SIPMOS ® Power Transistor
BUZ 31L H
• N channel • Enhancement mode • Avalanche-rated • Logic Level
. Halogen-free according to IEC61249-2-21
Pin 1
Pin 2
Pin 3
G
Type
D
Pb-free
S
VDS
ID
RDS(on)
Package
BUZ 31 L H
200 V
13.5 A
0.2 Ω
PG-TO220-3
Yes
Maximum Ratings Parameter
Symbol
Values
Unit
Continuous drain current
ID
13.5
A
TC = 28 ˚C
Pulsed drain current
IDpuls
54
TC = 25 ˚C
Avalanche current,limited by Tjmax
Avalanche energy,periodic limited by Tjmax
Avalanche energy, single pulse
IAR
EAR
EAS
13.5
9
mJ
ID = 13.5 A, VDD = 50 V, RGS = 25 Ω L = 1.65 mH, Tj = 25 ˚C
Gate source voltage
ESD-Sensitivity HBM as per MIL-STD 883
Power dissipation
200
VGS
± 20
Class 1
V
Ptot
95
W
TC = 25 ˚C
Operating temperature
Storage temperature
Thermal resistance, chip case
Thermal resistance, chip to ambient
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Tj
Tstg
RthJC
RthJA
-55 ... + 150
-55 ... + 150
˚C
≤ 1.32
75
K/W
E
55 / 150 / 56
Rev. 2.4
Page 1
2009-11-10
BUZ 31L H
Electrical Characteristics, at Tj = 25˚C, unless otherwise specified Parameter
Symbol
min.
Static Characteristics
Values
typ. max.
Unit
Drain- source breakdown voltage
V(BR)DSS
200
-
V
VGS = 0 V, ID = 0.25 mA, Tj = 25 ˚C
Gate threshold voltage
VGS(th)
1.2
1.6
2
µA
VGS=VDS, ID = 1 mA
Zero gate voltage drain current
IDSS
0.1
1
VDS = 200 V, VGS = 0 V, Tj = 25 ˚C VDS = 200 V, VGS = 0 V, Tj = 125 ˚C
Gate-source leakage current
-
10
100
nA
IGSS
10
100
VGS = 20 V, VDS = 0 V
Drain-Source on-resistance
RDS(on)
0.16
0.2
Ω
VGS = 5 V, ID = 7 A
Rev. 2.4
Page 2
2009-11-10
BUZ 31L H
Electrical Characteristics, at Tj = 25˚C, unless otherwise specified Parameter
Symbol
min.
Dynamic Characteristics
Values
typ. max.
Unit
Transconductance
gfs
5
12 -
S
VDS≥ 2 * ID * RDS(on)max, ID = 7 A
Input capacitance
Ciss
1200 1600
pF
VGS = 0 V, VDS = 25 V, f = 1 MHz
Output capacitance
Coss
200 300
VGS = 0 V, VDS = 25 V, f = 1 MHz
Reverse transfer capacitance
Crss
100 150
ns
VGS = 0 V, VDS = 25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = 30 V, VGS = 5 V, ID = 3 A RGS = 50 Ω
Rise time
-
25
40
tr
VDD = 30 V, VGS = 5 V, ID = 3 A RGS = 50 Ω
Turn-off delay time
-
80
120
td(off)
VDD = 30 V, VGS = 5 V, ID = 3 A RGS = 50 Ω
Fall time
-
210
270
tf
VDD = 30 V, VGS = 5 V, ID = 3 A RGS = 50 Ω
65 85
Rev. 2.4
Page 3
2009-11-10
BUZ 31L H
Electrical Characteristics, at Tj = 25˚C, unless otherwise specified Parameter
Symbol
min.
Reverse Diode
Values
typ. max.
Unit
Inverse diode continuous forward current
IS
13.5
A
TC = 25 ˚C
Inverse diode direct current,pulsed
ISM
54
V
TC = 25 ˚C
Inverse diode forward voltage
VSD
1.2
1.6
VGS = 0 V, IF = 27 A
Reverse recovery time
trr
180
-
ns
VR = 100 V, IF=lS, diF/dt = 100 A/µs
Reverse recovery charge
Qrr
1.2
-
µC
VR = 100 V, IF=lS, diF/dt = 100 A/µs
Rev. 2.4
Page 4
2009-11-10
BUZ 31L H
Power dissipation Ptot = ƒ(TC)
Drain current ID = ƒ(TC) parameter: VGS ≥ 5 V
14
100
W
A
12
Ptot
80
ID
11
70
10
9
60
8
50
7
40
6
5
30
4
20
3
2
10
0 0
1 0
20
40
60
80
100
120
˚C
160
0
20
40
60
80
100
120
˚C
160
TC
TC
Safe operating area ID = ƒ(VDS) parameter: D = 0.01, TC = 25˚C
10 2
tp = 15.0µs
Transient thermal impedance Zth JC = ƒ(tp) parameter: D = tp / T
10 1
A
ID
R
10 1
DS
V
DS
/I
D
K/W
100 µs
ZthJC
10 0
(o
n)
=
1 ms
1 0 -1
D = 0.50
10 ms
0.20
10 0
1 0 -2
0.10
0.05
DC
0.02
0.01
single pulse
10
-1
10
0
10
1
10
2
10
-3
V
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
s 10
0
VDS
tp
Rev. 2.4
Page 5
2009-11-10
BUZ 31L H
Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs , Tj = 25 ˚C
30
Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: tp = 80 µs, Tj = 25 ˚C
0.65
Ptot = 95W
A
lkj i h g f
e
VGS [V] a 3.0
Ω
0.55
a
b
c
d
26
ID
24
22
db
c
d
e
3.5
4.0
4.5
5.0
5.5
6.0
6.5
RDS (on) 0.50
0.45
20
18
0.40
16
c
f
g
0.35
14
h
0.30
12
i
7.0
8.0
9.0
10.0
10
bj
k
0.25
0.20
e
g
i k
8
l
6
0.15
f h j l
4
a
0.10
VGS [V] =
a 3.0
b 3.5
2 0 0
0.05
c 4.0
d 4.5
e f 5.0 5.5
g 6.0
h i 6.5 7.0
j 8.0
0.00
k l 9.0 10.0
2
4
6
8
V
11
0
4
8
12
16
20
A
26
VDS
ID
Typ. transfer characteristics ID = f (VGS)
Typ. forward transconductance gfs = f (ID)
parameter: tp = 80 µs
VDS≥2 x ID x RDS(on)max
22
A
ID
parameter: tp = 80 µs,
VDS≥2 x ID x RDS(on)max
18
S
gfs
18
14
12
16
14
12
10
8
6
4
10
8
6
4
2
2
0
0
0
1
2
3
4
5
6
7
8
V
VGS
10
0
2
4
6
8
10
12
14
16
ID
A
20
Rev. 2.4
Page 6
2009-11-10
BUZ 31L H
Drain-source on-resistance RDS (on) = ƒ(Tj) parameter: ID = 7 A, VGS = 5 V
0.65
Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS, ID = 1 mA
4.6
Ω
0.55
V
4.0
RDS (on) 0.50
0.45
VGS(th)
3.6
3.2
0.40
2.8
0.35
2.4
0.30
98%
98%
2.0
0.25
typ
typ
1.6
0.20
2%
1.2
0.15
0.10
0.8
0.05
0.4
0.00 -60
-20
20
60
100
˚C
160
0.0 -60
-20
20
60
100
˚C
160
Tj
Tj
Typ. capacitances
C = f (VDS)
parameter:VGS = 0V, f = 1MHz
10 1
Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj, tp = 80 µs
10 2
nF
C
A
IF
10 0
Ciss
10 1
Coss
1 0 -1
Crss
10 0
Tj = 25 ˚C typ
Tj = 150 ˚C typ
Tj = 25 ˚C (98%)
Tj = 150 ˚C (98%)
10 -2 0
5
10
15
20
25
30
V
VDS
40
10 -1 0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Rev. 2.4
Page 7
2009-11-10
BUZ 31L H
Avalanche energy EAS = ƒ(Tj) parameter: ID = 13.5 A, VDD = 50 V RGS = 25 Ω, L = 1.65 mH
220
Typ. gate charge VGS = ƒ(QGate) parameter: ID puls = 21 A
16
mJ
V
EAS
180
VGS
160
12
140
10
120
8
100
0,2 VDS max
0,8 VDS max
80
6
60
4
40
2
20
0 20
40
60
80
100
120
˚C
160
0 0
20
40
60
80
100
120 nC 150
Tj
QGate
Drain-source breakdown voltage V(BR)DSS = ƒ(Tj)
240
V
230 V(BR)DSS 225
220
215
210
205
200
195
190
185
180 -60
-20
20
60
100
˚C
160
Tj
Rev. 2.4
Page 8
2009-11-10
BUZ 31L H
Package Drawing: TO220-3
Rev. 2.4
Page 9
2009-11-10
BUZ 31L H
Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
(www.infineon.com).
Rev 2.4
Page 10
2009-11-10