Smart High-Side Power Switch BSP452
• High-side switch • Short-circuit protection • Input protection • Overtemperature protection with hysteresis • Overload protection • Overvoltage protection • Switching inductive load • Clamp of negative output voltage with inductive loads • Undervoltage shutdown • Maximum current internally limited • Electrostatic discharge (ESD) protection 1 • Reverse battery protection ) • AEC qualified Package: SOT (RoHS compliant) • Green product223 Type Ordering code Q67000-S271
SOT-223
1
SOT-223
PG-SOT-223
BSP 452
Application
• µC compatible power switch for 12 V DC grounded loads • All types of resistive, inductive and capacitive loads • Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection functions.
Blockdiagramm:
+ Vbb
4
Voltage source
ESDDiode
Overvoltage protection
Current limit
Gate protection
V Logic
Voltage sensor
Charge pump Level shifter
Limit for unclamped ind. loads
OUT
Rectifier
Temperature sensor
1
3
R IN
in
Load
ESD
Logic
GND
miniPROFET
Load GND
2
Signal GND
1)
With resistor RGND=150 Ω in GND connection, resistor in series with IN connections reverse load current limited by connected load.
Data Sheet
1
V1.0, 2007-05-25
Smart High-Side Power Switch BSP452
Pin 1 2 3 4
Symbol OUT GND IN Vbb O I +
Function Output to the load Logic ground Input, activates the power switch in case of logical high signal Positive power supply voltage
Maximum Ratings at Tj = 25 °C unless otherwise specified Parameter Supply voltage Load current self-limited 2) Maximum input voltage Maximum input current Inductive load switch-off energy dissipation, IL = 0.5A , TA = 150°C single pulse (not tested, specified by design) Load dump protection3) VLoadDump=UA+Vs RL= 24Ω RI=2Ω , td=400ms, IN= low or high, UA=13,5V RL= 80Ω (not tested, specified by design) Electrostatic discharge capability (ESD)5) PIN 3 PIN 1,2,4 Operating temperature range Storage temperature range 6 Max. power dissipation (DC) ) Thermal resistance Symbol Vbb IL VIN IIN EAS Values 40 Unit V A V mA J
IL(SC) -5.0...Vbb ±5 0.5
VLoad dump4)
60 80 ±1 ±2 -40 ...+150 -55 ...+150 1.8 7 70
V
VESD Tj Tstg Ptot RthJS RthJA
kV °C W K/W
TA = 25 °C
chip - soldering point: chip - ambient:6)
2) 3)
At VIN > Vbb, the input current is not allowed to exceed ±5 mA. Supply voltages higher than Vbb(AZ) require an external current limit for the GND pin, e.g. with a 150 Ω resistor in the GND connection A resistor for the protection of the input is integrated. 4) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 5) HBM according to MIL-STD 883D, Methode 3015.7 6) BSP 452 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection
Data Sheet
2
V1.0, 2007-05-25
Smart High-Side Power Switch BSP452
Electrical Characteristics
Parameter and Conditions
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
Symbol min
Values typ
Unit max
Load Switching Capabilities and Characteristics On-state resistance (pin 4 to 1) IL = 0.5 A, Vin = high Tj = 25°C Tj = 150°C 7) Nominal load current (pin 4 to 1) ISO Standard: VON = Vbb - VOUT = 0.5 V TS = 85 °C Turn-on time to 90% VOUT Turn-off time to 10% VOUT RL = 24 Ω Slew rate on 10 to 30% VOUT, RL = 24 Ω Slew rate off 70 to 40% VOUT, RL = 24 Ω
RON IL(ISO)
--0.7
0.16 ---
0.2 0.4 --
Ω A
ton toff
dV /dton -dV/dtoff
-----
60 60 2 2
100 150 4 4
µs
V/µs V/µs
Input Allowable input voltage range, (pin 3 to 2) Input turn-on threshold voltage Tj = -40...+150°C Input turn-off threshold voltage Tj = -40...+150°C Input threshold hysteresis Off state input current (pin 3) VIN(off) = 1.2 V Tj = -40...+150°C On state input current (pin 3) VIN(on) = 3.0 V to Vbb Tj = -40...+150°C Input resistance
VIN VIN(T+) VIN(T-)
-3.0 -1.5 -10 10 1.5
---0.5 --2.8
Vbb 3.5
--60 100 3.5
V V V V µA µA kΩ
∆VIN(T) IIN(off)
IIN(on) RIN
7)
IL(ISO) is limited by current limitation, see IL(SC), next page
Data Sheet
3
V1.0, 2007-05-25
Smart High-Side Power Switch BSP452
Parameter and Conditions
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
Symbol min
Values typ
Unit max
Operating Parameters Operating voltage8) Undervoltage shutdown Undervoltage restart
Tj =-40...+150°C Tj =-40...+150°C Tj =-40...+25°C Tj =+150°C Undervoltage restart of charge pumpe 7 see diagram page 7 Undervoltage hysteresis ∆Vbb(under) = Vbb(u rst) - Vbb(under) Overvoltage shutdown Tj =-40...+150°C Overvoltage restart Tj =-40...+150°C Overvoltage hysteresis Tj =-40...+150°C Standby current (pin 4), Vin = low Tj =-40...+150°C Operating current (pin 2), Vin = 5 V leakage current (pin 1) Vin = low Tj =-40...+25°C Tj =150°C
Protection Functions Current limit (pin 4 to 1) Tj = 25°C Vbb = 20V Tj = -40...+150°C Overvoltage protection Ibb=4mA Tj =-40...+150°C Output clamp (ind. load switch off) at VOUT=Vbb-VON(CL), Ibb = 4mA Thermal overload trip temperature Thermal hysteresis 9 Inductive load switch-off energy dissipation ) Tj Start = 150 °C, single pulse, IL = 0.5 A, Vbb = 12 V (not tested, specified by design) 10 Reverse battery (pin 4 to 2) ) (not tested, specified by design)
Vbb(on) Vbb(under) Vbb(u rst) Vbb(ucp)
∆Vbb(under)
5.0 3.5 ---34 33 -----
---5.6 0.3 --0.7 10 1 2
34 5 6.5 7.0 7 -42 --25 1.6 5 7
V V V V V V V V µA mA µA
Vbb(over) Vbb(o rst) ∆Vbb(over) Ibb(off) IGND IL(off)
IL(SC) Vbb(AZ) VON(CL) Tjt ∆Tjt EAS
0.7 0.7 41 41 150 ---
1.5 --47 -10 --
2 2.4 ----0.5
A V V °C K J
-Vbb
--
--
30
V
8) 9)
At supply voltage increase up to Vbb= 5.6 V typ without charge pump, VOUT ≈Vbb - 2 V While demagnetizing load inductance, dissipated energy in PROFET is EAS= ∫ VON(CL) * iL(t) dt, approx. 2 V EAS= 1/2 * L * IL * (V ON(CL) ) ON(CL) - Vbb 10) Requires 150 Ω resistor in GND connection. Reverse load current (through intrinsic drain-source diode) is normally limited by the connected load.
Data Sheet
4
V1.0, 2007-05-25
Smart High-Side Power Switch BSP452
Max. allowable power dissipation Ptot = f (TA,TSP) Ptot [W]
18 16 14 12 TSP 10
Current limit characteristic IL(SC) = f (Von); (Von see testcircuit) IL(SC) [A]
2 1.8 1.6 1.4 1.2 1 150°C 25°C -40°C
8
0.8
6
0.6
4 TA 2 0 0 25 50 75 100 125 150
0.4 0.2 0 0 2 4 6 8 10 12 14
TA, TSP[°C]
Von [V]
On state resistance (Vbb-pin to OUT-pin) RON = f (Tj); Vbb = 13.5 V; IL = 0.5 A RON [Ω]
0.4 0.35 0.3
Typ. input current IIN = f (VIN); Vbb = 13,5 V IIN [µA]
50 -40°C 45 40 35 + 25°C
0.25 0.2 0.15 0.1
98%
30 25 20 15 10 +150°C
0.05 0 -50 -25 0 25 50 75 100 125 150
5 0 0 2 4 6 8 10 12 14
Tj [°C]
VIN [V]
Data Sheet
Data Book
5
5
V1.0, 2007-05-25
20 08 96
Smart High-Side Power Switch BSP452
Typ. operating current IGND = f (Tj); Vbb = 13,5 V; VIN = high IGND [mA]
0.8 0.7 0.6
Typ. overload current IL(lim) = f (t); Vbb = 13,5 V, no heatsink, Param.: Tjstart IL(lim) [A]
1.4
1.2
1
0.5
0.8
0.4
0.6
+150°C
+25°C
-40°C
0.3 0.2 0.1 0 -50 -25 0 25 50 75 100 125 150
0.4
0.2
0 -50 0 50 100 150 200 250 300 350 400
Tj [°C]
t [ms]
Typ. standby current Ibb(off) = f (Tj); Vbb = 13,5 V; VIN = low Ibb(off) [µA]
8 7 6
Short circuit current IL(SC) = f (Tj); Vbb = 13,5 V IL(SC) [A]
1.4
1.2
1
5
0.8
4
0.6
3 2 1 0 -50 -25 0 25 50 75 100 125 150
0.4
0.2
0 -50
-25
0
25
50
75
100
125
150
Tj [°C]
Tj [°C]
Data Sheet
6
V1.0, 2007-05-25
Smart High-Side Power Switch BSP452
Typ. input turn on voltage threshold VIN(T+) = f (Tj); VIN(T+) [V]
3 13V 2.5
Figure 6: Undervoltage restart of charge pumpe
VON [V]
2
1.5
V bb(over) V
1
bb(o rs t)
V
bb(u rs t)
0.5
V
V bb(under)
bb(u c p)
0 -50 -25 0 25 50 75 100 125 150
Tj [°C]
Vbb [V]
charge pump starts at Vbb(ucp) about 7 V typ.
Typ. on-state resistance (Vbb-Pin to Out-Pin) RON = f (Vbb,IL); IL=0.5A, Tj = 25°C RON [mΩ]
300
Test circuit
250
200
150
100
50
0 0 5 10 15 20 25
Vbb [V]
Data Sheet
7
V1.0, 2007-05-25
Smart High-Side Power Switch BSP452
Package Outlines
A
6.5 ±0.2 3 ±0.1 0.1 max
1.6 ±0.1
B
7 ±0.3
15˚max
4
1 0.7 ±0.1
2
3 2.3 4.6
0.5 min
0.28 ±0.04
0.25
M
A
0.25
M
B
Figure 1
PG-SOT-223 (Plastic Dual Small Outline Package) (RoHS-compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pbfree finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). Please specify the package needed (e.g. green package) when placing an order
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 8
3.5 ±0.2
+0.2 acc. to DIN 6784
Dimensions in mm V1.0, 2007-05-25
Smart High-Side Power Switch BSP452
Revision History
Version 1.0 Date 2007-05-25 Changes Creation of the green datasheet. First page : Adding the green logo and the AEC qualified Adding the bullet AEC qualified and the RoHS compliant features Package page Modification of the package to be green.
Data Sheet
9
V1.0, 2007-05-25
Edition 2007-05-25 Published by Infineon Technologies AG 81726 Munich, Germany © Infineon Technologies AG 5/29/07. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.