SIPMOS ® Power Transistor
BUZ 73L H
• N channel • Enhancement mode • Avalanche-rated • Logic Level
. Halogen-free according to IEC61249-2-21
Pin 1
Pin 2
Pin 3
G
Type
D
Pb-free
S
VDS
200 V
ID
7A
RDS(on)
0.4 Ω
Package
BUZ 73 L H
PG-TO220-3
Yes
Maximum Ratings Parameter
Symbol
Values
Unit
Continuous drain current
TC = 28 ˚C
ID
A
7
IDpuls
Pulsed drain current
TC = 25 ˚C
28
IAR
E AR
E AS
Avalanche current,limited by Tjmax
Avalanche energy,periodic limited by Tjmax
Avalanche energy, single pulse
ID = 7 A, VDD = 50 V, RGS = 25 Ω L = 3.67 mH, Tj = 25 ˚C
7
6.5
mJ
120
VGS
Gate source voltage
ESD-Sensitivity HBM as per MIL-STD 883
Power dissipation
TC = 25 ˚C
± 20
Class 1
V
Ptot
W
40
Tj
Tstg
RthJC
RthJA
Operating temperature
Storage temperature
Thermal resistance, chip case
Thermal resistance, chip to ambient
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
-55 ... + 150
-55 ... + 150
˚C
≤ 3.1
75
K/W
E
55 / 150 / 56
Rev. 2.4
Page 1
2009-11-10
BUZ 73L H
Electrical Characteristics, at Tj = 25˚C, unless otherwise specified Parameter
Symbol
min.
Static Characteristics
Values
typ. max.
Unit
Drain- source breakdown voltage
VGS = 0 V, ID = 0.25 mA, Tj = 25 ˚C
V (BR)DSS
V
200
V GS(th)
-
-
Gate threshold voltage
V GS=VDS, ID = 1 mA
1.2
IDSS
1.6
2
µA
Zero gate voltage drain current
VDS = 200 V, V GS = 0 V, Tj = 25 ˚C VDS = 200 V, V GS = 0 V, Tj = 125 ˚C
-
0.1
1
IGSS
10
100
nA
Gate-source leakage current
V GS = 20 V, VDS = 0 V
RDS(on)
10
100
Drain-Source on-resistance
V GS = 5 V, ID = 3.5 A
Ω
0.3
0.4
Rev. 2.4
Page 2
2009-11-10
BUZ 73L H
Electrical Characteristics, at Tj = 25˚C, unless otherwise specified Parameter
Symbol
min.
Dynamic Characteristics
Values
typ. max.
Unit
Transconductance
VDS≥ 2 * ID * RDS(on)max, ID = 3.5 A
gfs
S
5
Ciss
6.5
pF
Input capacitance
V GS = 0 V, V DS = 25 V, f = 1 MHz
Coss
630
840
Output capacitance
V GS = 0 V, V DS = 25 V, f = 1 MHz
Crss
120
200
Reverse transfer capacitance
V GS = 0 V, V DS = 25 V, f = 1 MHz
td(on)
60
90
ns
Turn-on delay time
V DD = 30 V, VGS = 5 V, ID = 3 A RGS = 50 Ω
tr
15
20
Rise time
V DD = 30 V, VGS = 5 V, ID = 3 A RGS = 50 Ω
td(off)
60
90
Turn-off delay time
V DD = 30 V, VGS = 5 V, ID = 3 A RGS = 50 Ω
tf
100
130
Fall time
V DD = 30 V, VGS = 5 V, ID = 3 A RGS = 50 Ω
-
40
50
Rev. 2.4
Page 3
2009-11-10
BUZ 73L H
Electrical Characteristics, at Tj = 25˚C, unless otherwise specified Parameter
Symbol
min.
Reverse Diode
Values
typ. max.
Unit
Inverse diode continuous forward current
TC = 25 ˚C
IS
A
ISM
-
7
Inverse diode direct current,pulsed
TC = 25 ˚C
V SD
-
28
V
Inverse diode forward voltage
VGS = 0 V, IF = 14 A
trr
1.1
1.7
ns
Reverse recovery time
V R = 100 V, IF=lS, diF/dt = 100 A/µs
Qrr
140
µC
Reverse recovery charge
V R = 100 V, IF=lS, diF/dt = 100 A/µs
-
0.7
-
Rev. 2.4
Page 4
2009-11-10
BUZ 73L H
Power dissipation Ptot = ƒ(TC)
Drain current ID = ƒ(TC) parameter: VGS ≥ 5 V
7.5
45
W
A
6.5
Ptot
35
ID
6.0
5.5
30
5.0
4.5
25
4.0
20
3.5
3.0
15
2.5
2.0
10
1.5
5
1.0
0.5 0.0
0 0
20
40
60
80
100
120
˚C
160
0
20
40
60
80
100
120
˚C
160
TC
TC
Safe operating area ID = ƒ(VDS) parameter: D = 0.01, TC = 25˚C
10 2
Transient thermal impedance Zth JC = ƒ(tp) parameter: D = tp / T
10 1
K/W
A
/I
D
t = 15.0µs p
ID
10 1
=V
ZthJC
100 µs
10 0
R
DS (o n)
DS
1 ms
10 -1
D = 0.50
0.20
10 0
10 ms
0.10
10 -2
0.05
0.02
single pulse
0.01
DC
10 -1 0 10
10
1
10
2
V
10 -3 -7 10
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
s 10
0
VDS
tp
Rev. 2.4
Page 5
2009-11-10
BUZ 73L H
Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs
16
Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: VGS
1.3
Ptot = 40W
li h kj g f e
VGS [V] a 2.0
Ω
1.1
a
b
c
A
ID
12
d
b
c
2.5
3.0
3.5
4.0
RDS (on)
1.0
0.9
10
d
e
0.8
f
4.5
5.0
5.5
6.0
7.0
8.0
10.0
0.7
8
c
g
h
0.6
6
i
j
k
0.5
0.4
4
b
l
0.3
d e hjf k ig
2
0.2
VGS [V] =
a 2.0 2.5
b 3.0
0.1
c 3.5
d 4.0
e f 4.5 5.0
g 5.5
h i 6.0 7.0
j 8.0
0 0
a
k 10.0
0.0
2
4
6
8
V
12
0
2
4
6
8
10
A
13
VDS
ID
Typ. transfer characteristics ID = f (V GS)
Typ. forward transconductance gfs = f (ID)
parameter: tp = 80 µs
VDS≥2 x ID x RDS(on)max
18
A
ID
parameter: tp = 80 µs,
V DS≥2 x ID x RDS(on)max
12
S
10
14
12
gfs
9
8
10
7
6
8
5
6
4
4
3
2
2
1
0
0
0
1
2
3
4
5
6
7
8
V
VGS
10
0
2
4
6
8
10
12
ID
A
15
Rev. 2.4
Page 6
2009-11-10
BUZ 73L H
Drain-source on-resistance RDS (on) = ƒ(Tj ) parameter: ID = 3.5 A, VGS = 5 V
1.3
Gate threshold voltage VGS (th) = ƒ(Tj ) parameter: VGS = VDS, ID = 1 mA
4.6
Ω
1.1
V
4.0
RDS (on)
1.0
VGS(th)
3.6
3.2
0.9
0.8
2.8
0.7
2.4
0.6
98%
98%
2.0
0.5
typ
0.4
typ
1.6
2%
1.2
0.3
0.2
0.8
0.1
0.4
0.0 -60
-20
20
60
100
˚C
160
0.0 -60
-20
20
60
100
˚C
160
Tj
Tj
Typ. capacitances
C = f (VDS)
parameter:VGS = 0V, f = 1MHz
10 4
Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj , tp = 80 µs
10 2
pF
C
A
IF
10 3
Ciss
10 1
10 2
Coss
Crss
10 0
Tj = 25 ˚C typ
Tj = 150 ˚C typ
Tj = 25 ˚C (98%)
Tj = 150 ˚C (98%)
10 1 0
10 -1 0.0
5
10
15
20
25
30
V
VDS
40
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Rev. 2.4
Page 7
2009-11-10
BUZ 73L H
Avalanche energy EAS = ƒ(Tj) parameter: ID = 7 A, VDD = 50 V RGS = 25 Ω, L = 3.67 mH
130
Typ. gate charge VGS = ƒ(QGate) parameter: ID puls = 63 A
16
mJ
110
V
EAS
100
VGS
12
0,2 VDS max
90
80
10
0,8 VDS max
70
8
60
50
6
40
30
4
20
2
10
0 20
0
40
60
80
100
120
˚C
160
0
10
20
30
40
50
60
70
80
nC 100
Tj
Q Gate
Drain-source breakdown voltage V(BR)DSS = ƒ(Tj)
240
V
230 V(BR)DSS 225
220
215
210
205
200
195
190
185
180 -60
-20
20
60
100
˚C
160
Tj
Rev. 2.2
Page 8
2007-01-16
Rev. 2.4
Page 8
2009-11-10
BUZ 73L H
Package Drawing: TO220-3
Rev. 2.4
Page 9
2009-11-10
BUZ 73L H
Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
(www.infineon.com).
Rev. 2.4
Page 10
2009-11-10