SLE66CLX640P

Security & Chip Card ICs SLE 66CLX640P 16-Bit High Security Dual Interface Controller ISO/IEC 7816 and 14443 Type A & B Compliant Interfaces For Contact and Contactless Operation with Memory Management and Protection Unit in 0.22 µm CMOS Technology 136-Kbyte ROM, 5-Kbyte RAM, 64-Kbyte EEPROM 1100-Bit Advanced Crypto Engine supporting RSA and Elliptic Curve GF(p) 112-Bit / 192-Bit DDES-EC2 Accelerator supporting DES, 3DES and Elliptic Curve GF(2n) Short Product Information April 2004 SLE 66CLX640P Short Product Information Ref.: SPI_SLE66CLX640P_0404.doc This document contains preliminary information on a new product under development. Details are subject to change without notice. Revision History: Current Version 2004-04-27 Previous Releases: Page Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 - (0)89 234-81000 E-Mail: security.chipcard.ics@infineon.com Published by Infineon Technologies AG, SMS Security Applications Group St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 2004 All Rights Reserved. To our valued customers We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional amount of time to ensure that this document is correct. However, we realise that we may have missed a few things. If you find any information that is missing or appears in error, please use the contact section above to inform us. We appreciate your assistance in making this a better document. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. µµ SLE 66CLX640P 16-Bit High Security Dual Interface Controller ISO/IEC 7816 and 14443 Type A &B Compliant Interfaces For Contact and Contactless Operation with MMU in 0.22 µm CMOS Technology 136-Kbyte ROM, 5-Kbyte RAM, 64-Kbyte EEPROM 1100-Bit Advanced Crypto Engine supporting RSA and Elliptic Curve GF (p) and 112-Bit / 192-Bit DDES-EC2 Accelerator supporting DES, 3DES and Elliptic Curve GF (2n) Features • • • • • • • • • • • • • Enhanced low power 8051 CPU with extended addressing modes for dual interface smart card applications Instruction set opcode compatible with standard 8051 processor with additional powerful instructions optimized for smart card application Enhanced architecture with execution time 6 times faster (18 times using PLLmax) than standard 8051 processor at same external clock 134 Kbytes User ROM for operating system and application (programs & data) 2 Kbytes reserved ROM for Resource Management System (RMS_E) with Contactless Optimized EEPROM write/erase routines 64 Kbytes Secure EEPROM in SuperSlim technology for application program and data 4k bytes XRAM, 700 bytes Crypto-RAM and 256 bytes internal RAM for fast data processing Memory Management Unit Certified True Random Number Generator Dual Key Triple DES (DDES) & GF (2n) Elliptic Curve (EC2) Accelerator Advanced Crypto Engine for Elliptic Curve GF(p) and up to 2048 bits RSA computation CRC Module according to ISO/IEC 3309 supporting CCIT v.41 & HDLC X25 8 Interrupt Vectors Module with 3 priority levels to ensure real time operation • • • • PLL: to speed up the internal CPU clock frequency up to 15MHz (optional use) Two 16-bit Timers with interrupt capability for protocols, security checks & watch dog implementations Power saving sleep mode Temperature range: contact-based: -25°C to +85°C contact-less: -25°C to +70°C Short Product Information 3 / 12 2004-04-27 µµ SLE 66CLX640P Full operation either via Contact-based and/or Contactless interfaces controlled by Operating System enhances Security Level Contact-based Interface EEPROM (SuperSlim Technology) • • • • • • • • • • • • • • • • • • • • • • • Contact configuration and serial interface according to ISO/IEC 7816 UART handling serial interface compliant with ISO/IEC 7816 supporting transmission protocols T=0 and T=1 Supply voltage range: 5V ± 10% (Class A) 3V ± 10% (Class B) Current consumption < 10 mA @ 5.5 V External CPU clock frequency: 1 to 7.5 MHz Internal CPU clock frequency: up to 15 MHz ESD protection larger than 6 kV Byte wise EEPROM programming and read accesses Versatile & Flexible page mode for 1 to 256 bytes write/erase operation 32 bytes security area including: - 16 bytes chip unique identification number - 16 bytes PROM area (OTP like) Fast personalisation mode 1.5 ms Typical Page Erase time < 2.5ms Typical Page Writing time < 1.8 ms Minimum of 100.000 Write/erase cycles1) Data retention for a minimum of 10 years1) EEPROM programming voltage generated on chip Memory Management and Protection Unit • • • • Contactless Interface Interface according to ISO/IEC 14443 for both Type A and Type B Carrier frequency 13.56 MHz Data rate 106 Kbit/s in type A operation up to 848 Kbit/s in type B operation Anticollision & Transmission Protocol supported by open source application notes for both Type A & B Flexible Internal CPU clock frequency: fully configurable from 1.7MHz up to 15 MHz 256 bytes buffer for contactless data exchange (FiFo circular architecture) Parallel operation of CPU, Peripherals like DES, CRC and Contactless Interface possible for High Demanding Contactless Applications • Code execution from XRAM possible Addressable memory up to 1 Mbytes Separates OS (system mode) and Application (application mode) System routines called by traps Access Restrictions to peripherals in application mode controlled by OS 1) Values are temperature dependant Short Product Information 4 / 12 2004-04-27 µµ SLE 66CLX640P Anti Snooping Security Features Operation state monitoring mechanism The chip goes in a secure reset state on any following sensors alarm: • Low and high voltage sensors • Internal voltage sensor • Frequency sensors and filters • Light sensor • Glitch sensor • Temperature sensor • Life Test Sensor • Internal power-on reset sensor • Active Shield with automatic and user controlled attack detection • HW-countermeasures against SPA/DPA-, Timing- and DFA-attacks (differential fault analysis) Supported Standards • • • • • • • • ISO/IEC 7816 EMV 2000 GSM 11.1x ETSI TS 102 221 ISO/IEC 14443 ISO/IEC 3309 CCIT v.41 HDLC X25 Secure chip and firmware design • • • • • • • • • • • • Security scrambled & optimized chip layout against physical chip manipulation Memory encryption/decryption module (MED) for XRAM, ROM and EEPROM against reverse engineering and power attacks ROM code not visible due to implantation Mask dependant ROM code encrypted during production Chip Unique encryption of the XRAM and EEPROM Flexible encryption of part or whole EEPROM by additional user-defined key 16 byte Unique chip identification number for anti-clone countermeasure & tracking 16 bytes security PROM hardware protected (OTP like) Secure start of the operating system ensured by certified Self Test Software (STS) Certified EEPROM programming routines (RMS_E) True Random Number Generator with Firmware test function High Speed SPA/DPA resistant Triple DES (DDES) Accelerator and Advanced Crypto Engine 5 / 12 2004-04-27 Short Product Information µµ SLE 66CLX640P Application Support • • • • • • • • • HW-& SW-Tools (Emulator, ROM Monitor, Card Emulator, Simulator, Evaluation Kit Proximity (Contactless Reader package), SmartMask™ package, Simulated Reader Software, etc.) Open Source Application Notes Tutorial (e.g.: T=0, T=1, DES and 3DES, Crypto Library, Anticollision and Contactless Transmission Protocols for both Type A and B, Card Coil Design Guide, Card Coil Antenna Reference Design List, etc.) Certified CC EAL5+ Crypto Library Worldwide Application Engineer Team and customer dedicated Field Application Engineers Regular Customer trainings on Cryptography, Contactless and Dual interface controllers including ISO/IEC 14443 related topics On-site trainings available on request • • • • • • • • • • Chip Qualification report Chip delivery specification for wafer with chip-layout (die size, orientation, ...) Module specification containing description of package, etc. Module Qualification report Development Tools Overview Software Development Kit SDK CC Card Emulator CE66P Dual Interface ROM Monitor RM66P-II with stand alone functionality for ROM mask qualification in the end user system Emulator ET66P Hitex or ET66P KSC Smart Mask™ Package for chip evaluation Smart Mask™ Dual Interface modules M8.4 (supplied by Infineon) supporting both ISO/IEC 14443 Type A & B and ISO/IEC 7816 for implantation process testing and production setup Evaluation Kit Proximity (Contactless reader package) Document References Confidential Data Book SLE 66CxxP Confidential Instruction Set SLE 66CxxP Confidential Quick Reference SLE 66CxxP • Short Product Information 6 / 12 2004-04-27 µµ SLE 66CLX640P Timing performances are independent of the contact or contactless interface. Table 1 Operation Performance Advanced Crypto Engine Modulus Exponent Calculation Time at 5 MHz Calculation Time at 15 MHz Modular Exponentiation Modular Exponentiation Modular Exponentiation Modular Exponentiation RSA Encrypt / RSA Signature Verify Modular Exponentiation RSA Decrypt / RSA Signature Generate Modular Exponentiation using CRT RSA Decrypt / RSA Signature Generate DSA Signature Generate DSA Signature Verify DSA Signature Generate DSA Signature Verify Elliptic Curves EC-GDSA Sign. Verify. 160 bit 256 bit 512 bit 1024 bit 1024 bit 160 bit 256 bit 512 bit 16 bit 1024 bit 20 ms 35 ms 110 ms 20 ms 820 ms 7 ms 12 ms 37 ms 7 ms 273 ms 83 ms 48 ms 43 ms 97 ms 120 ms 87 ms 183 ms eq.1024 bit eq.1024 bit 250 ms 512 bit 512 bit 1024 bit 1024 bit 160 bit 160 bit 160 bit 160 bit 160 bit 160 bit 160 bit 145 ms 130 ms 290 ms 360 ms 260 ms 550 ms Elliptic Curves EC-GDSA Sign. Generate 160 bit Short Product Information 7 / 12 2004-04-27 µµ SLE 66CLX640P Features (cont’d) Table 2 Operation Performance DDES-EC2 Accelerator Data Block Length Encryption Time for an 8-byte Block including Data Transfer 5 MHz High Speed and Secure 56-bit Single DES Encryption (incl. key loading) High Speed and Secure 56-bit Single DES Encryption 64 bit 64 bit 37 µs 23 µs 60 µs 35 µs Calculation Time 5 MHz 285 ms 540 ms 15 MHz 95 ms 180 ms 15 MHz 12 µs 8 µs 20 µs 12 µs High Speed and Secure 64 bit 112-bit Triple DES Encryption (incl. key loading) High Speed and Secure 112-bit Triple DES Encryption 64 bit Operand Length Elliptic Curves GF(2n) EC-DSA Signature Generate 192 bit Elliptic Curves GF(2n) EC-DSA Signature Verify 192 bit Table 3 Type Ordering Information1 Package M8.42 Chip Voltage Range Temperature Range 2.7 V - 5.5 V – 25°C to + 85°C Frequency Range (external clock) 1 MHz – 7.5 MHz SLE 66CLX640P – M8.4 SLE 66CLX640P – C 1 2 Ordering Codes are available on request Dual Interface Module (M8.4) Short Product Information 8 / 12 2004-04-27 µµ SLE 66CLX640P Pin Description C1 C2 C3 C4 C5 C6 C7 C8 Figure 1 M8.4 Pin Configuration Wire-bonded Module (top view) LA LB C LK R ST I /O S LE 66CLX640P VDD G ND Figure 2 Pad Configuration (die) Table 4 Pin Definitions and Functions Card Contact C1 C2 C3 C5 C7 Symbol VDD RST CLK GND I/O LA LB Function Supply voltage Reset input Processor clock input Ground Bi-directional data port Coil connection pin LA Coil connection pin LB Short Product Information 9 / 12 2004-04-27 µµ SLE 66CLX640P General Description The dual interface security controller SLE 66CLX640P is a member of the Infineon Technologies SLE 66CxxxP high-end security controller family in 0.22 µm CMOS technology which is designed for security systems that requires continuous ongoing improvements with the highest degree of protection against fraudulent attacks. SLE 66CLX640P is targeting dual interface smart card applications such like national ID cards, banking, security access, digital signature and transport.. SLE 66CLX640P offers 134 Kbytes of User-ROM, 256 bytes internal RAM, 4 Kbytes XRAM, 700 bytes Crypto RAM and 64 Kbytes EEPROM, which can be used as data and as program memory. The non-volatile memory consists of high reliability cells to guarantee data integrity. This is especially important when the EEPROM is used as program memory. It features ISO/IEC 14443 Type A and B contactless interfaces as well as an ISO/IEC 7816 contact-based interface on a single chip that can be operated in parallel. It also supports symmetric and asymmetric public-key algorithm such like DES, 3DES, Elliptic Curves and RSA independently of the communication mode. Figure 2: Block Diagram of SLE 66CLX640P The CPU provides the high efficiency of the 8051 instruction set extended by additional powerful instructions with enhanced performance, memory sizes and security features tailored for contact and contactless smart card applications. Using the embedded PLL, the internal clock is adjustable up to 15 MHz independent from the carrier frequency of the magnetic field supplied by the contactless terminal. The Memory Management Unit allows a secure separation of the operating system and the applications. Using the system/application mode, it allows to securely downloading applications in the field after card personalisation. Using the MMU transparent mode allows keeping the memory mapping for code compatibility to SLE 66CxxS family. These new features suit the requirements of the new generation of operating systems. Short Product Information 10 / 12 2004-04-27 µµ SLE 66CLX640P The UART supports the half-duplex transmission protocols T=0 and T=1 according to ISO/IEC 7816-3. All relevant transmission parameters can be adjusted by software, as e.g. the clock division factor, direct/inverse convention and the number of stop bits. Additionally, the I/O port can be driven by communication routines realized in software. To minimize the overall power consumption, the smart card controller can be set into sleep mode supporting clock stop mode. Timers ease the implementation of advanced communication protocols such as T=CL (according to ISO/IEC 14443-4) and all other time critical processes for contactless communications. Both Timers features auto-reload mechanisms as well as their own dedicated interrupt vectors. Additional interrupts capability of the RF interface module allows real time operation of the pure contactless smart card with the contactless terminals. SLE 66CLX640P is able to communicate with any Proximity Card Device (PCD) defined in ISO/IEC 14443 such as the Infineon Evaluation Kit Proximity over a typical coupling distance of 10 cm. The power supply and data are received by an antenna, which consists of a coil with a few turns directly connected to the IC. DES acceleration by a factor of more than 500 compared to software solutions in combination with the high data transfer rate up to 848 Kbit/s keep the transaction times short. For more independence and flexibility, the controller offers the two modulation type A and type B according ISO/IEC 14443. The Anticollision and Contactless Transmission Protocol are supported by open source application notes for both Type A and B in order to offer a maximum flexibility to the Operating System. Both Contactless Communication protocol may be implemented in the Operating System while the final selection of the Type A or B is based upon the personalisation data of the contactless smart card. The communication type can also be changed during runtime in the field. Thus, SLE 66CLX640P ensures a simplified handling of the ROM mask, high reactivity by a tailored personalisation during production of the contactless smart card in order to answer to the increasing market demand and applications. SLE 66CLX640P features a new Resource Management System (RMS_E) which optimizes Contactless EEPROM write/erase routines. EEPROM programming is enhanced over the entire communication distance compared to the standard RMS. Thus, the reduction of programming times and power consumption is ensured independently of the use of the contact or the contactless interface. The CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-BitCRC), thus it supports the two different CRC calculation required for ISO/IEC 14443 Type A and Type B. Also, data as well as program located in the EEPROM can be extra-secured by a CRC checksum enabling the Operating System to detect errors while downloading new application in the field. To minimize the overall power consumption, the pure contactless smart card controller can be set into sleep mode. The certified random number generator (RNG) is able to supply the CPU with true random numbers on all conditions. It allows creating session key used for authentication in open networks and enable secure downloading of new applications. The DDES-EC2 accelerator consists of two modules. The DDES module supports symmetrical crypto algorithms according to the Data Encryption Standard in the Electronic Code Book Mode. It features two internal registers for storage of the two keys required for a Triple DES computation. Together with the fast contactless interface, it offers high security and high speed for dual interface smart card applications. The EC2 module accelerates the multiplication in GF (2n) and therefore the operations for elliptic curve cryptography. It widens the field of application for SLE 66CLX640P since it can be used as tamper-resistant security tool for secured and authentic communication in open networks. Short Product Information 11 / 12 2004-04-27 µµ SLE 66CLX640P The Advanced Crypto Engine (ACE) is equipped with its own RAM of 700 bytes and supports all of today known public-key algorithms based on large integer modular arithmetic. It allows fast and efficient calculation of e.g. RSA operations with key lengths up to 2048 bit and Elliptic Curve GF (p). As an important feature, SLE 66CLX640P provides a new and enhanced level of on-chip security, which fulfils the strong security requirements of a Common Criteria evaluation at an EAL5 level. Each security measure is designed to act as an integral part of the complete system in order to strengthen the system as a whole. Thus, porting an existing Operating System to SLE 66CLX640P requires only very limited changes as it is typically reduced to add the Contactless Library and the Contactless Optimized Resource Management System (RMS_E) to the existing Operating System. SLE 66CLX640P integrates outstanding memory sizes, additional peripherals in combination with enhanced performance and optimized power consumption on a minimized die size. In conclusion, SLE 66CLX640P fulfils the requirements of for both contact-based and contactless smart card applications such like national ID card, banking, security access, digital signature and transport. In the case a pure contactless security controller is required, SLE 66CLX641P offers a solution without the contact-based interface of the SLE 66CLX640P. Short Product Information 12 / 12 2004-04-27