SIDC112D170H

SIDC112D170H Fast switching diode This chip is used for: • power modules A Features: • 1700V technology, Emitter Controlled Diode 3th generation, 200 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient C Applications: • resonant applications, drives Chip Type SIDC112D170H VR IF Die Size 11.8 x 9.52 mm2 Package sawn on foil 1700V 205A Mechanical Parameters Raster size Area total Anode pad size Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal Backside metal Die bond Wire bond Reject ink dot size Recommended storage environment 11.8 x 9.52 112.3 9.78 x 7.5 200 150 114 Photoimide 3200 nm AlSiCu Ni Ag –system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, ≤500µm ∅ 0.65mm; max 1.2mm Store in original container, in dry nitrogen, in dark environment, < 6 month at an ambient temperature of 23°C µm mm mm2 Edited by INFINEON Technologies, IMM PSD, L4502A, Edition 0.9, 22.02.2010 SIDC112D170H Maximum Ratings Parameter Repetitive peak reverse voltage Continuous forward current Maximum repetitive forward current Junction temperature range Operating junction temperature Dynamic ruggedness²) 1) 2) Symbol VRRM IF IFRM Tvj Tvj Pmax Condition Tvj = 25 °C Tvj < 150°C Tvj < 150°C Value 1700 1) Unit V A °C °C kW 410 -40...+175 -40...+150 I F m a x = 410A, V R m a x = 1700V, Tvj ≤ 150°C tbd depending on thermal properties of assembly not subject to production test - verified by design/characterisation Static Characteristic (tested on wafer), Tvj = 25 °C Parameter Reverse leakage current Cathode-Anode breakdown Voltage Symbol IR VBR Conditions V R = 17 00 V I R =0 .25m A I F =2 05 A 1700 1.9 2.3 Value min. typ. max. 20 Unit µA V V Diode forward voltage V F 3) 3) V F tested at lower current Further Electrical Characteristics Switching characteristics and thermal properties are depending strongly on module design and mounting technology and can therefore not be specified for a bare die. Edited by INFINEON Technologies, IMM PSD, L4502A, Edition 0.9, 22.02.2010 SIDC112D170H Chip Drawing A A: Anode pad Edited by INFINEON Technologies, IMM PSD, L4502A, Edition 0.9, 22.02.2010 SIDC112D170H FURTHER ELECTRICAL CHARACTERISTICS This chip data sheet refers to the module data sheet DESCRIPTION AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 REVISION HISTORY Version Subjects (major changes since last revision) Date Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies, IMM PSD, L4502A, Edition 0.9, 22.02.2010