Features • N-channel • Depletion mode • dv /dt rated • Available with V GS(th) indicator on reel • Pb-free lead plating; RoHS compliant Product Summary V DS R DS(on),max I DSS,min 240 6 0.05 V Ω A PG-SOT-223 Type BSP129 BSP129 Package PG-SOTPG-SOT223 Ordering Code Q67000-S073 Q67042 S4294 Tape and Reel Information E6327: 1000 pcs/reel E6906: 1000 pcs/reel sorted in V GS(th) bands1) Marking BSP129 BSP129 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T A=25 °C T A=70 °C Pulsed drain current I D,pulse T A=25 °C I D=0.36 A, V DS=192 V, di /dt =200 A/µs, T j,max=150 °C Value 0.35 0.28 1.4 Unit A Reverse diode dv /dt dv /dt 6 kV/µs Gate source voltage ESD sensitivity (HBM) as per MIL-STD 883 Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 1) V GS ±20 Class 1 V P tot T j, T stg T A=25 °C 1.8 -55 ... 150 55/150/56 W °C see table on next page and diagram 11 Rev. 1.1 page 1 2005-02-22 BSP129 Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - soldering point (pin 4) SMD version, device on PCB R thJS R thJA minimal footprint 6 cm2 cooling area1) Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Drain-source cutoff current V (BR)DSS V GS=-3 V, I D=250 µA V GS(th) I D(off) V DS=3 V, I D=108 µA V DS=240 V, V GS=-3 V, T j=25 °C V DS=240 V, V GS=-3 V, T j=125 °C Gate-source leakage current On-state drain current Drain-source on-state resistance I GSS I DSS R DS(on) V GS=20 V, V DS=0 V V GS=0 V, V DS=10 V V GS=0 V, I D=25 mA V GS=10 V, I D=0.35 A Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=0.28 A 240 -2.1 -1.4 -1 0.1 µA V 25 115 70 K/W Values typ. max. Unit 50 0.18 6.5 4.2 0.36 10 10 20 6.0 S nA mA Ω Threshold voltage V GS(th) sorted in bands3) J K L M N 2) V GS(th) V DS=3 V, I D=108 µA -1.2 -1.35 -1.5 -1.65 -1.8 - -1 -1.15 -1.3 -1.45 -1.6 V Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (single layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific band cannot be ordered separately. Rev. 1.1 page 2 2005-02-22 BSP129 Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge IS I S,pulse V SD t rr Q rr T A=25 °C V GS=-3 V, I F=0.35 A, T j=25 °C V R=120 V, I F=0.2 A, di F/dt =100 A/µs 0.79 53 65 0.35 1.4 1.2 80 97 V ns nC A Q gs Q gd Qg V plateau V DD=192 V, I D=0.2 A, V GS=-3 to 5 V 0.24 1.7 3.8 0.37 0.36 2.6 5.7 V nC C iss C oss Crss t d(on) tr t d(off) tf V DD=120 V, V GS=-2...5 V, I D=0.2 A, R G=7.6 Ω V GS=-3 V, V DS=25 V, f =1 MHz 82 12 6 4.4 4.1 22 35 108 16 10 6.6 6.2 33 53 ns pF Values typ. max. Unit Rev. 1.1 page 3 2005-02-22 BSP129 1 Power dissipation P tot=f(T A) 2 Drain current I D=f(T A); V GS≥10 V 2 0.4 1.5 0.3 P tot [W] 1 I D [A] 0 40 80 120 160 0.2 0.5 0.1 0 0 0 40 80 120 160 T A [°C] T A [°C] 3 Safe operating area I D=f(V DS); T A=25 °C; D =0 parameter: t p 101 4 Max. transient thermal impedance Z thJA=f(t p) parameter: D =t p/T 102 limited by on-state resistance 10 µs 0.5 100 µs 100 0.2 1 ms 10-1 10 ms Z thJA [K/W] I D [A] 101 0.1 0.05 single pulse 0.02 10-2 0.01 DC 10-3 10 0 100 10 1 10 2 10 3 10-4 10-3 10-2 10-1 100 101 102 V DS [V] t p [s] Rev. 1.1 page 4 2005-02-22 BSP129 5 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 0.7 10 V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 °C parameter: V GS 20 -0.2 V 0V 0.1 V 0.2 V 0.5 V -0.1 V 0.6 15 1V 0.5 0.4 R DS(on) [Ω ] I D [A] 10 0.3 0.5 V 0.2 0V 0.2 V 0.1 V 1V 5 10 V 0.1 -0.2 V -0.1 V 0 0 2 4 6 8 10 0 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max 8 Typ. forward transconductance g fs=f(I D); T j=25 °C 1 0.6 0.8 0.5 0.4 0.6 g fs [S] 0.4 0.2 0 -2 -1 0 1 2 3 I D [A] 0.3 0.2 0.1 0 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 V GS [V] I D [A] Rev. 1.1 page 5 2005-02-22 BSP129 9 Drain-source on-state resistance R DS(on)=f(T j); I D=0.025 A; V GS=0 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V DS=3 V; I D=108 µA parameter: I D 40 0 -0.5 30 -1 98 % R DS(on) [Ω ] V GS(th) [V] 98 % 20 -1.5 typ -2 10 typ 2% -2.5 0 -60 -20 20 60 100 140 180 -3 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Threshold voltage bands I D=f(V GS); V DS=3 V; T j=25 °C 12 Typ. capacitances C =f(V DS); V GS=-3 V; f =1 MHz 10 103 1 102 Ciss I D [mA] N M L K J 108 µA C [pF] 0.1 101 Coss Crss 0.01 -2 -1.5 -1 -0.5 100 0 10 20 30 V GS [V] V DS [V] Rev. 1.1 page 6 2005-02-22 BSP129 13 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 10 15 Typ. gate charge V GS=f(Q gate); I D=0.2 A pulsed parameter: V DD 6 0.5 VDS(max) 5 150 °C 4 25 °C 0.2 VDS(max) 3 2 1 0.8 VDS(max) V GS [V] I F [A] 1 0 -1 -2 -3 150 °C, 98% 0.1 0.01 0 0.5 1 1.5 2 -4 0 1 2 3 4 V SD [V] Q gate [nC] 16 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=250 µA 280 V BR(DSS) [V] 240 200 -60 -20 20 60 100 140 180 T j [°C] Rev. 1.1 page 7 2005-02-22 BSP129 Package Outline: Footprint: Packaging: Dimensions in mm Rev. 1.1 page 8 2005-02-22 BSP129 Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Straße 53 D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide (see address list). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.1 page 9 2005-02-22