ESD0P4RFL

ESD0P4RFL RF ESD Protection Diodes • ESD protection of RF antenna / interfaces or ultra high speed data lines acc. to: IEC61000-4-2 (ESD): ± 15 KV (air / contact) IEC61000-4-4 (EPT): 40 A (5/50 ns) IEC61000-4-5 (surge): 5 A (8/20 µs) • Very low line capacitance: 0.4 pF @ 1 GHz ( 0.2 pF per diode) • Ultra low series inductance: 0.4 nH per diode • Very low clamping voltage • Ultra small leadless package:1.2 x 0.8 x 0.39 mm³ • Pb-free (RoHS compliant) package • Qualified according AEC Q101 Applications in anti-parallel configuration • For low RF signal levels without superimposed DC voltage: e.g. GPS, XM-Radio, Sirius, DVB, DMB, DAB, Remote Keyless Entry Applications in rail-to-rail configuration • For high RF signal levels or low RF signal levels with superimposed DC voltage: e.g. HDMI, S-ATA, Gbit Ethernet ESD0P4RFL 4 3 D1 D2 1 2 Type ESD0P4RFL Package TSLP-4-7 Configuration anti-parallel Marking E4 1 2009-02-18 ESD0P4RFL Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol VESD I pp T op T stg Value Unit ESD contact discharge1) Peak pulse current (tp = 8 / 20 µs)2) Operating temperature range Storage temperature 15 5 -55...150 -65...150 kV A °C Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Characteristics Symbol min. Values typ. max. Unit Reverse working voltage3) Reverse current3) VR = 50 V VRWM IR VFC CT LS - 20 6 0.4 0.4 50 100 9 - V nA V pF nH Forward clamping voltage2) IPP = 5 A Diode capacitance4) VR = 0 V, f = 1 GHz Series inductance per diode 1V 2I ESD according to IEC61000-4-2, only valid in anti-parallel or rail-to-rail connection. Please refer to the application examples. pp according to IEC61000-4-5, only valid in anti-parallel or rail-to-rail connection. 3Only Please refer to the application examples. valid in rail-to-rail configuration with VCC ≤ VRWM capacitance line to ground (2 diodes in parallel) 4Total 2 2009-02-18 ESD0P4RFL Forward clamping voltage VFC = ƒ(IPP) tp = 8 / 20 µs 9 V Reverse current IR = ƒ(VR) TA = Parameter leakage in rail-to-rail configuration 10 -4 A 10 -5 125°C 7 10 -6 V FC 6 85°C IR 5 4 3 2 10 -7 10 -8 25°C 10 -9 10 -10 1 0 0 10 -11 0 -40°C 1 2 3 4 A 6 10 20 30 40 50 V 70 Ipp VR Forward current IF = ƒ (VF) leakage in anti-parallel configuration Line capacitance CT = ƒ (f) VR = 0 V 0.5 10 -3 A 10 -4 pF 10 -5 10 -6 125°C 85°C 25°C - 40°C CT -2 -1 IF 0.3 0.2 10 -7 10 -8 0.1 10 -9 -3 10 10 10 V 10 0 0 0 500 1000 1500 2000 MHz 3000 VF f 3 2009-02-18 ESD0P4RFL Insertion loss IL = -|S21|2 = ƒ(f) VR = 0 V, Z = 50 Ω 0 dB -0.2 |S 21|² -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1 0 MHz 500 1000 1500 2000 3000 f 4 2009-02-18 ESD0P4RFL 1. Application example ESD0P4RFL 1 RF signal channel, anti-parallel configuration 1 protected signal line, superimposed DC voltage up to ±VF (diode forward volatge) I/O ESD sensitive circuit Line to ground capacitance 0.4 pF @1 GHz The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Grounded pins should be connected in parallel directly to a ground plane on the board . 2. Application example ESD0P4RFL 1 RF signal channel, rail-to-rail configuration 1 protected signal line, superimposed DC voltage up to +Vcc (voltage supply) I/O ESD sensitive circuit Line to ground capacitance 0.4 pF @1 GHz +Vcc Cathode of one diode should be connected to the positive supply voltage +Vcc and anode of the opposite diode should be connected directly to a ground plane on the board. Clamped input voltage at I/O port is limited to Vcc + VF at positive transients and 0V - VF at negative transients (VF ... diode forward voltage drop). 5 2009-02-18 Package TSLP-4-7 ESD0P4RFL Package Outline Top view 0.39 +0.01 -0.03 0.05 MAX. 4 x 0.25 ±0.035 1) 2 3 Bottom view 4 x 0.35 ±0.035 4 1) 0.8 ±0.05 4 1 2 1 Pin 1 marking 1) Dimension applies to plated terminal 0.45 ±0.05 Foot Print For board assembly information please refer to Infineon website "Packages" 0.8 0.4 0.78 0.38 1.18 0.28 0.3 0.3 0.2 Copper Solder mask 0.22 Stencil apertures 0.28 Marking Layout (Example) BAR90-07LRH Type code Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel 4 1.45 8 0.5 Pin 1 marking 1.05 0.38 0.4 0.42 1.2 0.4 1.2 ±0.05 3 0.75 ±0.05 6 2009-02-18 ESD0P4RFL Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2009-02-18