IPW50R299CP

IPW50R299CP CoolMOSTM Power Transistor Features • Lowest figure of merit RON x Qg • Ultra low gate charge • Extreme dv/dt rated • High peak current capability • Pb-free lead plating; RoHS compliant • Quailfied according to JEDEC1) for target applications Product Summary V DS @Tjmax R DS(on),max Q g,typ 550 0.299 23 V Ω nC TO-247-3-1 CoolMOS CP is designed for: • Hard- & soft switching SMPS topologies • CCM PFC for Notebook adapter, PDP and LCD TV • PWM for Notebook adapter, PDP and LCD TV Type IPW50R299CP Package PG-TO247 Marking 5R299P Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 °C T C=100 °C Pulsed drain current2) Avalanche energy, single pulse Avalanche energy, repetitive t AR2),3) Avalanche current, repetitive t AR2),3) MOSFET dv /dt ruggedness Gate source voltage I D,pulse E AS E AR I AR dv /dt V GS V DS=0...400 V static AC (f>1 Hz) Power dissipation Operating and storage temperature Mounting torque Rev. 2.0 P tot T j, T stg M3 and M3.5 screws page 1 T C=25 °C T C=25 °C I D=4.4 A, V DD=50 V I D=4.4 A, V DD=50 V Value 12 8 26 289 0.44 4.4 50 ±20 ±30 104 -55 ... 150 60 W °C Ncm 2007-11-07 A V/ns V mJ Unit A Please note the new package dimensions arccording to PCN 2009-134-A IPW50R299CP Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous diode forward current Diode pulse current 2) Reverse diode d v /dt 4) Symbol Conditions IS I S,pulse dv /dt T C=25 °C Value 6.6 26 15 V/ns Unit A Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction ambient Soldering temperature, wavesoldering only allowed at leads R thJC R thJA leaded 1.6 mm (0.063 in.) from case for 10 s 1.2 62 K/W T sold - - 260 °C Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage V (BR)DSS V GS=0 V, I D=250 µA V GS(th) V DS=V GS, I D=0.44 mA V DS=500 V, V GS=0 V, T j=25 °C V DS=500 V, V GS=0 V, T j=150 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=6.6 A, T j=25 °C V GS=10 V, I D=6.6 A, T j=150 °C Gate resistance RG f =1 MHz, open drain 500 2.5 3 3.5 V Zero gate voltage drain current I DSS - - 1 µA - 10 0.27 100 0.299 nA Ω - 0.68 2.2 Ω Rev. 2.0 page 2 2007-11-07 Please note the new package dimensions arccording to PCN 2009-134-A IPW50R299CP Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Effective output capacitance, energy related5) Effective output capacitance, time related6) Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current 1) Values typ. max. Unit C iss C oss C o(er) V GS=0 V, V DS=100 V, f =1 MHz - 1190 53 50 - pF V GS=0 V, V DS=0 V to 400 V C o(tr) t d(on) tr t d(off) tf V DD=400 V, V GS=10 V, I D=6.6 A, R G=27.9 Ω 110 35 14 80 12 ns Q gs Q gd Qg V plateau V DD=400 V, I D=6.6 A, V GS=0 to 10 V - 5 7 23 5.2 31 - nC V V SD t rr Q rr I rrm V GS=0 V, I F=6.6 A, T j=25 °C - 0.9 260 2.6 21 1.2 - V ns µC A V R=400 V, I F=I S, di F/dt =100 A/µs - J-STD20 and JESD22 Pulse width t p limited by T j,max Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f. I SD≤I D, di /dt ≤200A/µs, V DClink=400V, V peak