ESD5V3U1U-02LRH

ESD5V3U1U... Ultra-Low Capacitance TVS Diode • ESD / transient protection of high-speed data lines exceeding IEC61000-4-2 (ESD): ±20 kV (air / contact) IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns) IEC61000-4-5 (surge): 3 A (8/20 µs) • Extremely small form factor down to 0.62 x 0.32 x 0.31 mm³ • Reverse working voltage: 5.3 V max. • Very low reverse current: < 10 nA typ. • Extremely low capacitance: 0.4 pF typ. • Very low clamping voltage: 12 V typ. at positive transients, 4 V typ. at negative transients • Very low series inductance down to 0.2 nH typ. • Pb-free (RoHS compliant) package Applications • USB 2.0, 10/100/1000 Ethernet, Firewire, DVI, HDMI, S-ATA • Mobile communication • Consumer products (STB, MP3, DVD, DSC...) • LCD displays, camera • Notebooks and desktop computers, peripherals ESD5V3U1U-02LS ESD5V3U1U-02LRH 2 1 Type ESD5V3U1U-02LRH ESD5V3U1U-02LS Package TSLP-2-7 TSSLP-2-1 Configuration 1 line, uni-directional 1 line, uni-directional Marking E5 L 1 2010-03-12 ESD5V3U1U... Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol VESD I pp T op T stg Value Unit ESD (air / contact) discharge 1) Peak pulse current (tp = 8 / 20 µs)2) Operating temperature range Storage temperature 20 3 -55...125 -65...150 kV A °C Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Characteristics Symbol min. Values typ. max. Unit Reverse working voltage Breakdown voltage I(BR) = 1 mA, from pin 1 to 2 VRWM V(BR) IR VCL 6 - < 10 5.3 100 V Reverse current VR = 5.3 V, from pin 1 to 2 nA V Clamping voltage IPP = 1 A, tp = 8/20 µs2) , from pin 1 to 2 IPP = 3 A, tp = 8/20 µs2) , from pin 1 to 2 VFC 10 12 2 4 0.4 13 15 4 6 0.6 pF nH Forward clamping voltage IPP = 1 A, tp = 8/20 µs2) , from pin 2 to 1 IPP = 3 A, tp = 8/20 µs2) , from pin 2 to 1 CT LS Line capacitance3) VR = 0 V, f = 1 MHz - Series inductance ESD5V3U1U-02LS ESD5V3U1U-02LRH 1V 2I - 0.2 0.4 - ESD according to IEC61000-4-2 pp according to IEC61000-4-5 3Total capacitance line to ground 2 2010-03-12 ESD5V3U1U... Clamping voltage, V cl = ƒ(Ipp) tp = 8 / 20 µs, from pin 1 to 2 13 V Forward clamping voltage V FC = ƒ(IPP) tp = 8 / 20 µs, from pin 2 to 1 6 V 11 10 3 9 2 8 1 7 6 0 V FC A V cl 4 1 2 4 0 0 1 2 3 A 5 Ipp Ipp Reverse current IR = ƒ (TA) VR = 5.3 V, from pin 1 to 2 10 -6 A Line capacitance CT = ƒ (VR) f = 1 MHz, from pin 1 to 2 0.6 pF 10 -7 10 -8 CT °C 0.4 IR 0.3 10 -9 0.2 10 -10 0.1 10 -11 25 50 75 100 150 0 0 1 2 3 V 5 TA VR 3 2010-03-12 ESD5V3U1U... Line capacitance CT = ƒ (f) VR = parameter, from pin 1 to 2 0.6 Line capacitance CT = ƒ(TA) VR = 0 V, f = 1 MHz 0.7 pF pF CT CT 0.4 VR=5.3V VR=0V 0.5 5.3 V 0.4 0V 0.3 0.3 0.2 0.2 0.1 0.1 0 0 500 1000 1500 2000 MHz 3000 0 -50 -25 0 25 50 °C 100 f TA 4 2010-03-12 ESD5V3U1U... Application example ESD5V3U1U... 1-channel, uni-directional Protected line, signal level up to +VRWM (uni-directional) I/O Connector 1 ESD sensitive device The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pin 2 should be connected directly to a ground plane on the board. 2 5 2010-03-12 TSLP-2-7 (mm) ESD5V3U1U... Package Outline Top view 0.39 +0.01 -0.03 0.05 MAX. 0.65 ±0.05 Bottom view 0.6 ±0.05 2 2 1 1 Cathode marking 0.5 ±0.035 1) 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.35 0.45 0.3 0.925 1 0.275 0.275 0.375 0.6 Copper Solder mask 0.35 Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 4 1.16 0.5 Cathode marking 0.76 8 0.25 ±0.035 1) 1±0.05 6 2010-03-12 TSSLP-2-1 (mm) ESD5V3U1U... 7 2010-03-12 ESD5V3U1U... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( ). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 2010-03-12