SIGC144T170R2C_09

SIGC144T170R2C IGBT Chip in NPT-technology Features: • 1700V NPT technology • 280 µm chip • short circuit prove • positive temperature coefficient • easy paralleling This chip is used for: • chip only Applications: • drives C G E Chip Type SIGC144T170R2C VCE 1700V IC 75A Die Size 11.98 x 11.98 mm2 Package sawn on foil Mechanical Parameter Raster size Emitter pad size Gate pad size Area total Thickness Wafer size Max.possible chips per wafer Passivation frontside Pad metal Backside metal Die bond Wire bond Reject ink dot size Recommended storage environment 11.98 x 11.98 8x ( 2.98x1.98 ) 1.48 x 0.757 143.52 280 150 93 pcs Photoimide 3200 nm AlSiCu Ni Ag –system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al,