BSZ058N03MSG

BSZ058N03MS G OptiMOS™3 M-Series Power-MOSFET Features • Optimized for 5V driver application (Notebook, VGA, POL) • Low FOMSW for High Frequency SMPS • 100% avalanche tested • N-channel • Very low on-resistance R DS(on) @ V GS=4.5 V • Excellent gate charge x R DS(on) product (FOM) • Qualified according to JEDEC1) for target applications • Superior thermal resistance • Pb-free plating; RoHS compliant • Halogen-free according to IEC61249-2-21 Type BSZ058N03MS G Package PG-TSDSON-8 Marking 058N03M Product Summary V DS R DS(on),max V GS=10 V V GS=4.5 V ID 30 5 6.4 40 PG-TSDSON-8 A V mΩ Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID V GS=10 V, T C=25 °C V GS=10 V, T C=100 °C V GS=4.5 V, T C=25 °C V GS=4.5 V, T C=100 °C V GS=4.5 V, T A=25 °C, R thJA=60 K/W 2) Pulsed drain current3) Avalanche current, single pulse 4) Avalanche energy, single pulse Gate source voltage 1) Value 40 40 40 40 Unit A 14 160 20 55 ±20 mJ V I D,pulse I AS E AS V GS T C=25 °C T C=25 °C I D=20 A, R GS=25 Ω J-STD20 and JESD22 Rev. 2.0 page 1 2010-03-18 BSZ058N03MS G Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Power dissipation Symbol Conditions P tot T C=25 °C T A=25 °C, R thJA=60 K/W 2) Operating and storage temperature IEC climatic category; DIN IEC 68-1 T j, T stg Value 45 2.1 -55 ... 150 55/150/56 °C Unit W Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction - case Device on PCB R thJC R thJA 6 cm2 cooling area2) 2.8 60 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=250 µA V DS=30 V, V GS=0 V, T j=25 °C V DS=30 V, V GS=0 V, T j=125 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=16 V, V DS=0 V V GS=4.5 V, I D=20 A V GS=10 V, I D=20 A Gate resistance Transconductance 2) 30 1 - 0.1 2 1 V µA 0.6 10 10 5.1 4.2 1.3 70 100 100 6.4 5.0 2.3 Ω S nA mΩ RG g fs |V DS|>2|I D|R DS(on)max, I D=30 A 35 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. See figure 3 for more detailed information 3) Rev. 2.0 page 2 2010-03-18 BSZ058N03MS G Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 5) Gate to source charge Gate charge at threshold Gate to drain charge Switching charge Gate charge total Gate plateau voltage Gate charge total Q gs Q g(th) Q gd Q sw Qg V plateau Qg V DD=15 V, I D=30 A, V GS=0 to 10 V V DS=0.1 V, V GS=0 to 4.5 V V DD=15 V, V GS=0 V V DD=15 V, I D=30 A, V GS=0 to 4.5 V 6.9 3.7 3.3 6.5 14 3.0 30 9.2 4.9 5.5 9.8 19 40 V nC C iss C oss Crss t d(on) tr t d(off) tf V DD=15 V, V GS=10 V, I D=30 A, R G=1.6 Ω V GS=0 V, V DS=15 V, f =1 MHz 2300 710 47 6.0 3.8 24 3.0 3100 940 ns pF Values typ. max. Unit Gate charge total, sync. FET Output charge Reverse Diode Diode continuous forward current Diode pulse current Diode forward voltage Q g(sync) Q oss - 12 18 17 25 nC IS I S,pulse V SD T C=25 °C V GS=0 V, I F=20 A, T j=25 °C V R=15 V, I F=I S, di F/dt =400 A/µs - 0.84 40 160 1.1 A V Reverse recovery charge 4) 5) Q rr - - 10 nC See figure 13 for more detailed information See figure 16 for gate charge parameter definition Rev. 2.0 page 3 2010-03-18 BSZ058N03MS G 1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C) parameter: V GS 50 45 40 40 35 4.5 V 10 V 30 30 P tot [W] I D [A] 20 10 0 0 40 80 120 160 25 20 15 10 5 0 0 40 80 120 160 T C [°C] T C [°C] 3 Safe operating area I D=f(V DS); T C=25 °C; D =0 parameter: t p 103 limited by on-state resistance 4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T 10 1 µs 102 10 µs 0.5 100 µs DC 1 Z thJC [K/W] 0.2 0.1 0.05 0.02 I D [A] 101 1 ms 10 ms 0.1 0.01 single pulse 100 10-1 10-1 100 101 102 0.01 0 0 0 0 0 0 1 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 2.0 page 4 2010-03-18 BSZ058N03MS G 5 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 160 5V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 °C parameter: V GS 12 3V 140 10 V 4.5 V 4V 10 3.2 V 120 8 3.5 V R DS(on) [mΩ ] 100 I D [A] 80 3.5 V 6 4.5 V 6V 4V 5V 60 3.2 V 4 40 10 V 3V 2 20 2.8 V 0 0 1 2 3 0 0 10 20 30 40 50 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 160 8 Typ. forward transconductance g fs=f(I D); T j=25 °C 160 140 140 120 120 100 100 80 g fs [S] 150 °C 25 °C I D [A] 80 60 60 40 40 20 20 0 0 1 2 3 4 5 0 0 40 80 120 160 V GS [V] I D [A] Rev. 2.0 page 5 2010-03-18 BSZ058N03MS G 9 Drain-source on-state resistance R DS(on)=f(T j); I D=20 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS; I D=250 µA 10 2.5 8 2 R DS(on) [mΩ ] 6 typ 4 V GS(th) [V] 100 140 180 98 % 1.5 1 2 0.5 0 -60 -20 20 60 0 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 104 10000 1000 Ciss 25 °C 150 °C, 98% 103 1000 Coss 100 C [pF] I F [A] 150 °C 102 100 10 Crss 25 °C, 98% 101 10 1 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 0 V DS [V] V SD [V] Rev. 2.0 page 6 2010-03-18 BSZ058N03MS G 13 Avalanche characteristics I AS=f(t AV); R GS=25 Ω parameter: T j(start) 100 14 Typ. gate charge V GS=f(Q gate); I D=30 A pulsed parameter: V DD 12 15 V 10 6V 24 V 8 25 °C I AV [A] 10 125 °C V GS [V] 100 1000 100 °C 6 4 2 1 1 10 0 0 5 10 15 20 25 30 35 t AV [µs] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 34 V GS 32 Qg 30 V BR(DSS) [V] 28 26 V g s(th) 24 22 Q g(th) Q gs -60 -20 20 60 100 140 180 Q sw Q gd Q g ate 20 T j [°C] Rev. 2.0 page 7 2010-03-18 BSZ058N03MS G Package Outline PG-TSDSON-8 Rev. 2.0 page 8 2010-03-18 BSZ058N03MS G Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.0 page 9 2010-03-18