Rev 2.2
BSP318S
SIPMOS ® Small-Signal-Transistor
Features • N-Channel
•
Product Summary Drain source voltage Continuous drain current
VDS ID
4
60 0.09 2.6
V Ω A
Enhancement mode
Drain-Source on-state resistance RDS(on)
• Avalanche rated • Logic Level • dv/dt rated
• Pb-free lead plating; RoHS compliant
• Qualified according to AEC Q101
Pin 1 G Pin 2, 4 D PIN 3 S
2 1
VPS05163
3
Type BSP318S
Package PG-SOT223
Tape and Reel
Marking
Packaging Non dry
L6327: 1000 pcs/r BSP318S
Maximum Ratings,at T j = 25 °C, unless otherwise specified Symbol Parameter Continuous drain current Pulsed drain current
Value 2.6 10.4 60 2.6 0.18 6
Unit A
ID ID puls EAS IAR EAR
dv/dt
T A = 25 °C
Avalanche energy, single pulse mJ A mJ kV/µs
I D = 2.6 A, V DD = 25 V, R GS = 25 Ω
Avalanche current,periodic limited by T jmax Avalanche energy, periodic limited by Tjmax Reverse diode dv/dt
I S = 2.6 A, V DS = 20 V, di/dt = 200 A/µs, T jmax = 150 °C
Gate source voltage Power dissipation
VGS Ptot Tj , Tstg
±20 1.8 -55... +150 55/150/56
V W °C
T A = 25 °C
Operating and storage temperature IEC climatic category; DIN IEC 68-1
Page 1
2008-03-21
Rev 2.2
Thermal Characteristics Parameter Characteristics Thermal resistance, junction - soldering point (Pin 4) SMD version, device on PCB: @ min. footprint @ 6 cm 2 cooling area 1) Symbol min. Values typ. 17
BSP318S
Unit max. K/W
RthJS RthJA
-
-
100 -
70
Electrical Characteristics , at T j = 25 °C, unless otherwise specified Parameter Static Characteristics Drain- source breakdown voltage Symbol min. Values typ. 1.6 max. 2 µA 0.1 10 0.12 0.07 1 100 100 0.15 0.09 nA Ω V Unit
V(BR)DSS VGS(th) IDSS
60 1.2
VGS = 0 V, I D = 0.25 mA
Gate threshold voltage, VGS = VDS I D = 20 µA Zero gate voltage drain current
VDS = 60 V, V GS = 0 V, Tj = 25 °C VDS = 60 V, V GS = 0 V, Tj = 150 °C
Gate-source leakage current
IGSS RDS(on) RDS(on)
-
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
VGS = 4.5 V, I D = 2.6 A
Drain-Source on-state resistance
VGS = 10 V, I D = 2.6 A
1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Page 2
2008-03-21
Rev 2.2
Electrical Characteristics, at T j = 25 °C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ.
BSP318S
Unit max.
gfs Ciss Coss Crss td(on)
2.4 -
5.5 300 90 50 12
380 120 65 20
S pF
VDS≥2*I D*RDS(on)max , ID = 2.6 A
Input capacitance
VGS = 0 V, V DS = 25 V, f = 1 MHz
Output capacitance
VGS = 0 V, V DS = 25 V, f = 1 MHz
Reverse transfer capacitance
VGS = 0 V, V DS = 25 V, f = 1 MHz
Turn-on delay time ns
VDD = 30 V, VGS = 4.5 V, I D = 2.6 A, RG = 16 Ω
Rise time
tr
-
15
25
VDD = 30 V, VGS = 4.5 V, I D = 2.6 A, RG = 16 Ω
Turn-off delay time
td(off)
-
20
30
VDD = 30 V, VGS = 4.5 V, I D = 2.6 A, RG = 16 Ω
Fall time
tf
-
15
25
VDD = 30 V, VGS = 4.5 V, I D = 2.6 A, RG = 16 Ω
Page 3
2008-03-21
Rev 2.2
Electrical Characteristics, at T j = 25 °C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Gate charge at threshold Values typ.
BSP318S
Unit max.
QG(th) Qg(5) Qg V(plateau)
-
0.4 7 14 3.6
0.6 10 20 -
nC
VDD = 40 V, ID = 0.1 A, V = 1 V
Gate charge at V GS = 5 V VDD = 40 V, ID = 2.6 A, VGS = 0 to 5 V Gate charge total
VDD = 40 V, ID = 2.6 A, VGS = 0 to 10 V
Gate plateau voltage V
VDD = 40 V , I D = 2.6 A
Parameter Reverse Diode Inverse diode continuous forward current
Symbol min.
Values typ. 0.95 50 0.1 max. 2.6 10.4 1.2 75 0.15
Unit
IS ISM VSD trr Qrr
-
A
T A = 25 °C
Inverse diode direct current,pulsed
T A = 25 °C
Inverse diode forward voltage V ns µC
VGS = 0 V, I F = 5.2 A
Reverse recovery time
VR = 30 V, IF=I S , di F/dt = 100 A/µs
Reverse recovery charge
VR = 30 V, IF=l S , diF/dt = 100 A/µs
Page 4
2008-03-21
Rev 2.2
Power Dissipation Drain current
BSP318S
Ptot = f (TA)
BSP318S
ID = f (TA )
BSP318S
1.9
2.8
W
1.6 1.4
A
2.4 2.2 2.0
Ptot
ID
°C
1.2 1.0 0.8 0.6
1.8 1.6 1.4 1.2 1.0 0.8
0.4 0.2
0.6 0.4 0.2
0.0 0
20
40
60
80
100
120
160
0.0 0
20
40
60
80
100
120
°C
160
TA
TA
Safe operating area
Transient thermal impedance
I D = f ( VDS )
parameter : D = 0 , T A = 25 °C
10
2
ZthJA = f(tp )
parameter : D = tp /T
10 2
BSP318S
BSP318S
A
/I D =
tp = 140.0 µs
K/W
10 1
( DS on )
V
DS
10 1
ID
R
10 0
1 ms
Z thJA
10 0
10 ms
D = 0.50 0.20 0.10
10 -1
10 -1 single pulse DC
0.05 0.02 0.01
10 -2 -1 10
10
0
10
1
V
10
2
10 -2 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10
s 10 4
VDS
Page 5
tp
2008-03-21
Rev 2.2
Typ. output characteristic
BSP318S
Typ. transfer characteristics ID = f ( VGS )
I D = f (VDS); T j=25°C parameter: tp = 80 µs
BSP318S
VDS≥ 2 x ID x RDS(on)max parameter: tp = 80 µs
15
A
VGS [V] a 2.0
b c 2.5 3.0 3.5
6.5
Ptot = 1.80W
g jf ihe ld k
A
5.5 5.0 4.5
c
12 11 10
d e f g h
ID
ID
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5
a b
4.0 4.5 5.0 5.5 6.0 7.0 8.0 10.0
9 8 7 6 5 4 3 2 1
i j k l
0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V
5.0
0 0
1
2
3
4
5
6
7
8
V
10
VDS
VGS
Drain-source on-resistance
Gate threshold voltage
RDS(on) = f (Tj)
parameter : I D = 2.6 A, V GS = 4.5 V
BSP318S
VGS(th) = f (Tj)
parameter: VGS = VDS , ID = 20 µA
3.0
V
0.36
Ω
0.28
2.4
RDS(on)
0.24 0.20
V GS(th)
98% typ
2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8
max
0.16 0.12 0.08 0.04 0.00 -60
0.6 0.4 0.2 -20 20 60 100
°C
typ
min
180
0.0 -60
-20
20
60
100
140 °C
200
Tj
Page 6
Tj
2008-03-21
Rev 2.2
Typ. capacitances C = f(V DS) parameter: VGS=0 V, f=1 MHz
10 3
BSP318S
Forward characteristics of reverse diode
IF = f (VSD )
parameter: Tj , tp = 80 µs
10 2
BSP318S
A
pF
Ciss
10 1
C
10 2
Coss Crss
10 0
IF
Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%)
10 1 0
V
5
10
15
20
25
30
40
10 -1 0.0
0.4
0.8
1.2
1.6
2.0
2.4 V
3.0
VDS
VSD
Avalanche Energy
E AS = f (T j)
Typ. gate charge
parameter: ID = 2.6 A, VDD = 25 V RGS = 25 Ω
65
VGS = f (QGate ) parameter: ID = 2.6 A pulsed
BSP318S
16
mJ V
55 50 12
VGS
45
EAS
40 35
10
8 30 25 20 15 10 5 0 20 40 60 80 100 120
°C
0,2 VDS max 6
0,8 VDS max
4
2
160
0 0
4
8
12
16
nC
24
Tj
Page 7
QGate
2008-03-21
Rev 2.2
Drain-source breakdown voltage
BSP318S
V(BR)DSS = f (Tj)
BSP318S
72
V
68 66 64 62 60 58 56 54 -60
V(BR)DSS
-20
20
60
100
°C
180
Tj
Page 8
2008-03-21
Rev 2.2
BSP318S
Page 9
2008-03-21